5CGTFD9E5F35I7N

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5CGTFD9E5F35I7N

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IC FPGA 560 I/O 1152FBGA

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Series Cyclone® V GT
Part Status Active
Digi Key Programmable Not Verified
Number of Logic Elements / Cells 301000
Total RAM Bits 14251008
Number of I/O 560
Voltage - Supply 1.07V ~ 1.13V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number 5CGTFD9
Number of LA Bs / CL Bs 113560

概要

Description

5CGTFD9E5F35I7N appears to be a unique identifier or code, possibly related to a specific system, product, or service. Without additional context, it’s challenging to pinpoint its exact meaning or application. It may be an alphanumeric code used for tracking, categorization, or identification purposes in various fields, such as technology, logistics, or inventory management.
If you have more details or specific questions regarding this code, please provide additional context for a more tailored response.

Equivalent

The 5CGTFD9E5F35I7N chip is a part of the Intel Cyclone V FPGA family. Equivalent products include:
1. Intel Cyclone V E series (similar performance)
2. Lattice Semiconductor ECP5 (lower power, similar applications)
3. Xilinx Artix-7 (higher performance, but may vary in power consumption)
When selecting an equivalent, consider factors like specific application needs, power consumption, and available I/O features.

Manufacturer

The manufacturer of the part number 5CGTFD9E5F35I7N is Intel Corporation. Intel is a multinational technology company primarily known for designing and manufacturing semiconductor chips, particularly microprocessors used in computers and servers. Founded in 1968 and headquartered in Santa Clara, California, Intel plays a crucial role in the global technology industry. The company's products include CPUs, integrated circuits, and various hardware components, as well as solutions for data centers, IoT (Internet of Things), and AI (Artificial Intelligence). Intel is recognized for its innovation in computing technology and has a significant impact on advancements in electronics and computing across various sectors.

Package

The package type of the component with part number 5CGTFD9E5F35I7N is a Fine-Pitch BGA (Ball Grid Array). This packaging is typically used for high-density integrated circuits, providing efficient thermal and electrical performance.

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