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CSD95373AQ5M
+BOMIC SYNC BUCK NEXFET 12SON
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メーカーSTマイクロエレクトロニクス
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メーカー品番 #CSD95373AQ5M
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パッケージ LSON-CLIP (DQP)-12
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在庫状況6266
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive |
| Technology | Power MOSFET |
| Current-Output/Channel | 45A |
| Current-PeakOutput | 67A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 16V |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Status Flag |
| FaultProtection | Over Temperature, Shoot-Through, UVLO |
| MountingType | Surface Mount |
| Package/Case | 12-Power LFDFN |
概要
Description
Key features:
- Input voltage range: 4.5V to 16V
- High current capability: Up to 40A continuous
- Low RDS(on): Enhances efficiency (e.g., 1.8mΩ (high-side), 1.3mΩ (low-side)
- Switching frequency: Up to 2MHz
- Integrated bootstrap diode: Simplifies design
Applications include POL (point-of-load) converters, FPGA/ASIC power supplies, and high-current DC/DC converters. Its thermal-enhanced package ensures reliable operation under heavy loads.
For detailed specs, refer to the datasheet on TI’s website.
Pinout
Key Functions:
- Inputs (PWM, Enable, VIN): Controls switching and operation.
- Power Stage: Combines two MOSFETs (synchronous buck topology).
- Bootstrap (BOOT): Powers the high-side driver.
- PHASE Node: Connects to the inductor.
- VIN (4.5V–18V): Supply voltage range.
- Thermal Pad (GND): Enhances heat dissipation.
Designed for high-efficiency DC/DC converters, it simplifies power supply designs.
Application
- Voltage Regulator Modules (VRMs): For CPUs, GPUs, and ASICs in servers, PCs, and data centers.
- Point-of-Load (PoL) Converters: Efficient power delivery in telecom, networking, and industrial systems.
- Embedded Systems: Power management in automotive, medical, and IoT devices.
- High-Frequency DC-DC Converters: Optimized for compact, high-efficiency designs.
Its integrated MOSFET and driver reduce footprint and improve thermal performance, making it ideal for space-constrained, high-performance applications.