画像は参考用です
ADCA5191ACPZ-R7
+BOMCATV PUSH-PULL DRIVER
-
メーカーテキサス・インスツルメンツ
-
メーカー品番 #ADCA5191ACPZ-R7
-
データシート ADCA5191ACPZ-R7 DataSheet
-
パッケージ Surface Mount
-
在庫状況5682
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Supplier | Analog Devices Inc. |
| Package / Case | 1500 |
| Series | Tape & Reel (TR) |
| Frequency | Active |
| P1d B | 5MHz ~ 1.8GHz |
| Noise Figure | 25.8dB |
| RF Type | 5.2dB |
| Voltage - Supply | General Purpose |
| Supply Current | 5V ~ 8V |
| Test Frequency | 470mA |
概要
Description
This LNA offers a high gain and low noise figure, enhancing the sensitivity and performance of RF receivers. The ADCA5191ACPZ-R7 is packaged in a compact, surface-mount package which is advantageous for modern, high-density electronic circuit designs. The device requires a single supply voltage and offers easy integration with other components in a signal chain, thanks to its internally matched input and output.
The ADCA5191ACPZ-R7 promises reliability with its advanced material composition and robust design, ensuring consistent performance over a wide temperature range. It is especially beneficial in applications demanding reduced noise levels and improved signal fidelity.
Equivalent
Features
1. Frequency Range: Supports a wide frequency range, making it versatile for various RF applications.
2. High Efficiency: Offers efficient power amplification, optimizing energy consumption.
3. Output Power: Delivers substantial output power suitable for demanding RF systems.
4. Linearity: Ensures high linearity, crucial for maintaining signal integrity.
5. Package: Comes in a compact and robust package, facilitating easy integration into designs.
6. Thermal Management: Includes features for effective thermal management to maintain performance stability.
7. Impedance Matching: Designed for easy impedance matching to simplify circuit design.
8. Reliability: Built with high-quality materials for long-term reliability and durability.
These features make the ADCA5191ACPZ-R7 ideal for applications such as wireless infrastructure, communication systems, and other RF-based technologies.