10CL080YF780I7G vs 10CL080YF484C6G

10CL080YF780I7Gと10CL080YF484C6Gの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10CL080YF484C6G is a viable functional replacement candidate for the 10CL080YF780I7G, sharing the same logic density, device family, and core architecture. However, the differing package footprint and speed grade require careful validation against the target board layout and timing budget before substitution.

Logic Density High match
Package Type Validation required
Speed Grade Validation required
Operating Temperature High match

Parts at a glance

Part A

10CL080YF780I7G

アルテラ

Lifecycle
Active
Stock
4082 個数
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
Part B

10CL080YF484C6G

インテル

Lifecycle
Active
Stock
9535 個数
Package
BGA-484
Series
組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10CL080YF780I7G 10CL080YF484C6G Why it matters
Package / Case 780-FBGA (29x29) 484-FBGA (23x23) Different package footprints and ball counts are not drop-in compatible; the PCB layout must match the specific package.
Operating Temperature Range -40°C to 100°C (Industrial, I7) 0°C to 85°C (Commercial, C6) Industrial-grade parts support wider temperature extremes; substituting a commercial part in an industrial environment risks reliability.
Speed Grade 7 (faster) 6 (slower) Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same performance requirements.
Logic Elements (LEs) 8,000 8,000 Matching logic capacity ensures the same design fits without resource overflow.
Family / Series Cyclone 10 LP Cyclone 10 LP Same device family means identical architecture, IP compatibility, and tool support.
Embedded Memory 270 kbit 270 kbit Equal embedded memory supports the same on-chip buffering and storage requirements.
Number of I/O Pins 278 278 Identical usable I/O count allows the same peripheral interfacing, though ball placement differs by package.
Supply Voltage 1.2 V core 1.2 V core Same core voltage means identical power supply design and decoupling requirements.
Multiplier / PLL 2 PLLs 2 PLLs Equal PLL resources support the same clock generation and frequency synthesis schemes.

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10CL080YF780I7G 10CL080YF484C6G
Supplier - Intel
Series Cyclone® 10 LP Cyclone® 10 LP
Part Status Active Active
Number of LABs/CLBs - 5079
Number of Logic Elements/Cells - 81264
Total RAM Bits 2810880 2810880
Number of I/O 423 289
Voltage - Supply 1.2V 1.2V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)
Digi Key Programmable Not Verified -
Number of LA Bs / CL Bs 5079 -
Number of Logic Elements / Cells 81264 -
Packaging Tray -

Frequently asked questions

What are the key differences between the 10CL080YF780I7G and the 10CL080YF484C6G?

Both devices are Intel (formerly Altera) Cyclone 10 LP FPGAs with 80,000 logic elements, but they differ in package, speed grade, and temperature grade. The 10CL080YF780I7G uses a 780-pin FBGA package, has a speed grade of 7, and is rated for industrial temperature range (I7). The 10CL080YF484C6G uses a 484-pin FBGA package, has a speed grade of 6, and is rated for commercial temperature range (C6).

Are the 10CL080YF780I7G and 10CL080YF484C6G pin-to-pin compatible?

No. The 10CL080YF780I7G is in a 780-pin FBGA package, while the 10CL080YF484C6G is in a 484-pin FBGA package. The different pin counts and ball maps mean they are not pin-to-pin compatible and require different PCB footprints.

Can the 10CL080YF484C6G be used as a direct drop-in replacement for the 10CL080YF780I7G?

No. A direct drop-in replacement is not possible because the packages differ (484-pin vs 780-pin FBGA), the speed grades differ (6 vs 7), and the temperature grades differ (commercial vs industrial). Any substitution requires a full design review, including PCB layout changes, timing analysis, and thermal validation.

What is the logic capacity of both the 10CL080YF780I7G and the 10CL080YF484C6G?

Both devices provide 80,000 logic elements (LEs), which is the defining feature of the Cyclone 10 LP 10CL080 device family. They also share the same embedded memory and multiplier resources as defined by the 10CL080 device specification.

What do the speed grade and temperature grade suffixes indicate for these two FPGAs?

In the 10CL080YF780I7G, the "I7" suffix indicates an industrial temperature grade and speed grade 7. In the 10CL080YF484C6G, the "C6" suffix indicates a commercial temperature grade and speed grade 6. Speed grade 6 is faster than speed grade 7, while the industrial temperature grade supports a wider operating temperature range than the commercial grade.

Which device is better suited for industrial temperature environments?

The 10CL080YF780I7G is better suited for industrial temperature environments because its "I7" suffix denotes an industrial temperature grade. The 10CL080YF484C6G carries a commercial temperature grade ("C6") and is intended for commercial operating conditions.

Do both devices belong to the same FPGA family and device density?

Yes. Both the 10CL080YF780I7G and the 10CL080YF484C6G are members of the Intel Cyclone 10 LP family and share the same 10CL080 device density of 80,000 logic elements. The differences are limited to package, speed grade, and temperature grade.

What should be verified before considering a design migration between these two parts?

Before migrating between the 10CL080YF780I7G and the 10CL080YF484C6G, verify the target package footprint and ballout, confirm timing closure at the applicable speed grade, validate the operating temperature range against the system environment, and check that all I/O and power pin assignments meet the new package constraints using the official Intel Cyclone 10 LP device documentation.