10M40DAF256I7G
インテル
- Lifecycle
- Active
- Stock
- 5032 個数
- Package
- LBGA-256
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
10M40DAF256I7Gと10M40DAF256C8Gの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 10M40DAF256C8G and 10M40DAF256I7G are functionally compatible replacements, sharing identical logic density, package, and I/O configuration, with the primary distinction being the operating temperature grade. The I7G variant offers an extended industrial temperature range, making it suitable for more demanding environments, while the C8G variant is optimized for commercial applications. Both devices are viable substitutes, provided the target application's thermal requirements are carefully validated against the chosen grade.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DAF256C8G | 10M40DAF256I7G | Why it matters |
|---|---|---|---|
| Operating Temperature Range | 0°C to 85°C (Commercial) | -40°C to 100°C (Industrial) | Determines the environments in which the device can reliably operate; industrial grade is required for harsh or outdoor applications. |
| Speed Grade | 8 | 7 | A lower speed grade number indicates faster maximum operating frequency and tighter timing, affecting achievable system performance. |
| Logic Elements (LEs) | 40000 | 40000 | Defines the available programmable logic capacity for implementing custom digital functions. |
| Package | 256-pin FBGA | 256-pin FBGA | Must match the PCB footprint and assembly process for a drop-in replacement. |
| Supply Voltage | 1.2 V core | 1.2 V core | Core voltage must be compatible with the board power design to ensure correct operation. |
| Embedded Memory | 1260 kbit M9K | 1260 kbit M9K | On-chip memory capacity affects buffering, data storage, and implementation of memory-intensive functions. |
| Number of I/O Pins | 178 | 178 | I/O count determines how many external signals and peripherals the device can interface with. |
| Embedded Multipliers (18x18) | 116 | 116 | Hardware multipliers are essential for efficient DSP, filtering, and arithmetic-intensive designs. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DAF256I7G | 10M40DAF256C8G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate array (FPGA) devices in the 10M40 family, featuring 40,000 logic elements (LEs) and packaged in a 256-ball FineLine BGA (FBGA) package. The suffix C8G denotes commercial temperature grade and speed grade 8, while I7G denotes industrial temperature grade and speed grade 7.
The C8G suffix indicates a commercial temperature range (typically 0°C to 85°C junction temperature) with speed grade 8, while the I7G suffix indicates an industrial temperature range (typically -40°C to 100°C junction temperature) with speed grade 7. Speed grade 7 is faster than speed grade 8 in the MAX 10 family.
Yes. Both devices share the same 256-ball FBGA package with identical pinouts as defined by the Intel MAX 10 device pin-out specifications. The package and pin assignments are the same; only the temperature grade and speed grade differ.
Not directly in all cases. While the package and pinout are identical, the industrial-grade I7G device is specified for a wider temperature range and a faster speed grade. A commercial-grade C8G device may not meet the timing or environmental requirements of a design validated for the I7G. Replacement requires re-validation of timing, power, and thermal margins against the target application.
The 10M40DAF256C8G is rated for commercial operation, typically 0°C to 85°C junction temperature (TJ). The 10M40DAF256I7G is rated for industrial operation, typically -40°C to 100°C junction temperature (TJ). These ranges are defined in the Intel MAX 10 device datasheet.
Yes. Both are members of the MAX 10 10M40 device family and support the same architectural features, including internal configuration flash, analog-to-digital converter (ADC) blocks, and user flash memory. The differences are limited to temperature grade and speed grade, not functional capability.
The 10M40DAF256I7G is the appropriate choice for operation below 0°C, as its industrial temperature grade supports a junction temperature range extending to -40°C. The 10M40DAF256C8G commercial grade is not specified for sub-zero operation.
Speed grade can influence dynamic power consumption because faster devices may allow higher operating frequencies or may have different core timing characteristics. However, actual power consumption depends on the specific design, clock frequencies, and resource utilization. Intel PowerPlay or the Early Power Estimator (EPE) tool should be used with the correct device grade to obtain accurate power estimates.