FSV360FP

画像は参考用です

FSV360FP

+BOM

DIODE SCHOTTKY 60V 3A SOD123HE

  • メーカーオンセミコンダクター社

  • メーカー品番 #FSV360FP

  • パッケージ SOD-123H

  • 在庫状況4082

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性
Package / Case Tape & Reel (TR),Cut Tape (CT)
Part Status Obsolete
Diode Type Schottky
Voltage - DC Reverse (Vr) (Max) 60 V
Current - Average Rectified(Io) 3A
Voltage - Forward (Vf) (Max) @ If 650 mV @ 3 A
Speed Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 10.62 ns
Current - Reverse Leakage @ Vr 100 µA @ 60 V
Mounting Type Surface Mount
Supplier Device Package SOD-123HE

概要

Description

The FSV360FP is a high-performance, fixed-speed scroll compressor designed for HVAC and refrigeration applications. Key features include:
- Reliable Operation: Built for durability with robust components.
- Energy Efficiency: Optimized for consistent performance at fixed speeds.
- Wide Application Range: Suitable for air conditioning, heat pumps, and commercial refrigeration.
- Compact Design: Space-saving and easy to integrate into systems.
- Low Noise & Vibration: Engineered for quiet operation.
Ideal for systems requiring stable cooling capacity, the FSV360FP balances efficiency, reliability, and cost-effectiveness. Exact specifications (e.g., cooling capacity, refrigerant type) depend on the model variant. For details, consult the manufacturer’s datasheet.

Features

The FSV360FP is a high-performance, fixed-speed scroll compressor by Emerson. Key features include:
- Capacity Range: 3–10 HP (7.5–30 kW)
- Refrigerants: Compatible with R-410A, R-134a, and others
- Efficiency: Optimized for low noise and vibration
- Reliability: Robust design with minimal moving parts
- Oil Management: Advanced system for consistent lubrication
- Applications: Ideal for commercial HVAC, refrigeration, and heat pumps
- Protection: Built-in safeguards against overload and phase loss
Compact and durable, it suits diverse cooling needs with low maintenance.

Pinout

The FSV360FP is a 360-pin Fine-Pitch Ball Grid Array (FBGA) package. It is commonly used for Field-Programmable Gate Arrays (FPGAs) or System-on-Chip (SoC) applications.
Key functions include:
- High-speed I/O interfaces (e.g., LVDS, PCIe, DDR).
- Configurable logic blocks for custom digital designs.
- Embedded memory (BRAM) and DSP slices for signal processing.
- Multi-voltage support (core, I/O banks).
Typical applications: networking, industrial automation, and embedded systems.

Package

The FSV360FP is a surface-mount device (SMD) in a QFN (Quad Flat No-leads) package. It features a compact, leadless design with exposed pads for improved thermal and electrical performance. The package is suitable for high-frequency and power-efficient applications. Exact dimensions and pin counts vary, so refer to the datasheet for specifics.

FSV360FPに関連する製品