EG4X20BG256

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EG4X20BG256

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  • メーカーAnlogic

  • メーカー品番 #EG4X20BG256

  • 在庫状況16728

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Manufacturer Anlogic
Package BGA-256

概要

Description

The EG4X20BG256 is a high-performance FPGA (Field-Programmable Gate Array) from Efinix, part of their Trion® series. Key features include:
- Logic Capacity: ~20K logic elements (LEs).
- Memory: 1.1 Mb embedded RAM.
- I/O Pins: 256-ball BGA package with flexible GPIO.
- Power Efficiency: Built on 16nm process, optimized for low power.
- Applications: IoT, edge computing, embedded vision, and consumer electronics.
It supports Efinix’s Quantum™ architecture, enabling fast reconfiguration and efficient resource utilization. The device is ideal for cost-sensitive, power-efficient designs requiring moderate logic density.
For detailed specs, refer to Efinix’s official documentation.

Equivalent

The EG4X20BG256 is a Lattice Semiconductor FPGA. Equivalent alternatives include:
- Lattice ECP5 (LFE5UM-85F-8BG256C)
- Xilinx Spartan-6 (XC6SLX25-2FTG256C)
- Intel (Altera) Cyclone IV (EP4CE22F17C6N)
These offer similar logic capacity, I/O counts, and package compatibility (256-pin BGA). For exact replacements, verify specs like speed grade, power, and features. Always check datasheets for compatibility.

Features

The EG4X20BG256 is a high-performance FPGA (Field-Programmable Gate Array) with the following key features:
- 256K Logic Cells: Offers ample resources for complex designs.
- 20K Embedded Memory Blocks: Supports high-speed data storage and retrieval.
- 4 High-Speed Serial Transceivers (up to 12.5 Gbps each): Ideal for high-bandwidth applications.
- 256-Pin BGA Package: Compact and suitable for space-constrained designs.
- Low Power Consumption: Optimized for energy efficiency.
- Advanced DSP Blocks: Enhances signal processing capabilities.
- Wide I/O Support: Includes LVDS, LVCMOS, and other standards.
- Robust Security Features: Bitstream encryption and anti-tamper protection.
Designed for applications like networking, industrial automation, and high-speed data processing.

Pinout

The EG4X20BG256 is a 256-pin FPGA from Efinix's Trion series, packaged in a BGA (Ball Grid Array).
### Key Functions:
- Logic Elements: ~20K (exact count varies by model).
- I/O Pins: Up to 179 user I/Os (supports LVCMOS, LVDS, and other standards).
- Memory: ~1 Mb embedded RAM.
- DSP Blocks: Supports basic DSP operations.
- Configuration: Supports SPI flash, JTAG, and other boot methods.
- Power: Typically operates at 1.2V core voltage with additional I/O banks.
### Applications:
Used in low-power, cost-sensitive designs like IoT, embedded systems, and consumer electronics.

Manufacturer

The EG4X20BG256 is a field-programmable gate array (FPGA) manufactured by Intel (formerly Altera). Intel is a leading multinational technology company specializing in semiconductor manufacturing, processors, and programmable logic devices.
Intel acquired Altera in 2015, integrating its FPGA technology into its product lineup. The EG4X20BG256 is part of Intel’s Cyclone IV E series, designed for low-cost, low-power applications in consumer electronics, industrial automation, and communications.
Intel is known for its innovation in computing hardware, including CPUs, GPUs, and FPGAs, serving industries like data centers, AI, and IoT.

Application

The EG4X20BG256 is a high-performance FPGA (Field-Programmable Gate Array) commonly used in:
1. Industrial Automation – Control systems, robotics, and real-time processing.
2. Communications – Networking equipment, 5G infrastructure, and signal processing.
3. Consumer Electronics – Smart devices, displays, and multimedia processing.
4. Automotive – ADAS (Advanced Driver Assistance Systems) and infotainment.
5. Aerospace & Defense – Radar, avionics, and secure communications.
6. Medical Devices – Imaging systems and diagnostic equipment.
Its reprogrammable nature and high-speed I/O make it versatile for embedded and high-reliability applications.

Package

The EG4X20BG256 is a 256-pin Ball Grid Array (BGA) package. BGA packages offer high-density connections with solder balls on the underside, making them suitable for compact, high-performance applications. The "256" indicates the number of pins, arranged in a grid pattern for efficient PCB mounting. This package type is commonly used in advanced integrated circuits like FPGAs or processors.

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