BCM56440XB0IFSBLG

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BCM56440XB0IFSBLG

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  • メーカー品番 #BCM56440XB0IFSBLG

  • 在庫状況6540

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Supplier Broadcom Limited
Package / Case Tray
Part Status Active

概要

Description

BCM56440XB0IFSBLG is a Broadcom Ethernet switch ASIC (BCM56440 family) used in high‑performance switches and network appliances. It is a system‑on‑chip that provides core packet processing, switch fabric, and MAC/PHY interfaces in one device, enabling scalable data‑plane performance.
Key points:
- Multiport switching: supports configurable port speeds (typical 1G/10G/40G variants) and large switching capacity.
- On‑chip features: L2/L3 switching, VLANs, QoS, ACLs, and rate shaping; often includes basic routing capabilities.
- Integration: combines switch logic with interfaces for management CPU and memory; boards add external PHYs as needed.
- Packaging/variant: the B0 denotes silicon revision; IFSBLG encodes packaging, RoHS/lead‑free options, and related details.
Exact port counts, speeds, and memory depend on the board design and packaging. For precise specs, consult the official BCM56440 datasheet/product brief from Broadcom or contact Broadcom/your distributor.

Equivalent

BCM56440XB0IFSBLG is a Broadcom Prestera/StrataXGS switch ASIC. There is no public direct one‑to‑one “equivalent” part. For a cross‑reference, use Broadcom’s official cross‑reference tool or contact Broadcom/distributor support. They will map to a current device with similar specs (port speeds/count, features). Potential substitutes are other Prestera/StrataXGS devices (e.g., newer BCM569x/BCM567x families) or equivalent Broadcom parts—confirmed only via official cross‑reference.

Manufacturer

- Manufacturer: Broadcom Inc.
- About the company: A global fabless semiconductor company that designs and sells a wide range of chips and infrastructure software for networking, data centers, storage, wireless, and broadband applications.

Application

High-performance Ethernet switch SoC for data center and enterprise networks. Applications include data-center switching (leaf/spine, top-of-rack), enterprise access/aggregation switches, service-provider edge platforms, and network appliances (firewalls, load balancers, DPI) requiring QoS, virtualization, and SDN/NFV support.

Package

Ball Grid Array (BGA) package.

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