Part A
5CEFA4F23I7N
インテル
- Lifecycle
- Active
- Stock
- 6968 個数
- Package
- FBGA-484
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The 5CEFA4F23I7N and 5CEFA2M13I7N are both Intel Cyclone V F-series FPGAs sharing the same logic family, speed grade, and automotive-grade temperature range, making them functionally related candidates. However, they differ significantly in logic density, package footprint, and available I/O, so the 5CEFA2M13I7N cannot directly replace the 5CEFA4F23I7N without a full design review. The 5CEFA2M13I7N offers a smaller package and lower logic count, while the 5CEFA4F23I7N provides higher density and more user I/O. Designers must validate resource utilization, pinout, and board layout before considering substitution.
Logic Density
Validation required
Package Type
Not compatible
I/O Count
Not compatible
Operating Temperature
High match
Parts at a glance
Part B
5CEFA2M13I7N
インテル
- Lifecycle
- Active
- Stock
- 6649 個数
- Package
- TFBGA-383
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA4F23I7N | 5CEFA2M13I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 44000 | 25000 | Logic capacity determines the maximum complexity of digital designs the FPGA can implement; a large mismatch limits direct substitutability. |
| Total RAM Bits | 3080192 | 1953792 | Embedded memory affects buffering, FIFO depth, and data storage capability; differing sizes can break memory-intensive designs. |
| Number of I/Os | 240 | 224 | Available I/O pins constrain peripheral and interface connections; fewer pins may prevent a drop-in replacement. |
| Package / Case | 484-FBGA (23x23) | 383-FBGA (13x13) | Package footprint and ball pitch must match the PCB layout; different packages are not physically interchangeable. |
| Number of LABs/CLBs | 1650 | 943 | Logic array blocks define granularity of programmable logic resources; fewer blocks reduce achievable design density. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Thermal range must cover the application environment; identical ranges indicate equivalent environmental tolerance. |
| Voltage - Supply | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage must match the board power design; identical rails allow shared power architecture. |
| Mounting Type | Surface Mount | Surface Mount | Mounting style must match assembly process; both being SMD indicates compatible manufacturing flow. |
| Speed Grade | 7 | 7 | Speed grade determines maximum operating frequency and timing closure; matching grades preserve performance characteristics. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA4F23I7N | 5CEFA2M13I7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA4F23I7N and the 5CEFA2M13I7N?
The 5CEFA4F23I7N is a Cyclone V FPGA with 49,000 logic elements, 308 M9K memory blocks, and 224 18x18 multipliers in a 484-pin FBGA package. The 5CEFA2M13I7N is a Cyclone V FPGA with 25,000 logic elements, 176 M9K memory blocks, and 112 18x18 multipliers in a 383-pin Micro FBGA package. Both operate at a 1.1 V core voltage and are rated for industrial temperature range (I7).
Are the 5CEFA4F23I7N and 5CEFA2M13I7N pin-to-pin compatible?
No. The 5CEFA4F23I7N uses a 484-pin FBGA package, while the 5CEFA2M13I7N uses a 383-pin Micro FBGA package. The different package sizes, pin counts, and ball maps prevent direct PCB footprint compatibility.
Can the 5CEFA2M13I7N be used as a drop-in replacement for the 5CEFA4F23I7N?
No. The two devices differ in logic density, memory resources, multiplier count, package type, and pin count. A drop-in replacement is not possible without redesigning the PCB and revalidating the logic design against the smaller device's resources.
Which device has higher logic density, the 5CEFA4F23I7N or the 5CEFA2M13I7N?
The 5CEFA4F23I7N has higher logic density with 49,000 logic elements, compared to 25,000 logic elements in the 5CEFA2M13I7N.
Do both devices support the same configuration schemes?
Both are Cyclone V FPGAs and support the same configuration schemes, including active serial, passive serial, fast passive parallel, and JTAG configuration. However, the configuration bitstream size differs due to the different logic densities, so the same configuration file cannot be used for both devices.
What is the operating temperature range for both the 5CEFA4F23I7N and 5CEFA2M13I7N?
Both devices have the I7 suffix, which indicates an industrial temperature range of -40°C to 100°C junction temperature, as specified in the Intel Cyclone V device datasheet.
Are the 5CEFA4F23I7N and 5CEFA2M13I7N lead-free and RoHS compliant?
Yes. Both devices are offered in lead-free packages and are RoHS compliant, as stated in Intel's product material declarations and distributor product pages.
Which device is better suited for space-constrained designs?
The 5CEFA2M13I7N is better suited for space-constrained designs because it uses a 383-pin Micro FBGA package, which is smaller than the 484-pin FBGA package of the 5CEFA4F23I7N. However, the smaller package also provides fewer user I/O pins and lower logic capacity.