88W8987-A2-EAHE/AZ

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88W8987-A2-EAHE/AZ

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IC RF TXRX BLE 83WLCSP

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Part Status Active
Type TxRx Only
RF Family / Standard Bluetooth, WiFi
Protocol 802.11a/b/g/-c, Bluetooth v5.2
Modulation 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
Frequency 2.4GHz, 5GHz
Data Rate (Max) 433Mbps
Power - Output 22dBm
Sensitivity -99dBm
Serial Interfaces GPIO, JTAG, PCM, SDIO, UART
Voltage - Supply 1.1V, 1.8V, 2.2V
Current - Receiving 38mA ~ 82mA
Current - Transmitting 79mA ~ 145mA
Operating Temperature -30°C ~ 85°C
Mounting Type Surface Mount
Package / Case 83-WFBGA, WLCSP
Supplier Device Package 83-WLCSP (4.6x4.2)
GPIO 21

概要

Description

The 88W8987-A2-EAHE/AZ is a highly integrated wireless connectivity chip designed by NXP Semiconductors. It supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth 5.0, making it suitable for a wide range of applications, including smartphones, tablets, IoT devices, and automotive systems. The chip is known for its low power consumption, which extends battery life in portable devices, and its robust performance, which ensures reliable wireless communication.
The 88W8987 features advanced security protocols, such as WPA3, to protect data transmission and supports MU-MIMO technology for improved network efficiency. Its compact size and integration capabilities enable manufacturers to design smaller and more efficient devices. Additionally, the chip includes support for multiple interfaces, such as SDIO and PCIe, providing flexibility in design and implementation.
Overall, the 88W8987-A2-EAHE/AZ is a versatile solution for modern wireless communication needs, balancing performance, power efficiency, and security in a single package.

Equivalent

The 88W8987-A2-EAHE/AZ is a Wi-Fi and Bluetooth combo chip produced by Marvell (now part of NXP). Equivalent products from other manufacturers include:
1. Qualcomm QCA9377 - A low-power, single-stream 802.11ac and Bluetooth 4.2 combo chip.
2. Broadcom BCM43455 - Supports similar 802.11ac Wi-Fi and Bluetooth functionalities.
3. Realtek RTL8723BE - Offers integrated Wi-Fi and Bluetooth, although it may have slight variations in specifications.
These alternatives vary in specific features and support, so compatibility should be verified based on project requirements.

Features

The 88W8987-A2-EAHE/AZ is a highly integrated wireless communication module designed for various connectivity applications. Key features include:
1. Dual-Band Wi-Fi: Supports both 2.4 GHz and 5 GHz bands, enabling high-speed wireless data transmission.
2. Bluetooth 5.0: Provides improved range, speed, and broadcasting capacity compared to previous Bluetooth versions.
3. Advanced Security: Incorporates WPA3 security protocol to ensure secure and encrypted data transmission.
4. Low Power Consumption: Designed to optimize power efficiency, making it suitable for battery-powered devices.
5. MIMO Technology: Multiple Input, Multiple Output support enhances throughput and reliability by using multiple antennas.
6. Seamless Connectivity: Supports various interfaces like SDIO and UART for easy integration with different platforms.
7. Compact Design: Its small form factor fits easily into space-constrained applications.
8. Enhanced Coexistence: Advanced mechanisms to allow simultaneous operation of Wi-Fi and Bluetooth without interference.
These features make the 88W8987-A2-EAHE/AZ ideal for IoT devices, smartphones, tablets, wearable technology, and other applications requiring robust wireless communication.

Pinout

The 88W8987-A2-EAHE/AZ is a wireless SoC (System on Chip) from NXP Semiconductors, typically used for connectivity in various applications. It supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth 5.0. The specific pin count and detailed functions are usually found in the manufacturer's datasheet or technical documentation specific to that version of the chip.
Generally, such SoCs have a range of pins dedicated to power supply, ground, signal input/output, and interfaces like SDIO, UART, I2S, PCM, and GPIOs for communication with other components. For precise details, consulting the technical datasheet or contacting NXP directly is recommended, as it will provide comprehensive information about pin configuration and functionality.

Manufacturer

The 88W8987-A2-EAHE/AZ is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company that provides various solutions for automotive, industrial, mobile, and communication infrastructure markets. The company specializes in creating secure connectivity solutions for embedded applications and has a strong focus on innovations in the automotive industry, including advanced driver assistance systems (ADAS), secure vehicle-to-everything (V2X) communication, and other smart technologies. NXP is known for its expertise in areas like microcontrollers, microprocessors, analog devices, sensors, RF technologies, and secure connectivity solutions. The company's products are instrumental in enabling smart devices and secure connections, supporting the growing demand for IoT and automotive applications.

Application

The 88W8987-A2-EAHE/AZ is a highly integrated wireless SoC designed primarily for mobile and IoT applications. It supports both Wi-Fi and Bluetooth connectivity, making it suitable for a wide range of use cases. Key application areas include smartphones, tablets, wearables, smart home devices, and automotive infotainment systems. Its dual-band Wi-Fi (2.4GHz and 5GHz) and Bluetooth 5.0 support enhance wireless communication, making it ideal for applications that require robust connectivity and low power consumption. Additionally, its small form factor and high efficiency suit compact and battery-powered devices.

Package

The 88W8987-A2-EAHE/AZ is a Wi-Fi and Bluetooth combo chip commonly used in various wireless communication applications. It comes in a compact package, typically a QFN (Quad Flat No-leads) package, which provides a small footprint suitable for integration into portable and space-constrained devices. This package type ensures efficient thermal performance and is conducive to surface-mount technology.

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