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ADSP-BF700KCPZ-2
+BOMIC DSP LP 128KB L2SR 88LFCSP
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メーカーテキサス・インスツルメンツ
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メーカー品番 #ADSP-BF700KCPZ-2
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データシート ADSP-BF700KCPZ-2 DataSheet
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在庫状況6794
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Series | Blackfin® |
| Part Status | Active |
| Type | Blackfin+ |
| Interface | CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG |
| Clock Rate | 200MHz |
| Non - Volatile Memory | ROM (512kB) |
| On - Chip RAM | 128kB |
| Voltage - I / O | 1.8V, 3.3V |
| Voltage - Core | 1.10V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 88-VFQFN Exposed Pad, CSP |
| Supplier Device Package | 88-LFCSP-VQ (12x12) |
| Base Product Number | ADSP-BF700 |
概要
Description
Key features of the ADSP-BF700KCPZ-2 include a dual-MAC architecture for efficient computation, extensive on-chip memory, and a range of peripheral interfaces such as SPI, UART, and I2C for communication. It also supports both fixed-point and floating-point operations, providing flexibility in processing tasks.
Designed for low power consumption, the ADSP-BF700KCPZ-2 is ideal for battery-operated devices and systems requiring real-time performance. Additionally, it is supported by a comprehensive development environment, including software tools and libraries, to streamline the design process. Overall, the ADSP-BF700KCPZ-2 is a versatile choice for developers looking to implement advanced signal processing in their applications.
Equivalent
Features
1. Core Architecture: It utilizes a dual-core architecture with a 16/32-bit SIMD (Single Instruction, Multiple Data) engine for enhanced processing capabilities.
2. Performance: It operates at clock speeds up to 600 MHz, providing efficient processing for complex algorithms.
3. Memory: The chip includes on-chip memory configurations, featuring up to 32 KB of L1 cache and additional SRAM options for optimized data handling.
4. Connectivity: It supports various interfaces including SPI, I2C, and UART, enabling seamless communication with other peripherals.
5. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
6. Versatility: It is ideal for applications in audio processing, industrial control, and communications, owing to its flexible architecture.
7. Development Support: Compatible with development tools facilitating rapid prototyping and deployment.
These features combine to make the ADSP-BF700KCPZ-2 a robust choice for demanding signal processing applications.
Pinout
Key functions include:
1. Processing: It integrates a dual-core architecture that supports DSP (Digital Signal Processing) tasks, suitable for audio, video, and communication applications.
2. Memory Interfaces: It includes connections for external memory, such as SDRAM and flash, enhancing its capacity to handle complex algorithms.
3. I/O Interfaces: The processor provides various I/O options, including GPIOs, UARTs, SPI, and I2C for peripheral connectivity.
4. Analog Interfaces: It has integrated ADCs (Analog-to-Digital Converters) and DACs (Digital-to-Analog Converters), facilitating data acquisition and signal processing.
In summary, the ADSP-BF700KCPZ-2 is designed for high-performance embedded applications, with a versatile set of pins dedicated to processing, memory interfacing, and peripherals.
Manufacturer
Application
1. Audio Processing: Used in professional audio equipment for effects and mixing.
2. Video Processing: Supports video compression and enhancement in cameras and multimedia devices.
3. Industrial Automation: Employed in control systems for robotics and machinery.
4. Medical Devices: Utilized in diagnostic imaging and patient monitoring systems.
5. Communication Systems: Supports signal processing in wireless and wired communication applications.
Its flexibility and processing power make it suitable for a wide range of embedded systems.