CC430F5137IRGZ

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CC430F5137IRGZ

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IC RF TXRX+MCU ISM<1GHZ 48VQFN

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仕様

属性
PartStatus Active
DigiKeyProgrammable Not Verified
Type TxRx + MCU
RFFamily/Standard General ISM < 1GHz
Modulation 2FSK, 2GFSK, ASK, MSK, OOK
Frequency 300MHz ~ 348MHz, 389MHz ~ 464MHz, 779MHz ~ 928MHz
DataRate(Max) 500kBaud
Power-Output 13dBm
Sensitivity -117dBm
MemorySize 32kB Flash, 4kB SRAM
SerialInterfaces I2C, IrDA, JTAG, SPI, UART
Voltage-Supply 2V ~ 3.6V
Current-Receiving 15mA ~ 18.5mA
Current-Transmitting 15mA ~ 36mA
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 48-VFQFN Exposed Pad
SupplierDevicePackage 48-VQFN (7x7)
BaseProductNumber CC430F5137
GPIO 30

概要

Description

The CC430F5137IRGZ is a low-power microcontroller from Texas Instruments, part of the CC430 series, which integrates a 16-bit MSP430 CPU and a sub-1 GHz RF transceiver. It is designed for wireless communication and is particularly suited for applications in the Internet of Things (IoT), smart metering, and industrial automation.
Key features include:
- Memory: 128 KB of flash memory and 8 KB of RAM.
- Low Power Consumption: Ideal for battery-operated devices, with various low-power modes.
- RF Capabilities: Supports multiple modulation formats and has a programmable output power.
- Integrated Peripherals: Includes timers, ADCs, and GPIOs for versatile application designs.
- Development Support: Compatible with development tools and software from Texas Instruments, enabling rapid prototyping.
Overall, the CC430F5137IRGZ is a versatile choice for developers needing efficient, wireless control and data transmission in their applications.

Equivalent

The CC430F5137IRGZ chip can be equivalently replaced by other members of the CC430 family, such as CC430F5135 or CC430F5147, depending on specific requirements like memory size or peripheral features. Additionally, similar products from other manufacturers for low-power RF applications include the MSP430 series with RF capabilities or devices from the nRF series by Nordic Semiconductor. Always verify compatibility based on your application’s specific needs.

Features

The CC430F5137IRGZ is a low-power System-on-Chip (SoC) from Texas Instruments, designed for wireless applications. Key features include:
1. Microcontroller: It features an integrated 16-bit MSP430 CPU with 128KB Flash memory and 8KB RAM, suitable for processing tasks in embedded systems.

2. Radio: The device includes a sub-1 GHz RF transceiver, supporting various wireless protocols, making it ideal for applications like Zigbee and proprietary RF communications.
3. Low Power Consumption: It operates in low power modes, maximizing battery life, which is crucial for portable and remote applications.
4. Integrated Peripherals: It has built-in peripherals such as multiple timers, ADC, and UART, enabling versatile interfacing capabilities.
5. Temperature Range: Operates in a wide temperature range, typically -40 to +85 degrees Celsius, ensuring reliability in diverse environments.
6. Development Support: Compatible with TI's development tools, facilitating easy prototyping and deployment.
Overall, the CC430F5137IRGZ is an efficient choice for IoT devices, smart home applications, and industrial automation.

Pinout

The CC430F5137IRGZ is a System-on-Chip (SoC) from Texas Instruments, designed for low-power wireless applications. It features a 48-pin QFN package.
### Pin Count:
- Total Pins: 48
### Key Functions:
- Microcontroller: ARM Cortex-M3 core with up to 16 KB of RAM and 128 KB of flash memory.
- RF Transceiver: Integrated sub-1 GHz transceiver for wireless communication.
- GPIOs: Multiple General Purpose Input/Output pins for interfacing.
- ADC: 12-bit Analog-to-Digital Converter for sensor readings.
- Timers: Multiple timers for timing operations and PWM generation.
- I2C/SPI/UART: Communication interfaces for peripheral connectivity.
- Low Power Modes: Various low-power operation modes to extend battery life.
The CC430F5137IRGZ is ideal for applications in smart metering, home automation, and industrial monitoring due to its integrated functionality and low power consumption.

Manufacturer

The CC430F5137IRGZ is manufactured by Texas Instruments (TI), a prominent American technology company. Texas Instruments specializes in designing and manufacturing semiconductors and various integrated circuits, which are used in a wide range of electronic applications, including analog electronics, embedded processors, and digital signal processing (DSP).
Founded in 1930, Texas Instruments is known for its innovation in the field of electronics and has a significant presence in both consumer and industrial sectors. The company is particularly recognized for its products in the areas of wireless communication, automotive, industrial automation, and consumer electronics. The CC430F5137IRGZ is part of TI’s line of microcontrollers, specifically designed for low-power applications, combining a microcontroller with a radio frequency (RF) transceiver. This makes it suitable for applications such as smart meters, home automation, and sensor networks, where low power consumption and wireless connectivity are essential. Overall, Texas Instruments is a key player in the semiconductor industry, contributing to advancements in technology across various markets.

Application

The CC430F5137IRGZ is a low-power System-on-Chip (SoC) from Texas Instruments, primarily used in wireless communication applications. Key application areas include:
1. Smart Metering - for energy and water metering solutions.
2. Home Automation - enabling wireless control of devices and sensors.
3. Industrial Monitoring - for remote monitoring and control in industrial settings.
4. Medical Devices - in wearable health monitors and telemetry systems.
5. Smart Agriculture - for monitoring soil and crop conditions.
6. IoT Applications - facilitating connectivity in Internet of Things devices.
Its integrated RF transceiver and microcontroller make it suitable for low-power and long-range wireless applications.

Package

The CC430F5137IRGZ is packaged in a 48-pin VQFN (Very Thin Quad Flat No-lead) package. This compact and thermally efficient package is designed for surface mounting in electronic applications.

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