BGM220PC22HNA2

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BGM220PC22HNA2

+BOM

WIRELESS GECKO BLUETOOTH PCB MOD

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Package Strip
ProductStatus Active
RFFamily/Standard Bluetooth
Protocol Bluetooth v5.2
Modulation GFSK
Frequency 2.4GHz ~ 2.4835GHz
DataRate 2Mbps
Power-Output 8dBm
Sensitivity -98.9dBm
SerialInterfaces ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART
AntennaType Integrated, Chip
UtilizedIC/Part EFR32BG22
MemorySize 512kB Flash, 32kB RAM
Voltage-Supply 1.8V ~ 3.8V
Current-Receiving 4.3mA ~ 4.8mA
Current-Transmitting 4.8mA ~ 10.8mA
MountingType Surface Mount
OperatingTemperature -40°C ~ 105°C (TA)

概要

Description

The BGM220PC22HNA2 is a Bluetooth module developed by Silicon Labs, designed for wireless communication in IoT applications. Part of the BGM220P series, this module is built around the EFR32BG22 SoC, which integrates an ARM Cortex-M33 processor, providing a balance of performance and energy efficiency. It supports Bluetooth 5.2, offering enhanced features like improved data rates and extended range capabilities.
The BGM220PC22HNA2 is compact and includes robust security features, including hardware cryptographic accelerators and secure boot, making it suitable for secure applications. It also supports Bluetooth Low Energy (BLE), making it ideal for battery-powered devices due to its low power consumption.
The module is designed for easy integration into various applications, such as smart home devices, health and fitness products, and asset tracking solutions. It provides multiple GPIOs and peripheral interfaces like UART, SPI, and I2C, allowing flexibility in connecting with other components. Overall, the BGM220PC22HNA2 is a versatile and secure solution for modern wireless communication needs.

Equivalent

The BGM220PC22HNA2 is a Bluetooth module from Silicon Labs. Equivalent products may include:
1. Nordic Semiconductor's nRF52840, offering Bluetooth 5.2 capabilities.
2. Texas Instruments' CC2640R2F, which supports Bluetooth 5.1.
3. Dialog Semiconductor's DA14531, known for low power consumption.
These alternatives offer similar Bluetooth functionalities but may differ in other specifications and features. Always check the specific requirements and datasheets to ensure compatibility with your project.

Features

The BGM220PC22HNA2 is a part of Silicon Labs' Bluetooth Low Energy (BLE) module series designed for IoT applications. Key features include:
1. Bluetooth 5.2 Support: Offers enhanced range, speed, and broadcast capabilities.
2. Energy Efficiency: Designed for low power consumption, optimal for battery-operated devices.
3. Compact Size: Small form factor suitable for space-constrained applications.
4. High Performance: Powered by an ARM Cortex-M33 processor for efficient processing.
5. Security: Includes features like Secure Boot and TrustZone for robust security.
6. Integrated Antenna: Built-in antenna for simplified design and reduced cost.
7. Rich Peripheral Set: Supports various interfaces like UART, SPI, I2C, and GPIOs.
8. Development Support: Compatible with Silicon Labs’ software and tools for easy development and integration.
These features make the BGM220PC22HNA2 well-suited for a range of applications, including smart home devices, health monitoring systems, and wearable technology.

Pinout

The BGM220PC22HNA2 is a module from Silicon Labs designed for low-power Bluetooth applications. It is part of the BGM220P series, which features a powerful and efficient Bluetooth Low Energy (BLE) 5.2 compliant SoC.
The BGM220PC22HNA2 specifically has a pin count of 32. These pins are used for various functions typical of Bluetooth modules, including power supply, ground, I/O operations, and programming/debugging interfaces. Key functions include:
- Power and Ground Pins: For supplying power to the module.
- GPIO Pins: General-purpose input/output pins for interfacing with other devices.
- UART/SPI/I2C Interfaces: For communication with external peripherals.
- Antenna Interface: To connect with an external antenna for wireless communication.
- Programming/Debugging Pins: Used for flashing firmware and debugging.
This module is designed for applications where size, energy efficiency, and wireless connectivity are critical, such as in IoT devices, wearable technology, and smart home products.

Manufacturer

The BGM220PC22HNA2 is manufactured by Silicon Labs. Silicon Labs is a semiconductor company that specializes in the design and development of integrated circuits, modules, and software solutions for a wide range of applications. The company focuses on providing solutions for the Internet of Things (IoT), internet infrastructure, industrial automation, consumer electronics, and automotive markets. Silicon Labs is known for its expertise in wireless connectivity, microcontrollers, sensors, and timing devices.

Application

The BGM220PC22HNA2 is a Bluetooth module designed for applications requiring low power consumption and compact size. Key application areas include:
1. IoT Devices: Suitable for smart home devices, sensors, and other Internet of Things applications.
2. Wearables: Ideal for fitness trackers, smartwatches, and health monitoring devices.
3. Medical Devices: Can be used in wireless patient monitoring and portable medical equipment.
4. Asset Tracking: Useful in logistics and inventory management for tracking assets.
5. Consumer Electronics: Applicable in wireless audio, remote controls, and gaming peripherals.
6. Industrial Automation: Employed in smart industrial sensors and control systems.
Its Bluetooth Low Energy functionality makes it ideal for applications needing reliable wireless communication.

Package

The BGM220PC22HNA2 is a module in the BGM220P series by Silicon Labs. It features a compact package type known as PCB (Printed Circuit Board) module. This type of packaging is designed for easy integration into wireless applications, providing Bluetooth connectivity with low power consumption and efficient performance.

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