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FDMF5820DC
+BOMIC SPS HALF-BRIDGE DRVR 31PQFN
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メーカーオンセミコンダクター社
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メーカー品番 #FDMF5820DC
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データシート FDMF5820DC DataSheet
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パッケージ PQFN-31
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在庫状況3557
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package / Case | Tape & Reel (TR),Cut Tape (CT),Bulk |
| Series | PowerTrench®, SyncFET™ |
| Part Status | Active |
| Output Configuration | Half Bridge |
| Applications | Synchronous Buck Converters |
| Interface | PWM |
| Load Type | Inductive |
| Technology | UMOS |
| Rds On (Typ) | 470mOhm LS, 680mOhm HS |
| Current - Output / Channel | 60A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 16V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Features | Bootstrap Circuit, Latch Function, Status Flag |
| Fault Protection | Over Temperature, UVLO |
| Mounting Type | Surface Mount |
概要
Description
The FDMF5820DC is part of a broader family of power stage solutions, often featuring integrated protection mechanisms like over-current and thermal protection, ensuring reliability and longevity. Its compact design helps reduce the footprint on a PCB, allowing for more efficient use of space and easier thermal management. Overall, the FDMF5820DC offers a combination of efficiency, integration, and performance that is crucial for modern electronics requiring high power density and reliability.
Equivalent
1. Texas Instruments' CSD87350Q5D
2. Infineon's IRF6811MTRPBF
3. ON Semiconductor's FDMF3035 or FDMF3030
4. Renesas' RAA220001 or RAA220002
It's important to verify electrical and thermal characteristics to ensure compatibility for your specific application. Always refer to the datasheets for detailed specifications.
Features
1. Integration: Combines a driver IC with N-channel MOSFETs, providing a compact and efficient solution for power management.
2. Efficiency: Offers high efficiency with minimized switching and conduction losses due to its optimized design and advanced MOSFET technology.
3. Current Capability: Supports high current loads with a low on-resistance, making it suitable for power-intensive applications.
4. Thermal Performance: Enhanced thermal characteristics reduce heat dissipation, thus improving reliability in high-temperature environments.
5. Protection Features: Includes integrated protection mechanisms such as under-voltage lockout (UVLO), over-current protection (OCP), and thermal shutdown to enhance system safety.
6. Ease of Use: Simplifies design with its integrated features, reducing the component count and saving PCB space.
7. Applications: Ideal for use in computing, telecommunications, and other applications requiring high-efficiency power conversion.
This module is targeted at designers seeking a reliable, space-saving solution for power delivery systems.
Pinout
Manufacturer
Application
1. Server and Data Center Power Supplies: It supports high-performance processing units requiring efficient power delivery.
2. Telecommunications Equipment: Provides stable power to telecom infrastructure.
3. Graphics Cards and GPUs: Facilitates efficient power management for high-end graphics.
4. Desktop and Laptop Motherboards: Ensures reliable and efficient power supply to CPUs and other components.
5. Networking Devices: Used in routers and switches for effective power regulation.
These applications benefit from its compact design, high switching frequency, and improved thermal performance.