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FM33256B-GTR
+BOMIC PROCESSOR COMPANION 14SOIC
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メーカーオーラセミ社
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メーカー品番 #FM33256B-GTR
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データシート FM33256B-GTR DataSheet
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パッケージ PG-DSO-14
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在庫状況2956
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tape & Reel (TR) |
| ProductStatus | Last Time Buy |
| Type | Processor Companion |
| Applications | Processor-Based Systems |
| MountingType | Surface Mount |
| Package/Case | 14-SOIC (0.154, 3.90mm Width) |
概要
Description
An introduction to FM33256B-GTR would entail describing its purpose, specifications, and applications. For instance, if it's an electronic component, the introduction might cover its electrical characteristics, compatibility, and use cases. In a manufacturing context, it could describe the component's role in a larger assembly, material composition, and operational parameters. Understanding the specific industry and function of FM33256B-GTR is crucial for a relevant introduction. For more detailed information, consulting technical manuals, product datasheets, or industry-specific documentation would be necessary.
Equivalent
Features
1. Memory Capacity: 32Kb (4K x 8) of memory, providing a reliable storage solution with fast access times.
2. Non-Volatility: Retains data without power, ensuring data persistence similar to traditional EEPROM or Flash, but with faster write speeds.
3. High Endurance: Supports virtually unlimited read/write cycles (typically 10^14), significantly outperforming EEPROM and Flash, making it ideal for applications requiring frequent and repeated writes.
4. Fast Access Time: Read and write cycle times are symmetric and can occur as quickly as 70ns, allowing for rapid data processing.
5. Low Power Consumption: Operates at a low voltage supply, typically 3.3V, making it energy efficient.
6. Data Integrity: Offers reliable data retention over many years, suitable for mission-critical applications.
7. Package Type: Available in a compact TSSOP package, allowing for easy integration in space-constrained designs.
These features make the FM33256B-GTR suitable for a range of applications, including industrial control, automotive systems, and any application requiring high-reliability data storage with frequent updates.
Pinout
1. /CE (Chip Enable): Activates the device when low.
2. /WE (Write Enable): Controls write operations, active low.
3. /OE (Output Enable): Enables data output when low.
4. A0-A14 (Address Inputs): Selects one of the 32,768 storage locations.
5. DQ0-DQ7 (Data I/O): Bi-directional data bus for reading and writing data.
6. VSS (Ground): Ground reference for the device.
7. VDD (Power Supply): Power supply pin for the device's operation.
This functional pin configuration allows the FM33256B-GTR to perform read and write operations like a standard SRAM but with the benefit of data retention without power.