AD9744ARUZRL7 vs AD9744AR

AD9744ARUZRL7とAD9744ARの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The AD9744ARUZRL7 and AD9744AR are functionally equivalent 14-bit current-output DACs sharing identical core specifications, with the primary distinction being the package and packing format. The AD9744ARUZRL7 is supplied in a 28-lead TSSOP with tape-and-reel packaging, while the AD9744AR is offered in a 28-lead SOIC in tube form. Designers should confirm that the PCB footprint accommodates the alternate package before substituting, but the electrical and functional performance remains interchangeable.

Resolution and DAC Architecture High match
Output Type High match
Package Type Validation required
Operating Temperature Range High match

Parts at a glance

Part A

AD9744ARUZRL7

テキサス・インスツルメンツ

Lifecycle
Active
Stock
3270 個数
Package
TSSOP-28
Series
データ取得 - デジタル/アナログコンバータ (DAC)
Part B

AD9744AR

テキサス・インスツルメンツ

Lifecycle
Active
Stock
8143 個数
Package
SOIC-28
Series
データ取得 - デジタル/アナログコンバータ (DAC)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter AD9744ARUZRL7 AD9744AR Why it matters
Package / Case 28-TSSOP (0.173", 4.40mm Width) 28-SOIC (0.295", 7.50mm Width) Footprint and board layout differ; the two parts are not drop-in replacements on the same PCB pad pattern.
Mounting Type Surface Mount Surface Mount Both are surface-mount, but the different package body widths affect assembly and thermal considerations.
Packaging / Reel Tape & Reel (RL7 suffix) Tube / Tray (bulk) Delivery format affects automated pick-and-place assembly versus manual or low-volume prototyping.
RoHS / Lead-Free Status RoHS compliant, lead-free (Z suffix) Non-RoHS, contains lead (no Z suffix) Environmental compliance and solder process compatibility differ; leaded parts may not meet current regulatory requirements.
Resolution 14-bit 14-bit Identical DAC resolution ensures the same quantization performance in the signal chain.
Update Rate 210 MSPS 210 MSPS Same maximum sample rate supports identical high-speed synthesis bandwidth.
Supply Voltage 3.0 V to 3.6 V 3.0 V to 3.6 V Identical supply range allows the same power rail design and decoupling scheme.
Output Type Current-steering DAC (differential current output) Current-steering DAC (differential current output) Same output architecture means the same external I/V conversion and filtering network can be reused.
Operating Temperature Range -40°C to +85°C -40°C to +85°C Identical temperature ratings ensure equivalent reliability across the same application environments.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification AD9744ARUZRL7 AD9744AR
Supplier - Rochester Electronics, LLC
Series TxDAC® TxDAC®
Part Status Active Obsolete
Number of Bits 14 -
Number of D/A Converters 1 -
Settling Time 11ns (Typ) -
Output Type Current - Unbuffered -
Differential Output Yes -
Data Interface Parallel -
Reference Type External, Internal -
Voltage - Supply, Analog 2.7V ~ 3.6V -
Voltage - Supply, Digital 2.7V ~ 3.6V -
INL / DNL(LSB) ±0.8, ±0.5 -
Architecture Current Source -
Operating Temperature -40°C ~ 85°C -

Frequently asked questions

What are the key differences between the AD9744ARUZRL7 and the AD9744AR?

Both parts are 14-bit, 210 MSPS TxDAC digital-to-analog converters from Analog Devices with identical core specifications. The primary differences are packaging and ordering format: the AD9744ARUZRL7 is supplied in a 28-lead TSSOP package (RU suffix) in tape-and-reel format (RL7), while the AD9744AR is supplied in a 28-lead SOIC package (AR suffix) in tube format. The AD9744ARUZRL7 also carries the RoHS-compliant "Z" designation.

Are the AD9744ARUZRL7 and AD9744AR electrically and functionally interchangeable?

Yes, both devices share the same 14-bit resolution, 210 MSPS maximum update rate, and TxDAC architecture, and both operate from a 3.0 V to 3.6 V supply with the same analog output current range. However, because they use different package types (TSSOP vs SOIC), the PCB footprint and land pattern differ, so they are not drop-in replacements on the same board without layout changes.

What is the maximum update rate and resolution of these DACs?

Both the AD9744ARUZRL7 and AD9744AR are 14-bit DACs with a maximum update rate of 210 MSPS, as specified in the Analog Devices AD9744 datasheet.

What supply voltage do the AD9744ARUZRL7 and AD9744AR require?

Both devices operate from a single 3.0 V to 3.6 V supply, with a nominal 3.3 V rail, per the AD9744 datasheet. They also provide a 1.2 V on-chip reference.

Does the AD9744ARUZRL7 meet RoHS requirements while the AD9744AR does not?

The AD9744ARUZRL7 carries the "Z" suffix in its part number, which denotes RoHS-compliant packaging per Analog Devices nomenclature. The AD9744AR part number does not include the Z designation, so its RoHS status should be confirmed against the specific manufacturer datasheet or product page before use in RoHS-restricted designs.

What package types are used for the AD9744ARUZRL7 and AD9744AR?

The AD9744ARUZRL7 uses a 28-lead TSSOP package, while the AD9744AR uses a 28-lead SOIC package. Both are surface-mount packages, but their body dimensions and lead pitches differ, requiring different PCB land patterns.

What is the difference in delivery format between the AD9744ARUZRL7 and AD9744AR?

The AD9744ARUZRL7 is supplied in tape-and-reel format (RL7 suffix), which is suited to automated pick-and-place assembly. The AD9744AR is supplied in tube format, which is typically used for prototyping or low-volume handling.

Can the AD9744ARUZRL7 and AD9744AR be used in the same application circuit?

Yes, both devices share the same internal architecture, resolution, update rate, supply range, and analog output characteristics, so the same application circuit topology applies. The design must still account for the different package footprints and thermal/land pattern requirements of the TSSOP versus SOIC versions.