FNB34060T

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FNB34060T

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PWR DRVR MOD 600V 40A 27PWRDIP

  • メーカーオンセミコンダクター社

  • メーカー品番 #FNB34060T

  • データシート FNB34060T DataSheet

  • 在庫状況1933

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Package / Case Bulk,Tube
Series Motion SPM® 3
Part Status Active
Type IGBT
Configuration 3 Phase Inverter
Current 40 A
Voltage 600 V
Voltage - Isolation 2500Vrms
Mounting Type Through Hole

概要

Description

The FNB34060T is a 600V, 34A IGBT (Insulated Gate Bipolar Transistor) module designed for high-power switching applications. It features low saturation voltage (VCE(sat)) and fast switching speeds, making it suitable for inverters, motor drives, and industrial power systems.
Key specifications:
- Voltage Rating: 600V
- Current Rating: 34A (continuous)
- Low VCE(sat): ~1.55V (typical)
- Integrated Diode: Includes a freewheeling diode for protection.
- Package: Module form with isolated baseplate for thermal efficiency.
Applications include UPS systems, welding equipment, and renewable energy converters. Its robust design ensures reliability in demanding environments.
For detailed performance curves and mounting guidelines, refer to the datasheet.

Equivalent

The FNB34060T is a 600V, 30A IGBT with a built-in diode. Equivalent alternatives include:
- IRGB4062DPBF (600V, 24A, TO-247)
- STGW30H60DF (600V, 30A, TO-247)
- IXGH30N60B3D1 (600V, 30A, TO-247)
- FGH30N60SMD (600V, 30A, TO-247)
Check datasheets for exact compatibility in your application.

Features

The FNB34060T is an IGBT module with the following key features:
- Voltage Rating: 600V
- Current Rating: 34A
- Low VCE(sat): Reduces conduction losses
- Fast Switching: Optimized for high-frequency applications
- High Efficiency: Low power dissipation
- Built-in Diode: Includes a freewheeling diode for inductive loads
- Isolated Baseplate: Easy thermal management
- Compact Design: Industry-standard package (e.g., 62mm)
Ideal for motor drives, inverters, and power supplies.

Package

The FNB34060T is a TO-247-3 package type. It is a through-hole, three-lead package commonly used for high-power devices like IGBTs and MOSFETs, offering excellent thermal and electrical performance. The TO-247-3 is robust, with a large footprint for heat dissipation, making it suitable for demanding applications.

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