Part A
10M16SCU169C8G
アルテラ
- Lifecycle
- Active
- Stock
- 3068 個数
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 10M16SCU169C8G and 10M16DAU324I6G share the same Intel MAX 10 FPGA family, 16,000 logic elements, and non-volatile instant-on architecture, making them functionally related devices. However, they differ in package type, operating temperature grade, and speed grade, so the 10M16DAU324I6G is not a direct drop-in replacement for the 10M16SCU169C8G. Designers must validate pinout, thermal requirements, and timing closure before substituting one for the other in an existing design.
Logic Element Count
High match
Package Type
Validation required
Operating Temperature
Validation required
Speed Grade
Validation required
Parts at a glance
Part B
10M16DAU324I6G
インテル
- Lifecycle
- Active
- Stock
- 4162 個数
- Package
- LFBGA-324
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M16SCU169C8G | 10M16DAU324I6G | Why it matters |
|---|---|---|---|
| Family | MAX 10 FPGA | MAX 10 FPGA | Both belong to the same device family, which supports functional substitutability at the architecture level. |
| Logic Elements (LEs) | 16000 | 16000 | Matching logic capacity ensures equivalent programmable logic resources for the target design. |
| Package | 169-pin UBGA | 324-pin UBGA | Different package footprints affect PCB layout, routing, and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Temperature grade determines suitability for commercial versus industrial environments. |
| Speed Grade | 8 | 6 | Speed grade affects maximum operating frequency and timing closure of the design. |
| Embedded Memory | 588 kbits | 588 kbits | Identical embedded memory supports the same on-chip data buffering and storage needs. |
| User I/O Count | 130 | 246 | Different I/O counts affect the number of peripherals and interfaces that can be connected. |
| Supply Voltage | 1.2 V core | 1.2 V core | Matching core voltage simplifies power supply design and board-level compatibility. |
| Configuration Memory | Internal configuration flash | Internal configuration flash | Both offer instant-on configuration without external memory, aiding single-chip operation. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M16SCU169C8G | 10M16DAU324I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | - | 1000 |
| Number of Logic Elements/Cells | - | 16000 |
| Total RAM Bits | 562176 | 562176 |
| Number of I/O | 130 | 246 |
| Voltage - Supply | 2.85V ~ 3.465V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Digi Key Programmable | Not Verified | - |
| Number of LA Bs / CL Bs | 1000 | - |
| Number of Logic Elements / Cells | 16000 | - |
| Packaging | Tray | - |
Frequently asked questions
What are the key differences between the 10M16SCU169C8G and the 10M16DAU324I6G?
The 10M16SCU169C8G is a MAX 10 FPGA in a 169-pin UBGA package with commercial temperature grade (C8 speed grade), while the 10M16DAU324I6G is a MAX 10 FPGA in a 324-pin UBGA package with industrial temperature grade (I6 speed grade). Both devices feature 16,000 logic elements (LEs), but they differ in package, pin count, speed grade, and operating temperature range.
Do the 10M16SCU169C8G and 10M16DAU324I6G have the same logic density?
Yes. Both devices are members of the Intel MAX 10 FPGA family and provide 16,000 logic elements (LEs), along with equivalent embedded memory and DSP resources as defined by the MAX 10 10M16 device specification.
Can the 10M16SCU169C8G be used as a drop-in replacement for the 10M16DAU324I6G?
No. The two devices use different packages (169-pin UBGA vs 324-pin UBGA), have different pin counts and PCB land patterns, and operate over different temperature ranges (commercial vs industrial). A direct drop-in replacement is not possible without a redesign.
What are the operating temperature ranges for these two devices?
The 10M16SCU169C8G is rated for commercial temperature operation, typically 0°C to 85°C junction temperature. The 10M16DAU324I6G is rated for industrial temperature operation, typically -40°C to 100°C junction temperature, as specified in the Intel MAX 10 device datasheet.
What do the speed grade suffixes C8 and I6 indicate?
The C8 suffix on the 10M16SCU169C8G indicates a commercial temperature grade with speed grade 8. The I6 suffix on the 10M16DAU324I6G indicates an industrial temperature grade with speed grade 6. Speed grade 6 is faster than speed grade 8, meaning the 10M16DAU324I6G offers higher performance.
Which device is better suited for industrial applications?
The 10M16DAU324I6G is better suited for industrial applications because it is rated for the industrial temperature range (-40°C to 100°C junction) and has a faster speed grade (6). The 10M16SCU169C8G is intended for commercial temperature environments (0°C to 85°C junction).
Do both devices support the same configuration options?
Yes. Both the 10M16SCU169C8G and 10M16DAU324I6G are MAX 10 FPGAs and support the same configuration features, including instant-on configuration, dual configuration images, and internal configuration flash, as defined by the MAX 10 family specifications.
What package types are used by these two devices?
The 10M16SCU169C8G uses a 169-pin UBGA (Ultra FineLine BGA) package. The 10M16DAU324I6G uses a 324-pin UBGA package. The different pin counts affect available user I/O and PCB routing requirements.