10AX048E4F29E3SG vs 10AX032E2F29I2SG

10AX048E4F29E3SGと10AX032E2F29I2SGの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10AX048E4F29E3SG and 10AX032E2F29I2SG are both Intel Arria 10 GX FPGAs in the same FBGA-780 package, sharing identical I/O and transceiver resources, which makes them functionally interchangeable at the board level. However, they differ in logic density, speed grade, and operating temperature range, so the 10AX032E2F29I2SG can only serve as a lower-capacity, industrial-temperature substitute when the design's logic utilization and timing margins permit.

Logic Density Validation required
Speed Grade Validation required
Package Type High match
Operating Temperature Validation required

Parts at a glance

Part A

10AX048E4F29E3SG

インテル

Lifecycle
Active
Stock
4866 個数
Package
FBGA-780
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
Part B

10AX032E2F29I2SG

インテル

Lifecycle
Active
Stock
9496 個数
Package
BBGA-780
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10AX048E4F29E3SG 10AX032E2F29I2SG Why it matters
Logic Elements (LE) 480,000 320,000 Logic capacity determines how much custom digital logic can be implemented; a smaller device may not fit the original design.
Total RAM Bits 34,570,240 17,203,200 On-chip memory affects buffering, FIFO depth, and data storage capability; insufficient RAM can break functionality.
DSP Blocks 1,368 1,000 DSP blocks are needed for arithmetic-intensive functions such as filtering and FFT; fewer blocks may limit signal processing performance.
Speed Grade 4 2 Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet original timing requirements.
Operating Temperature Range 0°C to 100°C (Extended) -40°C to 100°C (Industrial) Temperature range must match the application environment; industrial grade is required for harsh or outdoor conditions.
Package FBGA-780 FBGA-780 Package must match for physical board compatibility and pinout alignment.
Family Arria 10 GX Arria 10 GX Same device family ensures compatible architecture, toolchain support, and IP reuse.
Transceiver Count 24 12 Transceivers support high-speed serial interfaces; fewer channels may prevent connecting all required links.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10AX048E4F29E3SG 10AX032E2F29I2SG
Supplier - Intel
Series Arria 10 GX Arria 10 GX
Part Status Active Active
Number of LABs/CLBs 183590 119900
Number of Logic Elements/Cells 480000 320000
Total RAM Bits 5664768 21040128
Number of I/O 360 360
Voltage - Supply 0.87V ~ 0.98V 0.87V ~ 0.98V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)

Frequently asked questions

What are the key differences between the 10AX048E4F29E3SG and 10AX032E2F29I2SG Intel Arria 10 FPGAs?

The 10AX048E4F29E3SG features 480,000 logic elements, a speed grade of 4, and an extended temperature range of 0°C to 100°C junction temperature. The 10AX032E2F29I2SG features 320,000 logic elements, a faster speed grade of 2, and an industrial temperature range of -40°C to 100°C junction temperature. Both use the same 780-pin FBGA package with a 29 mm x 29 mm body size.

Are the 10AX048E4F29E3SG and 10AX032E2F29I2SG pin-compatible?

Yes, both devices are offered in the same F29 package, which is a 780-pin FineLine BGA (FBGA) with a 29 mm x 29 mm body. However, pin assignments and I/O bank usage may differ based on the specific device density and configuration. Designers must verify pinout compatibility using the respective device pinout files from Intel (Altera) documentation before considering a board-level swap.

Can the 10AX032E2F29I2SG be used as a direct drop-in replacement for the 10AX048E4F29E3SG?

No, a direct drop-in replacement is not possible without design validation. The 10AX048E4F29E3SG has a larger logic capacity (480K LE vs. 320K LE), a different speed grade (4 vs. 2), and a different temperature grade (extended vs. industrial). The 10AX032E2F29I2SG has a faster speed grade and wider industrial temperature range, but fewer logic resources. The target design must be recompiled and timing-closed for the replacement device, and power delivery, configuration, and I/O assignments must be verified against the new device's requirements.

What is the operating temperature range for each device?

The 10AX048E4F29E3SG is rated for an extended temperature range with a junction temperature (Tj) of 0°C to 100°C. The 10AX032E2F29I2SG is rated for an industrial temperature range with a junction temperature (Tj) of -40°C to 100°C. The industrial-grade device is suitable for applications requiring operation below 0°C ambient or junction temperatures.

What are the speed grade and performance implications of the 10AX048E4F29E3SG versus the 10AX032E2F29I2SG?

The 10AX048E4F29E3SG has a speed grade of 4, while the 10AX032E2F29I2SG has a speed grade of 2. In Intel Arria 10 nomenclature, a lower speed grade number indicates a faster device. Therefore, the 10AX032E2F29I2SG offers higher maximum operating frequencies and faster timing closure for critical paths compared to the 10AX048E4F29E3SG. However, the 10AX048E4F29E3SG provides more logic elements (480K vs. 320K) for larger designs.

Do both devices support the same configuration and transceiver options?

Both devices are members of the Intel Arria 10 GX family and support similar configuration schemes, including active serial (AS), passive serial (PS), and JTAG. However, the number of available high-speed transceivers, I/O pins, and hard IP blocks (such as PCIe hard IP and memory controllers) may differ between the 480K LE and 320K LE densities. Designers must consult the Intel Arria 10 Device Handbook and the respective device pinout files to confirm transceiver count, data rates, and hard IP availability for each specific ordering code.

What are the power supply requirements for these two FPGAs?

Both devices require the standard Intel Arria 10 power rails, including VCC, VCCP, VCCAUX, VCCIO, and VCCA for transceivers. The exact current requirements and decoupling recommendations depend on the device density, speed grade, and resource utilization. The 10AX048E4F29E3SG, with higher logic density, may draw more static and dynamic power than the 10AX032E2F29I2SG under similar operating conditions. Intel's Early Power Estimator (EPE) or PowerPlay Power Analyzer must be used to determine specific power budgets for each device in the target design.

Which device is more suitable for industrial applications with wide temperature variations?

The 10AX032E2F29I2SG is more suitable for industrial applications requiring operation below 0°C, as it is rated for an industrial temperature range of -40°C to 100°C junction temperature. The 10AX048E4F29E3SG is rated for 0°C to 100°C junction temperature and is intended for extended-temperature commercial applications. If the application requires reliable operation in sub-zero environments, the industrial-grade 10AX032E2F29I2SG is the appropriate choice, provided its 320K logic element capacity and speed grade 2 meet the design's performance and resource requirements.