CL32A107MPVNNNE

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CL32A107MPVNNNE

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CAP CER 100UF 10V X5R 1210

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  • メーカー品番 #CL32A107MPVNNNE

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仕様

属性
Series CL
Part Status Active
Capacitance 100 µF
Tolerance ±20%
Voltage - Rated 10V
Temperature Coefficient X5R
Operating Temperature -55°C ~ 85°C
Applications General Purpose
Mounting Type Surface Mount, MLCC
Package 1210 (3225 Metric)
Size / Dimension 0.126" L x 0.098" W (3.20mm x 2.50mm)
Thickness (Max) 0.110" (2.80mm)
Packaging Cut Tape (CT), Tape & Reel (TR)

概要

Description

CL32A107MPVNNNE is a ceramic multilayer capacitor (MLCC) in the CL32A series. Key points:
- Capacitance: 107 → 100 µF
- Tolerance: M → ±20%
- Type: SMD MLCC (ceramic, typically Class II dielectric such as X7R/X5R)
- Voltage and exact footprint: encoded in the suffix; not specified here—check the manufacturer’s datasheet
- Typical use: decoupling and power-supply smoothing in compact electronic boards
For precise specs (dielectric, voltage rating, package size, temp range) you’ll need the official datasheet from the manufacturer.

Manufacturer

Manufacturer: Samsung Electro-Mechanics Co., Ltd. (South Korea).
What kind of company: A multinational electronics components maker, part of the Samsung Group, specializing in passive components such as chip inductors, capacitors, and filters used in mobile, consumer electronics, and automotive applications.

Application

CL32A107MPVNNNE is a high-capacitance multilayer ceramic capacitor (107 = 100 µF). Common application areas include:
- Decoupling and bulk energy storage for switching regulators (DC-DC converters) and VRMs
- Stabilizing core and I/O rails in mobile/consumer devices (phones, tablets, laptops, wearables)
- Smoothing and EMI filtering in automotive (ECUs, infotainment) and industrial control systems
- Short-term energy hold-up for microcontrollers and memories
- Filtering and bypassing in analog, mixed-signal, and RF front-ends
Note: voltage rating and ESR depend on the specific package; consult the datasheet.

Package

I can’t determine the package type from just the part number. Please provide the manufacturer or a data sheet link; the exact package (e.g., QFN, DFN, SOIC) is specified there.

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