Part A
10M50DAF256I7G
インテル
- Lifecycle
- Active
- Stock
- 1541 個数
- Package
- LBGA-256
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 10M50DCF256I6G is a viable functional replacement candidate for the 10M50DAF256I7G, sharing the same Intel MAX 10 device family, 50,000 logic elements, 256-pin FBGA package, and dual-supply voltage architecture. The primary distinction is the faster speed grade of the 10M50DCF256I6G, which may introduce timing margin improvements but requires validation against the original design's timing constraints. Both devices are functionally interchangeable at the logic and interface level, though the industrial temperature range and speed grade differences should be reviewed for application-specific requirements.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Supply Voltage
High match
Parts at a glance
Part B
10M50DCF256I6G
インテル
- Lifecycle
- Active
- Stock
- 3446 個数
- Package
- LBGA-256
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I7G | 10M50DCF256I6G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 50,000 | 50,000 | Identical logic density means both devices can implement the same logic designs without resource constraints. |
| Package / Pin Count | 256-pin FBGA | 256-pin FBGA | Matching package and pin count ensures the same PCB footprint and pinout compatibility. |
| Speed Grade | 7 (faster) | 6 (slower) | Different speed grades affect maximum operating frequency and timing closure; a slower grade may not meet the same timing requirements. |
| Operating Temperature Range | Industrial (-40°C to +100°C junction) | Industrial (-40°C to +100°C junction) | Identical temperature ratings ensure both parts are suitable for the same environmental conditions. |
| Embedded Memory (M9K blocks) | 1,638 Kbits | 1,638 Kbits | Equal embedded memory capacity supports the same on-chip buffering and storage requirements. |
| 18x18 Multipliers | 144 | 144 | Same number of hardware multipliers ensures equivalent DSP performance for signal processing tasks. |
| Configuration Method | Flash-based (instant-on) | Flash-based (instant-on) | Both are non-volatile flash-based FPGAs, providing instant-on operation and eliminating external configuration memory. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage simplifies power supply design and ensures electrical compatibility. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M50DAF256I7G | 10M50DCF256I6G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 3125 | 3125 |
| Number of Logic Elements/Cells | 50000 | 50000 |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 10M50DAF256I7G and the 10M50DCF256I6G?
The primary differences are the speed grade and the operating temperature range. The 10M50DAF256I7G is a speed grade 7 device specified for industrial temperature range (I7), while the 10M50DCF256I6G is a speed grade 6 device specified for industrial temperature range (I6). Both are Intel MAX 10 FPGA devices in the same 256-pin FineLine BGA package with 50,000 logic elements, but the DCF variant offers a faster speed grade compared to the DAF variant.
Are the 10M50DAF256I7G and 10M50DCF256I6G pin-to-pin compatible?
Yes. Both devices are offered in the same 256-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device family. The package designation "F256" is common to both part numbers, so they share the same physical footprint and pin assignments.
What is the logic density of the 10M50DAF256I7G and 10M50DCF256I6G?
Both devices feature 50,000 logic elements (LEs), as indicated by the "10M50" prefix in the part number. They belong to the Intel MAX 10 family of non-volatile FPGAs and include integrated flash memory, analog-to-digital converter (ADC) blocks, and other embedded features typical of the MAX 10 series.
Can the 10M50DAF256I7G be used as a drop-in replacement for the 10M50DCF256I6G?
Not necessarily as a direct drop-in replacement without design validation. Although both share the same package and logic density, the 10M50DCF256I6G has a faster speed grade (6) than the 10M50DAF256I7G (7). A design optimized for the faster device may not meet timing when populated with the slower speed grade. Additionally, the temperature grade suffix differs (I7 vs. I6), so the operating temperature specifications must be verified against the target application requirements.
What does the speed grade difference between these two devices mean for timing closure?
The 10M50DCF256I6G is rated at speed grade 6, which provides faster maximum operating frequencies and shorter propagation delays compared to the speed grade 7 rating of the 10M50DAF256I7G. Designs that achieve timing closure on the speed grade 6 device may require additional timing analysis and potential re-optimization if migrated to the speed grade 7 device, since the slower grade reduces available timing margin.
What temperature range do the 10M50DAF256I7G and 10M50DCF256I6G support?
Both devices carry the "I" designation in their part numbers, indicating industrial temperature range support. Intel MAX 10 industrial-grade devices are typically specified for operation over the -40°C to +100°C junction temperature range (TJ), though exact thermal specifications should be confirmed in the official Intel MAX 10 device datasheet for the specific speed grade and package combination.
Do both devices support the same configuration and flash memory features?
Yes. Both the 10M50DAF256I7G and 10M50DCF256I6G are Intel MAX 10 devices with the same 50,000 LE density and integrated configuration flash memory. They support the same configuration schemes, including internal configuration from on-chip flash, and offer the same embedded features such as DSP blocks, embedded memory, and ADC capabilities as defined by the MAX 10 family for the 50K LE density in the 256-pin FBGA package.
Which device should be selected for a new design requiring the highest performance?
The 10M50DCF256I6G should be selected when higher performance is required, because its speed grade 6 rating provides faster timing characteristics than the speed grade 7 rating of the 10M50DAF256I7G. However, final selection should also consider availability, power consumption, and whether the design's timing requirements can be met by the slower speed grade, which may offer advantages in cost or supply depending on market conditions.