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AD9601BCPZ-200
+BOMIC ADC 10BIT PIPELINED 56LFCSP
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メーカーテキサス・インスツルメンツ
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メーカー品番 #AD9601BCPZ-200
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データシート AD9601BCPZ-200 DataSheet
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パッケージ VFQFN-56
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在庫状況6175
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package / Case | Tray |
| Part Status | Active |
| Number of Bits | 10 |
| Sampling Rate(Per Second) | 200M |
| Number of Inputs | 1 |
| Input Type | Differential |
| Data Interface | LVDS - Parallel |
| Configuration | S/H-ADC |
| Ratio - S / H: ADC | 1:1 |
| Number of A/D Converters | 1 |
| Architecture | Pipelined |
| Reference Type | Internal |
| Voltage - Supply, Analog | 1.7V ~ 1.9V |
| Voltage - Supply, Digital | 1.7V ~ 1.9V |
| Operating Temperature | -40°C ~ 85°C |
| Supplier Device Package | 56-LFCSP-VQ (8x8) |
概要
Description
Key features of the AD9601BCPZ-200 include a low power consumption design, typically operating at around 300 mW, and an integrated input buffer that enhances performance by reducing signal distortion. Additionally, it supports both single-ended and differential input configurations, offering flexibility for various design needs.
The device includes a single 1.8 V supply, making it compatible with modern digital systems, and provides a flexible output interface that supports various formats, including CMOS and LVDS. The AD9601BCPZ-200 is housed in a compact 32-lead LFCSP (Lead Frame Chip Scale Package), ensuring it occupies minimal space on a circuit board.
Overall, the AD9601BCPZ-200 is a robust solution for high-speed data acquisition systems.
Equivalent
1. TI ADS5400 - 12-bit, 500 MSPS ADC
2. Maxim MAX109 - 10-bit, 200 MSPS ADC
3. Microchip MCP37DX02-200 - 12-bit, 200 MSPS ADC
Ensure to verify the specific application requirements such as power consumption, interfaces, and package type for compatibility.
Features
Key features include a differential input with an integrated buffer, a wide bandwidth input clock buffer, and a multi-stage, pipelined architecture for high-speed processing. The AD9601BCPZ-200 also incorporates an on-chip voltage reference and a serial port interface for easy configuration.
Designed for ease of use, it supports both CMOS and LVDS digital outputs, making it suitable for a variety of applications such as communications, instrumentation, and data acquisition systems. The compact, lead-free LFCSP (Lead Frame Chip Scale Package) packaging ensures efficient thermal management and ease of integration into circuit designs.
Pinout
Manufacturer
Application
1. Communications: Used in baseband and intermediate frequency processing.
2. Medical Imaging: Integral in systems requiring high-speed data acquisition.
3. Radar and Defense: Useful in signal intelligence and radar systems.
4. Test and Measurement Equipment: Employed in oscilloscopes and spectrum analyzers for precise measurements.
5. Industrial Controls: Suitable for high-speed industrial automation and control systems.
Its high-speed conversion capability and performance make it versatile for applications requiring rapid and accurate digital conversion of analog signals.