5CEFA2F23C8N
インテル
- Lifecycle
- Active
- Stock
- 2565 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
5CEFA2F23C8Nと5CEFA2M13C7Nの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 5CEFA2F23C8N and 5CEFA2M13C7N are both Intel Cyclone V FPGAs sharing the same logic density, transceiver count, and core architecture, making them functionally interchangeable for most designs. However, they differ in package type, operating temperature grade, and speed grade, so validation against the target application's thermal and mechanical requirements is essential before committing to a drop-in substitution.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA2F23C8N | 5CEFA2M13C7N | Why it matters |
|---|---|---|---|
| Package / Case | FBGA-484 | MBGA-383 | The physical footprint and ball pitch differ, so the two devices are not drop-in compatible on the same PCB land pattern. |
| Number of I/Os | 224 | 112 | Available user I/O count directly limits how many external interfaces and peripherals can be connected. |
| Logic Elements (LE) | 25000 | 25000 | Logic capacity determines the complexity of digital designs that can be implemented in the fabric. |
| Total RAM Bits | 1956864 | 1956864 | Embedded memory capacity affects buffering, FIFO depth, and on-chip data storage capability. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | The temperature grade must match the target application's environmental conditions for reliable operation. |
| Speed Grade | 8 | 7 | A faster speed grade allows higher clock frequencies and tighter timing closure for demanding designs. |
| Supply Voltage | 1.1 V Core | 1.1 V Core | Core voltage must match the board power design to avoid damage or unreliable operation. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style determines the assembly process and whether the part suits the intended PCB technology. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2F23C8N | 5CEFA2M13C7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 9434 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 2002944 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) Cyclone V F-series FPGAs from the same 5CEFA2 device family. The 5CEFA2F23C8N is a 484-pin FineLine BGA (FBGA) device with a speed grade of 8, while the 5CEFA2M13C7N is a 383-pin Micro FineLine BGA (MBGA) device with a speed grade of 7.
Yes. Both devices belong to the same Cyclone V F-series 5CEFA2 density tier, which provides approximately 25,000 logic elements (LEs), 9,430 adaptive logic modules (ALMs), and 1,880 Kbits of embedded memory. The primary differences are package, pin count, and speed grade.
No. The 5CEFA2F23C8N uses a 484-pin FBGA package, while the 5CEFA2M13C7N uses a 383-pin MBGA package. These packages have different physical dimensions, ball counts, ball pitches, and pinouts, so they are not footprint-compatible and cannot be interchanged without a PCB redesign.
The 5CEFA2F23C8N is specified with speed grade 8, and the 5CEFA2M13C7N is specified with speed grade 7. In Intel Cyclone V nomenclature, a lower speed grade number indicates a faster device. Therefore, the 5CEFA2M13C7N (grade 7) offers faster timing performance than the 5CEFA2F23C8N (grade 8).
Both the 5CEFA2F23C8N and 5CEFA2M13C7N are specified for commercial temperature operation, typically 0°C to 85°C junction temperature (TJ), as indicated by the "C" in the ordering code. Industrial-temperature versions would carry a different suffix and should be selected if a wider range is required.
The 5CEFA2F23C8N, with its larger 484-pin FBGA package, provides more user I/O pins than the 5CEFA2M13C7N, which is housed in the smaller 383-pin MBGA package. The exact user I/O count for each device should be confirmed from the Intel Cyclone V device pin-out files and datasheet for the specific package option.
Both devices use the "N" suffix in their ordering codes, which indicates lead-free (Pb-free) packaging and RoHS compliance per Intel's ordering code conventions for Cyclone V devices. Designers should still verify the specific product change notices and material declarations from Intel or authorized distributors for the latest compliance status.
As members of the Cyclone V F-series 5CEFA2 tier, both the 5CEFA2F23C8N and 5CEFA2M13C7N share the same core FPGA architecture, including logic array, embedded memory blocks, variable-precision DSP blocks, and general-purpose PLLs. Differences arise from the package pin count, which affects the number of available I/O banks and high-speed interfaces that can be routed out.