Part A
10AX048E4F29E3SG
インテル
- Lifecycle
- Active
- Stock
- 4866 個数
- Package
- FBGA-780
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 10AX048E4F29E3SG and 10AX032E2F29E2SG are both Intel Arria 10 GX series FPGAs sharing the same 780-pin FBGA package and identical 29 mm × 29 mm footprint, making them mechanically interchangeable on a common PCB. However, they differ in logic density, speed grade, and operating temperature range, so the 10AX032E2F29E2SG can only serve as a functional substitute where the reduced logic capacity, faster speed grade, and extended temperature rating are acceptable. Designers must verify resource utilization and timing closure before committing to this substitution.
Package Type
High match
Logic Density
Validation required
Speed Grade
Validation required
Operating Temperature Range
Not compatible
Parts at a glance
Part B
10AX032E2F29E2SG
インテル
- Lifecycle
- Active
- Stock
- 9210 個数
- Package
- BBGA-780
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX048E4F29E3SG | 10AX032E2F29E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 480,000 | 320,000 | Logic capacity determines how much custom digital logic can be implemented; a smaller device may not fit the same design. |
| Adaptive Logic Modules (ALM) | 183,590 | 122,400 | ALMs are the fundamental logic building blocks; fewer ALMs limit achievable design complexity. |
| Total Embedded Memory | 28,080 Kbit | 18,720 Kbit | On-chip memory affects buffering, FIFO depth, and data storage capability within the FPGA fabric. |
| DSP Blocks (Variable Precision) | 1,368 | 912 | DSP blocks accelerate multiply-accumulate operations; fewer blocks reduce signal-processing throughput. |
| Maximum User I/O Pins | 480 | 480 | I/O count determines how many external interfaces and peripherals can be connected simultaneously. |
| Speed Grade | 4 (Fastest) | 2 (Slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet performance targets. |
| Package | FBGA-780 | FBGA-780 | Package must match the PCB footprint; identical packages allow physical drop-in compatibility. |
| Operating Temperature Range | 0°C to 100°C (Commercial) | 0°C to 100°C (Commercial) | Temperature range determines suitability for the target environment and thermal design requirements. |
| Transceiver Count | 12 | 12 | High-speed serial transceivers enable protocols like PCIe and Ethernet; count limits high-speed link availability. |
| Core Supply Voltage | 0.9 V | 0.9 V | Core voltage must match the board power design; mismatch can damage the device or prevent operation. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10AX048E4F29E3SG | 10AX032E2F29E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 183590 | 119900 |
| Number of Logic Elements/Cells | 480000 | 320000 |
| Total RAM Bits | 5664768 | 21040128 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 0.87V ~ 0.98V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10AX048E4F29E3SG and the 10AX032E2F29E2SG?
The 10AX048E4F29E3SG is an Intel (Altera) Arria 10 GX FPGA with 480,000 logic elements, a speed grade of 4, and an F29 package with 780 pins. The 10AX032E2F29E2SG is an Arria 10 GX FPGA with 320,000 logic elements, a speed grade of 2, and the same F29 package with 780 pins. The primary differences are logic density (480K vs 320K LE) and speed grade (4 vs 2).
Are the 10AX048E4F29E3SG and 10AX032E2F29E2SG pin-to-pin compatible?
Both devices use the same F29 package with 780 pins, which provides an identical physical footprint and pin count. However, pin-to-pin compatibility must be verified against the respective device pin-out files, as logic density differences can affect I/O bank assignments and transceiver channel availability.
Can the 10AX032E2F29E2SG be used as a direct drop-in replacement for the 10AX048E4F29E3SG?
No. Although both share the F29 package, the 10AX048E4F29E3SG has a higher logic density (480K LE vs 320K LE) and a faster speed grade (4 vs 2). A direct drop-in replacement would require recompilation of the FPGA design, verification of timing closure, and confirmation that the reduced logic capacity and slower speed grade meet the design requirements.
What is the speed grade difference between the 10AX048E4F29E3SG and the 10AX032E2F29E2SG?
The 10AX048E4F29E3SG has a speed grade of 4, while the 10AX032E2F29E2SG has a speed grade of 2. In Intel Arria 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10AX048E4F29E3SG (grade 4) is faster than the 10AX032E2F29E2SG (grade 2).
Do both the 10AX048E4F29E3SG and 10AX032E2F29E2SG belong to the same FPGA family?
Yes. Both devices are members of the Intel (Altera) Arria 10 GX family, which features 20 nm process technology, integrated transceivers, and hardened floating-point DSP blocks. They share the same architecture and development tool support (Intel Quartus Prime).
What is the logic element count for each device?
The 10AX048E4F29E3SG contains 480,000 logic elements (LEs). The 10AX032E2F29E2SG contains 320,000 logic elements (LEs). The 10AX048E4F29E3SG therefore offers 50% more logic capacity than the 10AX032E2F29E2SG.
Are the operating temperature ranges the same for both devices?
Both the 10AX048E4F29E3SG and the 10AX032E2F29E2SG are specified for commercial temperature range operation, typically 0°C to 85°C junction temperature (TJ). Designers should confirm the exact temperature grade from the respective Intel Arria 10 device datasheet, as the suffix codes in the ordering part number may indicate specific temperature options.
Which device should be selected for a design requiring higher logic utilization and faster timing closure?
The 10AX048E4F29E3SG is the appropriate choice for designs requiring higher logic utilization and faster timing closure, because it provides 480,000 LEs and a faster speed grade 4. The 10AX032E2F29E2SG, with 320,000 LEs and speed grade 2, is better suited for lower-density designs where timing requirements are less stringent.