仕様
| 属性 | 値 |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 500 |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 387072 |
| Number of I/O | 178 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
概要
Description
The 10M08DAF256I7G is a member of the Intel MAX 10 FPGA family, designed for a wide range of applications requiring flexibility and performance. It features 8,000 logic elements, making it suitable for moderate complexity designs. The device is housed in a 256-pin FineLine BGA package, which supports efficient space utilization on PCBs. Operating at a speed grade of 7, it balances power consumption and performance effectively.
One of the notable features of the 10M08DAF256I7G is its on-chip flash memory, allowing for instant-on configurations and eliminating the need for external configuration devices. This makes it ideal for applications requiring quick start-up times. The FPGA offers embedded memory, DSP blocks, and supports various I/O standards, providing designers with ample resources for diverse applications.
With its Nios II soft processor support, the 10M08DAF256I7G is suitable for embedded applications. Additionally, its non-volatile configuration memory enhances reliability and reduces system costs, making it a versatile choice for industrial, automotive, and consumer electronics markets.
One of the notable features of the 10M08DAF256I7G is its on-chip flash memory, allowing for instant-on configurations and eliminating the need for external configuration devices. This makes it ideal for applications requiring quick start-up times. The FPGA offers embedded memory, DSP blocks, and supports various I/O standards, providing designers with ample resources for diverse applications.
With its Nios II soft processor support, the 10M08DAF256I7G is suitable for embedded applications. Additionally, its non-volatile configuration memory enhances reliability and reduces system costs, making it a versatile choice for industrial, automotive, and consumer electronics markets.
Equivalent
The 10M08DAF256I7G is a part of Intel's MAX 10 FPGA series. Equivalent products may include other FPGAs with similar logic element counts and performance from different manufacturers. Consider devices like:
1. Xilinx Spartan-7 series (e.g., XC7S15)
2. Lattice ECP5 series (e.g., LFE5U-25F)
3. Microchip (formerly Microsemi) SmartFusion2 (e.g., M2S010)
These alternatives vary in features and specifications, so ensure they meet your specific design requirements.
1. Xilinx Spartan-7 series (e.g., XC7S15)
2. Lattice ECP5 series (e.g., LFE5U-25F)
3. Microchip (formerly Microsemi) SmartFusion2 (e.g., M2S010)
These alternatives vary in features and specifications, so ensure they meet your specific design requirements.
Features
The 10M08DAF256I7G is part of Intel's MAX 10 FPGA family, which is designed for low power, high functionality applications. Key features include:
1. Logic Elements (LEs): It contains 8,000 LEs, which are the basic building blocks for implementing digital logic.
2. Embedded Memory: Offers up to 387 Kbits of embedded memory, useful for data storage and buffering.
3. I/O Pins: Configurable I/Os with a total of 178 user I/O pins, supporting multiple I/O standards.
4. Integrated Analog-to-Digital Converter (ADC): Includes on-chip ADCs for mixed-signal applications.
5. Non-Volatile Configuration Memory: Allows instant-on functionality as the FPGA retains its configuration after power-off.
6. Power Supply: Supports 3.3V single power supply operation, simplifying power management.
7. Package: Available in a 256-pin FineLine BGA package, providing a compact physical footprint.
8. Temperature Range: Supports industrial temperature range, ensuring reliability in a wide range of environments.
These features make it suitable for diverse applications such as industrial automation, consumer electronics, and more.
1. Logic Elements (LEs): It contains 8,000 LEs, which are the basic building blocks for implementing digital logic.
2. Embedded Memory: Offers up to 387 Kbits of embedded memory, useful for data storage and buffering.
3. I/O Pins: Configurable I/Os with a total of 178 user I/O pins, supporting multiple I/O standards.
4. Integrated Analog-to-Digital Converter (ADC): Includes on-chip ADCs for mixed-signal applications.
5. Non-Volatile Configuration Memory: Allows instant-on functionality as the FPGA retains its configuration after power-off.
6. Power Supply: Supports 3.3V single power supply operation, simplifying power management.
7. Package: Available in a 256-pin FineLine BGA package, providing a compact physical footprint.
8. Temperature Range: Supports industrial temperature range, ensuring reliability in a wide range of environments.
These features make it suitable for diverse applications such as industrial automation, consumer electronics, and more.
Pinout
The 10M08DAF256I7G is a member of the Intel MAX 10 FPGA family. This specific model comes in a 256-pin FineLine BGA (Ball Grid Array) package.
The device includes up to 8,000 logic elements (LEs) and supports various functions such as digital signal processing (DSP), memory, and general-purpose logic. It features embedded flash memory, which allows for single-chip configuration without the need for an external configuration device. Additionally, it supports analog-to-digital conversion (ADC) capabilities, making it useful for mixed-signal applications.
The 10M08DAF256I7G is designed for industrial-grade applications with an operating temperature range of -40°C to +100°C. This makes it suitable for a wide range of applications, including industrial, automotive, and communication systems. Its versatility and low power consumption are key attributes that enable a broad spectrum of applications.
The device includes up to 8,000 logic elements (LEs) and supports various functions such as digital signal processing (DSP), memory, and general-purpose logic. It features embedded flash memory, which allows for single-chip configuration without the need for an external configuration device. Additionally, it supports analog-to-digital conversion (ADC) capabilities, making it useful for mixed-signal applications.
The 10M08DAF256I7G is designed for industrial-grade applications with an operating temperature range of -40°C to +100°C. This makes it suitable for a wide range of applications, including industrial, automotive, and communication systems. Its versatility and low power consumption are key attributes that enable a broad spectrum of applications.
Manufacturer
The 10M08DAF256I7G is a part of the Intel MAX 10 FPGA series, manufactured by Intel Corporation. Intel is a multinational corporation and technology company headquartered in Santa Clara, California, USA. It is well-known for designing and manufacturing a wide range of semiconductor products, including microprocessors, integrated graphics, and a variety of other integrated circuits. The company plays a significant role in the computing and electronics industries and is one of the largest and most influential semiconductor manufacturers globally. The Intel MAX 10 FPGAs are particularly noted for their integration of non-volatile flash memory, providing benefits such as instant-on capability and the ability to store and run multiple configurations.
Application
The 10M08DAF256I7G is an Intel MAX 10 FPGA, commonly used in applications requiring low power, high functionality, and flexibility. Key application areas include:
1. Industrial Automation: Used in control systems and machine vision.
2. Consumer Electronics: For enhancing device functionality and flexibility.
3. Communications: In signal processing and protocol bridging.
4. Automotive: For infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Used in portable diagnostic equipment.
6. IoT Devices: Facilitates edge computing and connectivity tasks.
7. Data Acquisition: For sensors and monitoring systems.
These application areas leverage its integrated analog functionality, low power consumption, and reconfigurability.
1. Industrial Automation: Used in control systems and machine vision.
2. Consumer Electronics: For enhancing device functionality and flexibility.
3. Communications: In signal processing and protocol bridging.
4. Automotive: For infotainment systems and advanced driver-assistance systems (ADAS).
5. Medical Devices: Used in portable diagnostic equipment.
6. IoT Devices: Facilitates edge computing and connectivity tasks.
7. Data Acquisition: For sensors and monitoring systems.
These application areas leverage its integrated analog functionality, low power consumption, and reconfigurability.
Package
The 10M08DAF256I7G is part of Intel's MAX 10 FPGA series. It has a FineLine BGA (Ball Grid Array) package with 256 pins. This package type is known for its compact size and efficient heat dissipation, making it suitable for high-density electronic applications.