EN2340QI

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EN2340QI

+BOM

DC DC CONVERTER 0.75-5V 20W

  • メーカーアルテラ

  • メーカー品番 #EN2340QI

  • データシート EN2340QI DataSheet

  • 在庫状況22058

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Series Enpirion® 2300
PartStatus Obsolete
Type Non-Isolated PoL Module
NumberofOutputs 1
Voltage-Input(Min) 4.5V
Voltage-Input(Max) 14V
Voltage-Output1 0.75 ~ 5V
Current-Output(Max) 4A
Applications ITE (Commercial)
Features Remote On/Off, OCP, OTP, SCP, UVLO
OperatingTemperature -40°C ~ 85°C
Efficiency 95%
MountingType Surface Mount
Package/Case 68-BFQFN Exposed Pad, Module
Size/Dimension 0.43" L x 0.32" W x 0.12" H (11.0mm x 8.0mm x 3.0mm)
SupplierDevicePackage 68-QFN (11x8)
BaseProductNumber EN2340
ControlFeatures Enable, Active High

概要

Description

EN2340QI appears to be a course code, possibly for a class related to English, literature, or a specific academic discipline, though the specifics can vary by institution. An "Introduction to EN2340QI" would typically cover the main objectives, key topics, and structure of the course. This could involve an overview of the subject matter, such as literary analysis, historical contexts, critical theories, or specific themes relevant to the course's focus. Students might engage with various texts, participate in discussions, and develop skills in critical thinking and writing. The introduction would also likely outline assessment methods, such as essays, exams, or projects, and provide guidance on required readings and resources. If EN2340QI is a unique course code specific to a particular institution, checking the syllabus or academic catalog for detailed information would be recommended.

Equivalent

The EN2340QI is a step-down DC-DC converter from Intel's Enpirion product line. Equivalent products from other manufacturers with similar specifications may include:
1. Texas Instruments TPS82130
2. Analog Devices (formerly Linear Technology) LTM4623
3. Maxim Integrated (now part of Analog Devices) MAXM17532
4. Murata MYMGC2R53RELC
Ensure to check detailed specifications and pin compatibility to confirm suitability as a direct replacement.

Features

The EN2340QI is a Power System on Chip (PowerSoC) with several key features designed for efficient power management in electronic devices. It typically includes:
1. Integrated DC-DC Converter: Provides a step-down power conversion, delivering a constant voltage output with high efficiency.

2. Compact Design: The EN2340QI is known for its small footprint, making it ideal for space-constrained applications.
3. High Efficiency: Offers high power conversion efficiency, reducing power loss and heat generation.
4. Wide Input Voltage Range: Supports a broad range of input voltages, enhancing its versatility for different applications.
5. Fast Transient Response: Quickly reacts to changes in load, maintaining stable output voltage.
6. Built-in Protections: Features over-current, over-voltage, and thermal protection to safeguard against faults.
7. Simplified Design: With integrated components, it reduces the need for external parts, simplifying the design process.
8. Low-Noise Operation: Minimizes electromagnetic interference, making it suitable for noise-sensitive applications.
These features make the EN2340QI suitable for use in consumer electronics, telecommunications, and other applications requiring reliable and efficient power management.

Pinout

The EN2340QI is a high-efficiency, monolithic step-down DC-DC converter. It is designed to provide a compact and efficient power solution for applications requiring up to 2 A of output current. The device is housed in a compact package, typically with 24 pins, though the specific package variation can slightly alter the pin count.
Key functions of the EN2340QI include:
- Input Voltage Range: Supports a broad input range, typically between 2.375 V and 6.6 V.
- Output Voltage: Configurable via external resistors, allowing for flexibility in various applications.
- High Efficiency: Optimized for high efficiency across a wide load range.
- Integrated Inductor: Simplifies design and reduces system size.
- Protection Features: Includes over-current protection (OCP), thermal shutdown, and under-voltage lockout (UVLO).
The integration of key components on the chip minimizes the need for external components, facilitating a simpler and more compact PCB layout. This makes the EN2340QI suitable for space-constrained applications such as portable electronics and embedded systems. For precise details, always refer to the official datasheet provided by the manufacturer.

Manufacturer

The EN2340QI is manufactured by Intel. Intel is a multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest and most well-known semiconductor manufacturers, renowned for developing and producing a wide range of hardware components, including processors, integrated circuits, and various microelectronics. Intel's products are widely used in computers, servers, smartphones, and other electronic devices. The company is known for its innovation in semiconductor technology and plays a significant role in the global tech industry.

Application

The EN2340QI is a power management integrated circuit (PMIC) designed for various applications requiring efficient power regulation and management. It is commonly used in compact electronic devices due to its small size and high efficiency. Key application areas include:
1. Consumer Electronics: Smartphones, tablets, and wearable devices benefit from its efficient power management.
2. Telecommunications: It supports compact and efficient power solutions for networking equipment.
3. Industrial Automation: Used in control systems and various industrial applications requiring reliable power regulation.
4. IoT Devices: Ensures efficient power use in connected devices with limited space for components.
These applications leverage the EN2340QI's compact design, high efficiency, and advanced power management capabilities.

Package

The EN2340QI is a Power Management IC (PMIC) that comes in a compact Quad Flat No-Lead (QFN) package. This type of packaging is commonly used for its efficient thermal performance and small footprint, suitable for high-density electronic applications.

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