Part A
10M16DAU324C8G
インテル
- Lifecycle
- Active
- Stock
- 3130 個数
- Package
- LFBGA-324
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 10M16DCU324I6G is a viable functional replacement candidate for the 10M16DAU324C8G in many applications, as both devices share the same Intel MAX 10 FPGA family, 16,000 logic elements, 324-ball UBGA package, and core architecture. However, designers must account for the industrial temperature grade and the different speed grade of the 10M16DCU324I6G, which may affect timing closure and thermal management in the target design.
Logic Density
High match
Package Type
High match
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DCU324I6G
インテル
- Lifecycle
- Active
- Stock
- 3807 個数
- Package
- LFBGA-324
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DAU324C8G | 10M16DCU324I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility. |
| Logic Elements (LEs) | 16,000 | 16,000 | Identical logic density ensures the same design fits without resource re-estimation. |
| Embedded Memory | 588 kbit | 588 kbit | Matching on-chip memory supports the same buffering and storage requirements. |
| Package | 324-pin UBGA | 324-pin UBGA | Same package and pin count allow a drop-in board-level replacement. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | Industrial-grade parts support harsher environments; commercial parts are limited to benign conditions. |
| Speed Grade | 8 (Fastest) | 6 (Slower) | Speed grade affects maximum clock frequency and timing closure; a slower grade may require design re-timing. |
| Core Supply Voltage | 1.2 V | 1.2 V | Identical core voltage means the same power supply design can be reused. |
| Configuration Method | Instant-on / dual configuration | Instant-on / dual configuration | Same configuration features enable identical boot and fail-safe strategies. |
| RoHS Compliance | RoHS compliant | RoHS compliant | Both meet environmental regulations, simplifying procurement and compliance. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16DAU324C8G | 10M16DCU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 246 | 246 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the 10M16DAU324C8G and 10M16DCU324I6G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 324-pin Ultra FineLine Ball-Grid Array (UBGA) package. They feature 16,000 logic elements (LEs), integrated analog-to-digital converters (ADCs), and non-volatile flash configuration. The 10M16DAU324C8G is specified for commercial temperature range operation, while the 10M16DCU324I6G is specified for industrial temperature range operation.
What is the difference between the 10M16DAU324C8G and 10M16DCU324I6G?
The primary differences are the operating temperature range and the speed grade. The 10M16DAU324C8G operates over the commercial temperature range (0°C to 85°C junction temperature) with speed grade 8. The 10M16DCU324I6G operates over the industrial temperature range (-40°C to 100°C junction temperature) with speed grade 6. The industrial version also carries a higher speed grade, meaning faster timing performance, which is reflected in the ordering code.
Are the 10M16DAU324C8G and 10M16DCU324I6G pin-compatible?
Yes. Both devices are offered in the same 324-pin UBGA package (Intel package code U324) with identical pinouts as defined in the MAX 10 device pin-out files. This allows a single PCB footprint to accommodate either device, provided the timing and temperature requirements of the application are satisfied.
Can the 10M16DAU324C8G be used as a drop-in replacement for the 10M16DCU324I6G?
Not directly. Although they share the same package and pinout, the 10M16DCU324I6G is rated for industrial temperature range and has a faster speed grade (6 vs. 8). Replacing an industrial-grade device with a commercial-grade device may violate the system's operating temperature requirements. Additionally, timing closure must be re-verified because the speed grade difference affects propagation delays and maximum operating frequencies.
What are the logic density and memory resources of these devices?
Both devices provide 16,000 logic elements (LEs), 549,376 total RAM bits, and 360 embedded 18x18 multipliers. They also include flash memory for configuration and user data storage. These parameters are identical for both the 10M16DAU324C8G and 10M16DCU324I6G as they belong to the same MAX 10 10M16 device family.
Do these devices include integrated analog-to-digital converters (ADCs)?
Yes. Both the 10M16DAU324C8G and 10M16DCU324I6G include a dual-channel 12-bit 1 Msps successive-approximation-register (SAR) ADC. The ADC is part of the MAX 10 device architecture and is available in both commercial and industrial temperature grade versions. The ADC supports up to 18 analog input channels depending on package and pin configuration.
What configuration methods are supported by these MAX 10 devices?
Both devices support internal configuration from on-chip flash memory, as well as external configuration via JTAG, active serial (AS), and passive serial (PS) modes. The internal flash configuration allows the device to operate as a single-chip solution without an external configuration device. Configuration data can be loaded via the Intel Quartus Prime programmer or through a supported external host.
What are the typical applications for the 10M16DAU324C8G and 10M16DCU324I6G?
These devices are used in a broad range of applications including industrial control systems, motor control, sensor fusion, human-machine interfaces, communication bridges, and embedded systems requiring moderate logic density with integrated ADC functionality. The industrial-grade 10M16DCU324I6G is specifically suited for applications exposed to extended temperature environments such as industrial automation, automotive infotainment, and outdoor equipment.