Part A
EP3SL150F780I3N
インテル
- Lifecycle
- Active
- Stock
- 8041 個数
- Package
- BBGA-780
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Replacement verdict
Compatible functional replacement candidate
The EP3SL70F780C2 is a lower-density, commercial-grade alternative to the EP3SL150F780I3N. While both devices share the same 780-pin FBGA footprint and Stratix III architecture, the EP3SL70F780C2 offers approximately half the logic density and lacks the industrial temperature qualification of the EP3SL150F780I3N. Designers must validate logic utilization, thermal margins, and timing closure before substituting in industrial or high-density applications.
Logic Density
Validation required
Package Type
High match
Operating Temperature
Not compatible
Supply Voltage
Validation required
Parts at a glance
Part B
EP3SL70F780C2
インテル
- Lifecycle
- Active
- Stock
- 8981 個数
- Package
- BBGA-780
- Series
- 組み込み - FPGA（フィールド・プログラマブル・ゲート・アレイ）
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | EP3SL150F780I3N | EP3SL70F780C2 | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 142,500 | 67,500 | Logic capacity determines how much digital logic can be implemented; a smaller device may not fit the same design. |
| Total RAM Bits | 6,390,528 | 2,695,680 | On-chip memory affects buffering, FIFO depth, and whether memory-intensive designs can be mapped without external RAM. |
| Embedded Multipliers (18x18) | 384 | 288 | DSP blocks determine arithmetic throughput for filtering, FFT, and other signal-processing functions. |
| Maximum User I/O Pins | 488 | 488 | I/O count limits how many external interfaces and peripherals can be connected to the device. |
| Package | 780-pin FBGA | 780-pin FBGA | Package compatibility is required for a drop-in replacement on the same PCB footprint. |
| Operating Temperature Grade | Industrial (-40°C to 100°C junction) | Commercial (0°C to 85°C junction) | Temperature grade determines suitability for harsh or industrial environments versus commercial applications. |
| Speed Grade | 3 (fastest) | 2 | Speed grade affects maximum operating frequency and timing closure for high-performance designs. |
| Supply Voltage (Core) | 1.1 V | 1.2 V | Core voltage must match the board power design; a mismatch can prevent correct operation or damage the device. |
Need help validating a replacement?
Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | EP3SL150F780I3N | EP3SL70F780C2 |
|---|---|---|
| Supplier | Intel | Intel |
| Series | Stratix® III L | Stratix® III L |
| Part Status | Obsolete | Obsolete |
| Number of LABs/CLBs | 5700 | 2700 |
| Number of Logic Elements/Cells | 142500 | 67500 |
| Total RAM Bits | 6543360 | 2699264 |
| Number of I/O | 488 | 488 |
| Voltage - Supply | 0.86V ~ 1.15V | 0.86V ~ 1.15V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the primary differences between the EP3SL150F780I3N and the EP3SL70F780C2?
The EP3SL150F780I3N and EP3SL70F780C2 are both Altera (now Intel) Stratix III FPGAs in the same 780-pin FBGA package, but they differ in logic density, speed grade, and operating temperature range. The EP3SL150F780I3N offers approximately 150,000 logic elements (LEs) and is rated for industrial temperature range (-40°C to 100°C junction), while the EP3SL70F780C2 offers approximately 70,000 LEs and is rated for commercial temperature range (0°C to 85°C junction). The EP3SL150F780I3N also has a faster speed grade (3) compared to the EP3SL70F780C2 (2).
Are the EP3SL150F780I3N and EP3SL70F780C2 pin-compatible?
Yes, both devices are offered in the same 780-pin FineLine BGA (FBGA) package with the same physical footprint and ballout. However, pin compatibility does not guarantee functional equivalence; designers must verify that all I/O banks, transceiver channels, and power pins are correctly assigned for the specific device and application.
Can the EP3SL70F780C2 be used as a direct drop-in replacement for the EP3SL150F780I3N?
No, a direct drop-in replacement is not possible without design changes. The EP3SL150F780I3N has a larger logic capacity (approximately 150K LEs vs. 70K LEs), a different speed grade (3 vs. 2), and a wider industrial temperature range. The EP3SL70F780C2 has lower logic density and a commercial temperature range, so it cannot accommodate the same design logic or meet industrial thermal requirements without significant redesign and revalidation.
What are the operating temperature ranges for these two FPGAs?
The EP3SL150F780I3N is specified for industrial temperature range, typically -40°C to 100°C junction temperature (Tj). The EP3SL70F780C2 is specified for commercial temperature range, typically 0°C to 85°C junction temperature (Tj). These ranges are defined in the respective Intel Stratix III device datasheets and must be observed for reliable operation.
What is the difference in logic density between the EP3SL150F780I3N and EP3SL70F780C2?
The EP3SL150F780I3N contains approximately 150,000 logic elements (LEs), while the EP3SL70F780C2 contains approximately 70,000 LEs. This difference affects available resources for implementing custom logic, memory, and DSP functions. The EP3SL150F780I3N also typically includes more embedded memory blocks and multipliers proportional to its higher density.
Do both devices support the same transceiver speeds and protocols?
Both devices belong to the Stratix III family and support similar high-speed transceiver capabilities, but the exact number of transceiver channels and maximum data rates may differ by density and speed grade. The EP3SL150F780I3N, with its higher density and speed grade 3, may support higher aggregate bandwidth. Designers must consult the specific device datasheet and pin-out files to confirm transceiver channel counts and supported protocols for each part number.
What power supply voltages are required for the EP3SL150F780I3N and EP3SL70F780C2?
Both devices are Stratix III FPGAs and typically require a core voltage (VCCINT) of 1.1V, a peripheral voltage (VCCIO) that depends on I/O bank configuration (e.g., 1.2V, 1.5V, 1.8V, 2.5V, 3.0V, or 3.3V), and auxiliary voltages for PLLs and transceivers. Exact supply requirements are specified in the Intel Stratix III device datasheets and must be verified for each part number and configuration.
Are these parts still in active production or have they been discontinued?
The Stratix III family, including the EP3SL150F780I3N and EP3SL70F780C2, has been discontinued by Intel (formerly Altera). These devices are no longer in active production. Availability is limited to remaining distributor stock, surplus, or third-party sources. Designers should consider migrating to a newer FPGA family for new designs.