5CEBA7F23C7N
インテル
- Lifecycle
- Active
- Stock
- 4498 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
5CEBA7F23C7Nと5CEBA7U19C7Nの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 5CEBA7F23C7N and 5CEBA7U19C7N are both Intel Cyclone V FPGA devices sharing the same logic density, speed grade, and temperature grade, making them functionally comparable for many designs. However, they differ in package type and pin count, which affects PCB footprint and I/O availability. The 5CEBA7U19C7N offers a higher I/O count in a UBGA package, while the 5CEBA7F23C7N provides a larger FBGA package with a different ballout. Designers must validate pin compatibility and thermal performance before substituting one for the other.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEBA7F23C7N | 5CEBA7U19C7N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | UBGA-484 | The package type determines the physical footprint, PCB land pattern, and thermal characteristics, so a different package prevents direct drop-in replacement. |
| Package Dimensions | 23 x 23 mm | 19 x 19 mm | Different body sizes require different board layouts and may affect routing density and thermal management. |
| Ball Pitch | 1.0 mm | 0.8 mm | Ball pitch dictates PCB manufacturing tolerances and escape routing capability; mismatched pitch makes the parts non-interchangeable on the same footprint. |
| Number of I/O Pins | 224 | 240 | Available user I/O affects how many peripherals and interfaces can be connected, influencing system design flexibility. |
| Number of LABs / Logic Elements | 56480 LEs | 56480 LEs | Logic capacity determines the complexity of digital designs that can be implemented; identical capacity means equivalent logic resources. |
| Total RAM Bits | 2867200 | 2867200 | Embedded memory capacity affects buffering, FIFO depth, and data storage within the FPGA; identical values indicate equivalent on-chip memory. |
| Number of Transceivers | 6 | 6 | High-speed serial transceivers enable protocols like PCIe and Ethernet; equal counts mean similar high-speed interface capability. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for commercial versus industrial environments; identical ranges mean the same environmental applicability. |
| Supply Voltage - Core | 1.1 V | 1.1 V | Core voltage must match the board power design; identical values allow the same power supply configuration. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style affects assembly process; both being surface mount means compatible reflow soldering processes. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEBA7F23C7N | 5CEBA7U19C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 56480 |
| Number of Logic Elements/Cells | 149500 | 149500 |
| Total RAM Bits | 7880704 | 7880704 |
| Number of I/O | 240 | 240 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) Cyclone V E series field-programmable gate arrays (FPGAs). The 5CEBA7F23C7N is a 5CEBA7 device in a 484-pin FBGA package, while the 5CEBA7U19C7N is a 5CEBA7 device in a 484-pin UBGA package. Both are specified with a C7 speed grade and are lead-free (N suffix).
Yes. Both devices are members of the same Cyclone V E A7 variant, so they share the same core fabric: approximately 149,500 logic elements (LEs), 9,560 kbits of embedded memory, and 156 variable-precision DSP blocks, as documented in the Intel Cyclone V Device Handbook.
The F23 suffix indicates a 484-pin FineLine BGA (FBGA) package, while U19 indicates a 484-pin Ultra FineLine BGA (UBGA) package. Both packages have 484 balls, but they differ in physical dimensions, ball pitch, and PCB land pattern requirements, so they are not footprint-compatible.
No. Although both are 484-ball packages, the FBGA (F23) and UBGA (U19) packages have different ball pitches, body sizes, and land patterns. A PCB designed for one package cannot directly accept the other without a layout redesign or an appropriate adapter.
Both are Cyclone V E A7 devices and share the same transceiver count and I/O bank architecture as defined by the device variant. However, the exact number of usable user I/Os can differ between the F23 and U19 packages due to different ball assignments and package routing. Designers should consult the Intel Cyclone V Pin Connection Guidelines and device pin-out files for the specific package.
Yes. The "N" suffix in both part numbers indicates lead-free (Pb-free) construction, and both devices are RoHS compliant as stated in Intel's product material declarations for Cyclone V devices.
The C7 speed grade in both part numbers corresponds to the commercial temperature range, typically 0°C to 85°C junction temperature (TJ), as specified in the Intel Cyclone V Device Datasheet. Industrial and automotive temperature grades use different speed grade suffixes.
Both the 5CEBA7F23C7N and 5CEBA7U19C7N support the same Cyclone V configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration, as documented in the Intel Cyclone V Device Handbook. Configuration scheme availability is a function of the device family, not the package.