Part A
5CEFA2M13C8N
インテル
- Lifecycle
- Active
- Stock
- 4445 個数
- Package
- TFBGA-383
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Not a drop-in replacement
The 5CEFA9F27I7N and 5CEFA2M13C8N are not functionally interchangeable. They differ in logic density, package footprint, speed grade, and operating temperature range, so the 5CEFA2M13C8N cannot directly replace the 5CEFA9F27I7N in the same design without significant redesign and revalidation.
Different logic density
Different package footprint
Different speed grade
Different temperature range
Parts at a glance
Part B
5CEFA9F27I7N
インテル
- Lifecycle
- Active
- Stock
- 7586 個数
- Package
- BGA-672
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F27I7N | 5CEFA2M13C8N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E FPGA | Cyclone V E FPGA | Same device family ensures toolchain, IP, and pinout compatibility for migration. |
| Logic Elements (LE) | 301,000 | 25,000 | LE count determines available logic capacity; a large mismatch prevents direct functional substitution. |
| Total RAM Bits | 12,200 kbit | 1,880 kbit | Embedded memory capacity limits buffering, FIFOs, and data storage in the design. |
| 18x18 Multipliers | 684 | 72 | DSP block count governs arithmetic throughput for signal processing functions. |
| Package | FBGA-672 | MBGA-383 | Different packages have incompatible footprints and pin counts, preventing drop-in replacement. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade affects suitability for industrial versus commercial environments. |
| Speed Grade | 7 (Fastest) | 8 (Slowest) | Speed grade determines maximum clock frequency and timing closure margins. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage must match the board power design for correct operation. |
| Number of I/O Pins | 336 | 224 | I/O count limits the number of external interfaces and peripherals that can be connected. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA2M13C8N | 5CEFA9F27I7N |
|---|---|---|
| Supplier | Intel | - |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 9434 | 113560 |
| Number of Logic Elements/Cells | 25000 | 301000 |
| Total RAM Bits | 2002944 | 14251008 |
| Number of I/O | 223 | 336 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F27I7N and the 5CEFA2M13C8N?
The 5CEFA9F27I7N is a Cyclone V FPGA with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers in a 672-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C). The 5CEFA2M13C8N is a Cyclone V FPGA with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C). The two devices differ significantly in logic density, memory, DSP resources, package, and temperature grade.
Are the 5CEFA9F27I7N and 5CEFA2M13C8N pin-compatible?
No. The 5CEFA9F27I7N uses a 672-pin FBGA package, while the 5CEFA2M13C8N uses a 383-pin Micro FBGA package. The package sizes, ball counts, and ball maps are different, so they are not pin-compatible or footprint-compatible.
Can the 5CEFA2M13C8N be used as a direct drop-in replacement for the 5CEFA9F27I7N?
No. The 5CEFA2M13C8N has fewer logic elements, less embedded memory, fewer multipliers, a different package, and a commercial temperature grade rather than industrial. A direct drop-in replacement is not possible without redesigning the PCB, resynthesizing the FPGA design, and verifying that the reduced resources and temperature range meet the application requirements.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA9F27I7N is specified for industrial temperature operation with a junction temperature range of -40°C to 100°C. The 5CEFA2M13C8N is specified for commercial temperature operation with a junction temperature range of 0°C to 85°C. The industrial-grade device is suitable for harsher environments, while the commercial-grade device is intended for controlled environments.
How do the logic densities of the 5CEFA9F27I7N and 5CEFA2M13C8N compare?
The 5CEFA9F27I7N contains 301,000 logic elements, whereas the 5CEFA2M13C8N contains 25,000 logic elements. The 5CEFA9F27I7N offers approximately twelve times the logic capacity of the 5CEFA2M13C8N, making it suitable for significantly more complex digital designs.
Do these two FPGAs have the same embedded memory and DSP resources?
No. The 5CEFA9F27I7N provides 13,917 Kbits of embedded memory and 480 18x18 multipliers. The 5CEFA2M13C8N provides 1,864 Kbits of embedded memory and 72 18x18 multipliers. The 5CEFA9F27I7N has substantially more memory and DSP resources for demanding signal processing and data buffering applications.
Are the 5CEFA9F27I7N and 5CEFA2M13C8N from the same FPGA family?
Yes. Both devices are members of the Intel (formerly Altera) Cyclone V FPGA family. They share the same architecture and supported development tools, but differ in logic density, memory, DSP resources, package, and temperature grade.
What package types are used by the 5CEFA9F27I7N and 5CEFA2M13C8N?
The 5CEFA9F27I7N is housed in a 672-pin FineLine BGA (FBGA) package. The 5CEFA2M13C8N is housed in a 383-pin Micro FineLine BGA (Micro FBGA) package. These packages have different physical dimensions, ball pitches, and PCB land pattern requirements.