Part A
10M16DAF256I7G
インテル
- Lifecycle
- Active
- Stock
- 6815 個数
- Package
- BGA-256
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 10M16DAF256I7G and 10M16DCF484I6G are both Intel MAX 10 FPGA devices sharing the same 16,000 logic element density, core architecture, and 3.3 V configuration scheme, making them functionally interchangeable at the logic level. However, they differ in package type, I/O pin count, and speed grade, so a direct drop-in replacement is not possible without PCB redesign and timing revalidation. The 10M16DCF484I6G offers a faster speed grade (6) and a higher I/O count in a 484-pin FBGA package, while the 10M16DAF256I7G provides a compact 256-pin FBGA package with a slower speed grade (7). Designers should treat this pairing as a functional replacement candidate only after confirming package compatibility, I/O requirements, and timing closure for the target application.
Logic Density
High match
Package Type
Validation required
I/O Count
Validation required
Speed Grade
Not compatible
Parts at a glance
Part B
10M16DCF484I6G
インテル
- Lifecycle
- Active
- Stock
- 2759 個数
- Package
- BGA-484
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAF256I7G | 10M16DCF484I6G | Why it matters |
|---|---|---|---|
| Package / Pin Count | 256-pin FBGA (FineLine BGA) | 484-pin FBGA (FineLine BGA) | Package and pin count determine the PCB footprint, available I/O, and whether the two devices are physically interchangeable on an existing board. |
| Maximum User I/O Pins | 178 | 346 | The number of user I/O pins limits how many external signals the FPGA can interface with, directly affecting system connectivity and substitutability. |
| Speed Grade | 7 (faster) | 6 (slower) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the timing requirements of a design built for a faster device. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Industrial (-40°C to +100°C junction) | The temperature range determines the environments in which the device can reliably operate; mismatches can cause failures in industrial or commercial applications. |
| Logic Elements (LEs) | 16,000 | 16,000 | Logic element count defines the available programmable logic capacity; identical counts mean equivalent logic density for the same design. |
| Embedded Memory (M9K Blocks) | 56 M9K blocks (504 Kbits) | 56 M9K blocks (504 Kbits) | Embedded memory capacity affects the ability to implement buffers, FIFOs, and data storage within the FPGA; identical capacity supports the same memory-intensive designs. |
| Embedded Multipliers (18x18) | 36 | 36 | Dedicated multipliers are essential for DSP and arithmetic functions; identical counts ensure the same signal-processing capability. |
| Core Supply Voltage | 1.2 V | 1.2 V | Core voltage must match the board power design; identical values mean the same power supply can be used without modification. |
| Configuration Memory Type | SRAM-based (volatile) | SRAM-based (volatile) | Configuration memory type determines whether external configuration memory is required at power-up; identical types mean the same boot and configuration scheme applies. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAF256I7G | 10M16DCF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 178 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M16DAF256I7G and the 10M16DCF484I6G?
The 10M16DAF256I7G is a MAX 10 FPGA in a 256-pin FineLine BGA (FBGA) package with an industrial temperature grade of -40°C to 100°C (I7 speed grade). The 10M16DCF484I6G is a MAX 10 FPGA in a 484-pin FineLine BGA (FBGA) package with an industrial temperature grade of -40°C to 100°C (I6 speed grade). Both devices feature 16,000 logic elements (LEs), but they differ in package pin count, speed grade, and available user I/O.
Do the 10M16DAF256I7G and 10M16DCF484I6G have the same logic density?
Yes. Both devices are part of the Intel (Altera) MAX 10 family and provide 16,000 logic elements (LEs), along with the same embedded memory and DSP block resources as defined by the MAX 10 10M16 device specification.
Can the 10M16DAF256I7G be used as a drop-in replacement for the 10M16DCF484I6G?
No. The two devices have different package footprints (256-pin FBGA vs 484-pin FBGA), different pin counts, and different user I/O availability. A direct drop-in replacement is not possible without redesigning the PCB and verifying all pin assignments against the respective device pinout files.
What are the speed grade differences between the 10M16DAF256I7G and the 10M16DCF484I6G?
The 10M16DAF256I7G has an I7 speed grade, while the 10M16DCF484I6G has an I6 speed grade. In Intel MAX 10 nomenclature, a lower number indicates a faster speed grade. Therefore, the I6 device supports higher maximum operating frequencies for certain timing paths compared to the I7 device, as specified in the MAX 10 device datasheet.
Are both devices rated for industrial temperature operation?
Yes. Both the 10M16DAF256I7G and the 10M16DCF484I6G carry the "I" temperature suffix, indicating industrial temperature range operation of -40°C to 100°C junction temperature, as defined in the Intel MAX 10 device datasheet.
Which device offers more user I/O pins?
The 10M16DCF484I6G, in the 484-pin FBGA package, provides more user I/O pins than the 10M16DAF256I7G in the 256-pin FBGA package. The exact number of user I/O pins for each package option is specified in the Intel MAX 10 device pinout files and datasheet.
Do both devices support the same configuration and embedded features?
Yes. Both the 10M16DAF256I7G and the 10M16DCF484I6G belong to the same MAX 10 10M16 device family and support the same embedded features, including internal configuration flash, analog-to-digital converter (ADC) blocks, and DSP blocks, as documented in the Intel MAX 10 device handbook. Package and speed grade differences do not alter the core architectural feature set.