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CSD95378BQ5MC
+BOMIC SYNC BUCK NEXFET 12SON
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メーカーSTマイクロエレクトロニクス
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メーカー品番 #CSD95378BQ5MC
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パッケージ VSONCLIP-12
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在庫状況4222
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | NexFET™ |
| ProductStatus | Active |
| OutputConfiguration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| LoadType | Inductive |
| Technology | Power MOSFET |
| Current-Output/Channel | 60A |
| Current-PeakOutput | 90A |
| Voltage-Supply | 4.5V ~ 5.5V |
| Voltage-Load | 4.5V ~ 16V |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| Features | Bootstrap Circuit, Status Flag |
| FaultProtection | Current Limiting, Over Temperature, Shoot-Through, Short Circuit, UVLO |
| MountingType | Surface Mount |
| Package/Case | 12-PowerTFDFN |
概要
Description
The CSD95378BQ5MC is a NexFET™ Power Stage, which integrates a driver IC and a MOSFET pair into a single package. This integration is designed to optimize efficiency in power conversion, such as in point-of-load converters and other high-frequency, high-current applications. Key features typically include low on-resistance, fast switching speeds, and high efficiency, which help in reducing power losses and improving thermal performance.
These devices are often used in computing and telecom sectors where space and energy efficiency are critical. The compact QFN package helps save board space, making it a preferred choice for engineers looking to optimize the layout of their power delivery circuits. For specific technical details, consulting the manufacturer's datasheet is recommended.
Equivalent
Features
1. Integration: Combines a driver IC and MOSFETs in one package, optimizing performance and reducing design complexity.
2. Efficiency: Designed to deliver high efficiency with low switching and conduction losses.
3. Current Rating: Offers high current capability, suitable for applications requiring robust power handling.
4. Package: Available in a compact, space-saving package ideal for compact PCB designs.
5. Thermal Performance: Optimized for excellent thermal performance, allowing for improved reliability and power density.
6. Protection Features: Includes protection features like over-current protection (OCP) and thermal shutdown to enhance safety and reliability.
7. Applications: Suitable for use in high-performance digital computing, networking, and telecommunication systems where efficient power conversion is critical.
The device is geared towards applications that demand efficient power conversion and compact design, making it a preferred choice for engineers focused on high-performance power management solutions.
Pinout
The CSD95378BQ5MC comes in a 5 mm x 6 mm QFN package with a total of 15 pins. Its pin functions typically include:
1. VIN - Input voltage supply.
2. VDD - Power for internal control circuitry.
3. PGND - Power ground.
4. SW - Switching node, connected to the output inductor.
5. BOOT - Bootstrap capacitor connection for high-side gate drive.
6. PWM - PWM input from the controller.
7. VOUT - Output voltage sense.
8. EN - Enable input, used to turn the device on or off.
9. THERMAL PAD - Exposed pad for thermal management and ground connection.
Please consult the datasheet for precise pin configurations and functions, as this information is critical for proper implementation in a specific application.