5CEFA9F23I7N
インテル
- Lifecycle
- Active
- Stock
- 4366 個数
- Package
- BGA-484
- Series
- 組み込み - FPGA(フィールド・プログラマブル・ゲート・アレイ)
5CEFA9F23I7Nと5CEFA2M13I7Nの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The 5CEFA9F23I7N and 5CEFA2M13I7N are both Intel (Altera) Cyclone V FPGAs sharing the same I7 speed grade and industrial temperature range, but they differ fundamentally in logic density, package footprint, and I/O resources. The 5CEFA9F23I7N offers significantly higher logic capacity and user I/O count in a larger FBGA package, while the 5CEFA2M13I7N provides a much smaller logic array in a compact M383 package. Because these devices are not pin-compatible and target different design scales, a direct drop-in substitution is not feasible without a full board redesign and logic re-fit.
インテル
インテル
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2M13I7N | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the amount of programmable logic available for implementing a design; a large mismatch means the two devices are not functionally interchangeable for complex designs. |
| Total RAM Bits | 14251008 | 1945600 | Embedded memory capacity affects the ability to store data, buffers, and look-up tables on-chip; differing RAM sizes limit direct substitutability for memory-intensive applications. |
| Number of I/Os | 480 | 224 | I/O count determines how many external signals the device can interface with; a lower I/O count restricts peripheral connectivity and board-level compatibility. |
| Package / Case | FBGA-484 | MBGA-383 | Package type and footprint must match for physical board compatibility; different packages require different PCB layouts and cannot be dropped in interchangeably. |
| Number of Logic Array Blocks (LABs) | 11356 | 943 | LAB count reflects the granular architectural resources available for logic placement and routing; a large difference impacts achievable design density and timing closure. |
| Number of Embedded Multipliers (18x18) | 684 | 66 | Dedicated multiplier blocks accelerate DSP operations; a significant difference limits signal-processing throughput and arithmetic performance. |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | Both devices share the same industrial temperature grade, so thermal operating conditions are equivalent and do not differentiate them. |
| Supply Voltage | 1.07V to 1.13V | 1.07V to 1.13V | Core supply voltage compatibility ensures both devices can operate from the same power rail without additional regulation changes. |
| Speed Grade | 7 (Fastest) | 7 (Fastest) | Speed grade determines maximum operating frequency and timing performance; matching grades means comparable performance characteristics. |
| Series | Cyclone V E | Cyclone V E | Both belong to the same Cyclone V E family, sharing architecture and toolchain support, which aids design migration but does not overcome density differences. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F23I7N | 5CEFA2M13I7N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
The 5CEFA9F23I7N is a Cyclone V FPGA with 301,000 logic elements, 12,200 Kbits of embedded memory, and 480 18x18 multipliers in a 484-pin FBGA package. The 5CEFA2M13I7N is a Cyclone V FPGA with 25,000 logic elements, 1,400 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package. The 5CEFA9F23I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2M13I7N provides a smaller footprint and lower resource count.
No. The 5CEFA9F23I7N uses a 484-pin FBGA package, while the 5CEFA2M13I7N uses a 383-pin Micro FBGA package. The different package types, pin counts, and ball maps prevent direct pin-to-pin compatibility.
No. The two devices differ in package, pin count, logic density, embedded memory, and DSP resources. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the logic design against the target device resources.
Both the 5CEFA9F23I7N and 5CEFA2M13I7N are members of the Cyclone V F-series and share the same core voltage requirements and industrial temperature grade (I7) as specified in the Intel Cyclone V device datasheet. However, always verify the exact operating conditions in the respective device datasheet before design.
The 5CEFA9F23I7N is better suited for high-performance DSP applications because it provides 480 18x18 multipliers, compared to 72 multipliers in the 5CEFA2M13I7N. The higher multiplier count supports more parallel DSP operations.
The 5CEFA2M13I7N is more appropriate for space-constrained designs because it is offered in a 383-pin Micro FBGA package, which is smaller than the 484-pin FBGA package used by the 5CEFA9F23I7N.
No. The 5CEFA9F23I7N and 5CEFA2M13I7N belong to different Cyclone V F-series density grades and therefore differ in available transceiver channels, configuration options, and I/O resources. Consult the Intel Cyclone V device datasheet for the exact configuration and transceiver specifications of each part number.