PC28F128J3F75A
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PC28F128J3F75AとPC28F00AG18FF TRの詳細な比較では、それぞれの仕様と主要機能に関する貴重な洞察を提供します。RoHS指令への準拠、REACH規則、シリーズ、実装スタイル、パッケージタイプ、その他の関連特性など、重要な要素を詳細に網羅しています。違いを並べて表示することで、部品選定が容易になり、特定のアプリケーションに最適なオプションを選択しやすくなります。
Replacement verdict
The PC28F128J3F75A and PC28F00AG18FF TR are not drop-in replacements for one another. They differ fundamentally in memory architecture, density, interface voltage, and package configuration, so substituting one for the other would require a complete board redesign and firmware rework rather than a simple part swap.
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Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | PC28F128J3F75A | PC28F00AG18FF TR | Why it matters |
|---|---|---|---|
| Memory Density | 128 Mbit | 1 Gbit | Density determines total storage capacity; a 1 Gbit device holds eight times the data of a 128 Mbit device, so they are not drop-in substitutes for firmware or code storage. |
| Memory Organization | 8 Mbit x 16 (word-wide) | 64 Mbit x 16 (word-wide) | Organization defines the data bus width and addressable word count, affecting how the host controller addresses and accesses the array. |
| Supply Voltage | 3.0 V to 3.6 V | 1.7 V to 2.0 V | Core and I/O voltage must match the system rail; a 3 V part cannot be substituted into a 1.8 V design without level shifting or a different power supply. |
| Interface Type | Parallel (asynchronous) | Parallel (synchronous burst) | Asynchronous versus synchronous interfaces require different controller timing and clocking, so the host must support the specific protocol. |
| Access Time | 75 ns | 110 ns (initial access) | Access time governs read latency; slower initial access can violate timing budgets in code-execution (XiP) applications. |
| Package / Case | 56-TSOP | 64-BGA | Footprint and pinout must match the PCB land pattern; different packages are not physically interchangeable without a board redesign. |
| Operating Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | Temperature range confirms suitability for industrial versus commercial environments; matching ranges indicate comparable environmental robustness. |
| Architecture / Cell Type | NOR flash (Intel StrataFlash) | NOR flash (Intel StrataFlash) | Both are NOR flash, which supports random access and code execution, unlike NAND; this preserves functional behavior for XiP use cases. |
| Product Status | Obsolete / not recommended for new designs | Active | Lifecycle status affects long-term availability and sourcing; an obsolete part may require redesign or last-time-buy planning. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | PC28F128J3F75A | PC28F00AG18FF TR |
|---|---|---|
| Series | - | StrataFlash™ |
| Part Status | Obsolete | Obsolete |
| Memory Type | Non-Volatile | Non-Volatile |
| Memory Format | FLASH | FLASH |
| Technology | FLASH - NOR | FLASH - NOR |
| Memory Size | 128Mbit | 1Gb (64M x 16) |
| Memory Interface | Parallel | Parallel |
| Clock Frequency | - | 133 MHz |
| Write Cycle Time - Word Page | - | 96ns |
| Access Time | 75 ns | 96 ns |
| Voltage - Supply | 2.7V ~ 3.6V | 1.7V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) | -30°C ~ 85°C (TC) |
| Mounting Type | Surface Mount | Surface Mount |
| Base Product Number | PC28F128 | - |
| Digi Key Programmable | Not Verified | - |
| Memory Organization | 16M x 8, 8M x 16 | - |
| Write Cycle Time - Word, Page | 75ns | - |
| Packaging | Tray | - |
The PC28F128J3F75A is a 128 Mbit (16 MByte) Intel StrataFlash embedded memory device in a 56-pin TSOP package, while the PC28F00AG18FF TR is a 1 Gbit (128 MByte) Micron StrataFlash embedded memory device in a 64-ball BGA package. They differ in density, package, pinout, voltage range, and interface timing, so they are not pin-to-pin or function-to-function equivalent.
No. The PC28F128J3F75A uses a 56-pin TSOP package, while the PC28F00AG18FF TR uses a 64-ball BGA package. The package types, ball/pin counts, and land patterns are different, so they cannot be interchanged without a PCB redesign.
No. The PC28F128J3F75A operates with a VCC core supply of 2.7 V to 3.6 V and a VCCQ I/O supply of 1.65 V to 3.6 V. The PC28F00AG18FF TR operates with a VCC core supply of 1.7 V to 2.0 V and a VCCQ I/O supply of 1.7 V to 3.6 V. The core voltage ranges are not compatible, so level shifting or a different power rail would be required.
The PC28F128J3F75A has a density of 128 Mbit (16 MByte), organized as 8 Mbit x 16. The PC28F00AG18FF TR has a density of 1 Gbit (128 MByte), organized as 64 Mbit x 16. The PC28F00AG18FF TR provides eight times the storage capacity of the PC28F128J3F75A.
No. Due to differences in package type, pin count, supply voltage, density, and command set architecture, the PC28F00AG18FF TR cannot be used as a drop-in replacement for the PC28F128J3F75A. A redesign of the PCB, power supply, and firmware would be necessary.
The PC28F128J3F75A is specified for operation over the industrial temperature range of -40°C to +85°C. The PC28F00AG18FF TR is specified for operation over the industrial temperature range of -40°C to +85°C. Both devices support the same industrial temperature range.
The PC28F128J3F75A has a maximum access time of 75 ns. The PC28F00AG18FF TR has a maximum access time of 110 ns. The PC28F128J3F75A provides faster random access timing than the PC28F00AG18FF TR.
No. The PC28F128J3F75A was originally manufactured by Intel and is now part of Micron's StrataFlash portfolio. The PC28F00AG18FF TR is manufactured by Micron. Both are now part of Micron's product line, but they originate from different generations of StrataFlash technology.