10M16DCF484C8G
インテル
- Lifecycle
- Active
- Stock
- 6504 個数
- Package
- BGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
10M16DCF484C8Gと10M16DCF484I6Gの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 10M16DCF484C8G and 10M16DCF484I6G are functionally equivalent Intel MAX 10 FPGA devices sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The commercial-grade C8G variant can serve as a functional substitute for the industrial-grade I6G in benign thermal environments, while the I6G offers broader temperature resilience for demanding applications. Designers should validate thermal margins against the target application before committing to a cross-grade substitution.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16DCF484C8G | 10M16DCF484I6G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade supports harsher conditions. |
| Speed Grade | 8 | 6 | A lower speed grade number indicates faster maximum operating frequency and tighter timing performance. |
| Logic Elements (LEs) | 16000 | 16000 | Defines the available programmable logic capacity for implementing user designs. |
| Package / Pin Count | FBGA-484 | FBGA-484 | Physical footprint and pinout must match for board-level drop-in compatibility. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must match the board power design for correct operation. |
| Embedded Memory | 588288 bits | 588288 bits | On-chip memory capacity affects ability to store data, buffers, and configuration. |
| Number of PLLs | 4 | 4 | PLLs provide clock synthesis and management needed for many digital designs. |
| Maximum User I/O | 320 | 320 | Determines how many external signals the device can interface with in a given package. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M16DCF484C8G | 10M16DCF484I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1000 | 1000 |
| Number of Logic Elements/Cells | 16000 | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 320 | 320 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M16 density family, featuring 16,000 logic elements (LEs), non-volatile integrated flash configuration, and a 484-pin FineLine BGA (FBGA) package. The suffix C8G denotes commercial temperature grade and speed grade 8, while I6G denotes industrial temperature grade and speed grade 6.
The C8G suffix indicates a commercial temperature range (typically 0°C to 85°C junction) with speed grade 8, while the I6G suffix indicates an industrial temperature range (typically -40°C to 100°C junction) with speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the I6G variant offers higher performance but is specified for industrial environments.
Yes. Both devices share the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. The package footprint and pin functions are the same, so they are pin-compatible when the PCB is designed for the 484-pin FBGA package.
Not unconditionally. Although both are pin-compatible, the I6G variant supports a wider industrial temperature range and a faster speed grade (6 vs. 8). A drop-in replacement requires verifying that the target design's timing closure, power budget, and thermal requirements are satisfied by the C8G variant's commercial temperature range and slower speed grade. Intel datasheets and timing models must be consulted before substitution.
Both devices feature integrated non-volatile flash configuration memory, allowing them to be used in single-chip designs without an external configuration device. They support dual configuration images and can operate in instant-on mode, which is a key feature of the Intel MAX 10 FPGA family.
These MAX 10 FPGAs are used in applications such as industrial control, motor control, human-machine interfaces, sensor fusion, and system management. The C8G variant is suited for commercial-grade environments, while the I6G variant is intended for industrial applications requiring extended temperature range and faster timing performance.
Yes. Both the 10M16DCF484C8G and 10M16DCF484I6G support external memory interfaces such as DDR3, DDR3L, DDR2, and LPDDR2, as documented in the Intel MAX 10 FPGA device specifications. The supported memory interface performance depends on the speed grade and temperature grade of the specific variant.
Both devices require a core voltage (VCC) of 1.2 V, and I/O voltages (VCCIO) that depend on the selected I/O standard, typically 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Additional supply rails include VCCA for the analog PLL and VCCINT for the core. Exact voltage tolerances and sequencing requirements are specified in the Intel MAX 10 device datasheet and pin-out files.