10M25DAF484C8G
インテル
- Lifecycle
- Active
- Stock
- 4515 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
10M25DAF484C8Gと10M25DCF484I7Gの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 10M25DAF484C8G and 10M25DCF484I7G are both Intel MAX 10 FPGA devices sharing the same 25K logic element density and 484-pin FBGA package, making them functionally interchangeable in many designs. However, the 10M25DCF484I7G offers a faster speed grade and a wider industrial temperature range, while the 10M25DAF484C8G provides lower power consumption with its automotive-grade rating. Designers should validate timing closure, power budget, and thermal requirements before substituting one for the other.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF484C8G | 10M25DCF484I7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is essential for pinout, toolchain, and IP compatibility when considering substitution. |
| Logic Elements (LEs) | 25,000 | 25,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 484-pin FBGA | 484-pin FBGA | Identical package and pin count allow the same PCB footprint and assembly process. |
| Operating Temperature Range | 0°C to +85°C (Commercial) | -40°C to +100°C (Industrial) | The industrial-grade version supports harsher environments, so substitution depends on the application's temperature requirements. |
| Speed Grade | 8 | 7 | A faster speed grade (7 vs 8) affects maximum operating frequency and timing closure, which can impact design performance. |
| Embedded Memory (M9K blocks) | Not verified | Not verified | Embedded memory capacity is critical for buffering and data storage; however, verified values were not available from public sources for this comparison. |
| Configuration Method | Instant-on / dual configuration | Instant-on / dual configuration | Both support the same configuration schemes, simplifying board-level design and boot flexibility. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage ensures power supply compatibility and similar power consumption characteristics. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF484C8G | 10M25DCF484I7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 484-pin FineLine BGA (FBGA) package. The 10M25DAF484C8G is a dual-supply, commercial-grade (0°C to 85°C junction) device with speed grade 8. The 10M25DCF484I7G is a single-supply, industrial-grade (-40°C to 100°C junction) device with speed grade 7. Both feature 25,000 logic elements (LEs) and belong to the MAX 10 family, which integrates non-volatile flash configuration memory.
The "DA" in 10M25DAF484C8G indicates a dual-supply voltage option (1.2 V core and 2.5 V I/O, or similar dual-rail configuration). The "DC" in 10M25DCF484I7G indicates a single-supply voltage option (3.3 V or 1.2 V single rail, depending on configuration). This difference affects power supply design, external component count, and power sequencing requirements.
No, they are not directly interchangeable. The dual-supply (DA) and single-supply (DC) variants have different power rail requirements and pinout definitions for supply pins. Additionally, the speed grades (8 vs. 7) and temperature grades (commercial vs. industrial) differ, which affects timing closure and operating environment. A redesign of the power delivery network and timing analysis is required before substitution.
The 10M25DAF484C8G is rated for commercial operation with a junction temperature (Tj) range of 0°C to 85°C. The 10M25DCF484I7G is rated for industrial operation with a junction temperature range of -40°C to 100°C. The industrial-grade device is suitable for harsh environments, while the commercial-grade device is intended for controlled environments.
Both devices provide 25,000 logic elements (LEs) and are housed in a 484-pin FineLine BGA (FBGA) package with a 0.8 mm ball pitch. They also include embedded memory blocks, DSP blocks, and analog-to-digital converter (ADC) blocks as part of the MAX 10 architecture. The package footprint is identical, but supply pin assignments differ between the DA and DC variants.
The 10M25DCF484I7G has a faster speed grade (7) compared to the 10M25DAF484C8G (speed grade 8). In Intel FPGA nomenclature, a lower speed grade number indicates faster performance. Therefore, the 10M25DCF484I7G offers shorter propagation delays and higher maximum operating frequencies, but this must be validated against the specific design's timing constraints.
Yes, both are MAX 10 FPGAs, which feature integrated non-volatile flash memory for instant-on configuration. They support single-chip configuration without an external configuration device. However, the dual-supply (DA) and single-supply (DC) variants may have different configuration voltage requirements and flash memory access timing, which should be verified in the respective datasheets.
The 10M25DAF484C8G (commercial, dual-supply) is typically used in consumer electronics, industrial control, and communication systems where cost and board space are optimized with dual-rail power. The 10M25DCF484I7G (industrial, single-supply, faster speed grade) is suited for automotive, industrial automation, and outdoor equipment requiring wide temperature operation and simplified power design. Application suitability must be confirmed against the specific system requirements.