AS4C256M16D4-75BIN

The AS4C256M16D4-75BIN is a 256Mb (megabit) DDR3 SDRAM (Synchronous Dynamic Random-Access Memory) chip, designed for high-performance memory applications. It features a 16-bit data width and operates at a 1.5V power supply, making it suitable for various electronic devices, including smartphones, tablets, and computers.
This memory module is organized in a configuration of 16Mbits x 16 bits, allowing for efficient data processing. The "75" in the designation refers to the maximum clock frequency, indicating it can operate at speeds up to 750 Mbps per pin. The "BIN" suffix often denotes a specific package or temperature range.
Key features include low power consumption, support for various operating modes, and enhanced data transfer rates, which are essential for modern applications that require fast and efficient memory access. Overall, the AS4C256M16D4-75BIN is a reliable choice for developers looking to implement high-performance memory solutions in their designs.

The AS4C256M16D4-75BIN chip is a 256Mb DDR3 SDRAM memory device. Equivalent products include the Micron MT41J256M16HA-125, Hynix H5TQ2G83AFR, and Samsung K4B4G1646D-BCMA. When looking for alternatives, ensure they have similar specifications, such as density, organization, voltage, and speed grade to ensure compatibility.

The AS4C256M16D4-75BIN is a DDR3 SDRAM memory chip designed for high-performance applications. Here are its key features:
1. Capacity: 256 Megabits (32 Megabytes) organized as 16 bits wide.
2. Speed: Operates at a data rate of 800 MT/s (Mega Transfers per second).
3. Interface: Supports DDR3 SDRAM interface standards.
4. Voltage: Operates at a low voltage of 1.5V, with an option for 1.35V low-power mode.
5. Package: Typically available in a small footprint, such as a 60-ball TFBGA (Thin Fine Ball Grid Array).
6. Latency: Offers low latency, contributing to improved performance in memory-intensive applications.
7. Features: Includes features like single-ended data inputs and outputs, and an internal self-refresh mode to conserve power.
8. Applications: Suitable for various applications, including networking, consumer electronics, and industrial devices.
These attributes make the AS4C256M16D4-75BIN a reliable choice for modern electronic systems requiring efficient memory solutions.

The AS4C256M16D4-75BIN is a DDR3 SDRAM memory chip with a pin count of 78. This device is organized as 256 Meg x 16 bits and operates at a data rate of up to 1600 MT/s. The main functions of the chip include serving as volatile memory for high-speed data storage and retrieval in applications such as computers, servers, and other electronic devices. Key features include support for burst mode, a low power mode, and various data transfer modes, making it suitable for a range of high-performance applications.

The AS4C256M16D4-75BIN is manufactured by Alliance Memory, Inc. Alliance Memory is a semiconductor company that specializes in the design, development, and distribution of memory components. They focus on providing a wide range of memory solutions, including DRAM, SRAM, and other memory products, primarily targeting various applications in consumer electronics, telecommunications, and industrial markets.
Founded in 2006, Alliance Memory aims to offer high-quality, cost-effective memory solutions while providing excellent customer support and service. The company positions itself as a reliable source for legacy memory components, helping manufacturers maintain and enhance their product offerings in an ever-evolving technological landscape. Overall, Alliance Memory plays a significant role in the semiconductor industry by supplying essential memory products that meet diverse customer needs.

The AS4C256M16D4-75BIN is a 4Gb (256M x 16) DDR3 SDRAM memory chip used in various application areas, including consumer electronics, networking equipment, and embedded systems. Common applications include laptops, desktops, servers, gaming consoles, and industrial automation devices. Its features, such as high-speed data transfer and energy efficiency, make it suitable for applications requiring significant memory bandwidth and performance, such as video processing, telecommunications, and cloud computing. Additionally, it is used in automotive electronics for advanced driver-assistance systems (ADAS).

The AS4C256M16D4-75BIN is packaged in a standard 78-ball TFBGA (Thin Fine Pitch Ball Grid Array) form factor. This compact package type is designed for high-density applications, ensuring efficient thermal performance and electrical connectivity.