仕様
| 属性 | 値 |
| Supplier | GigaDevice Semiconductor (HK) Limited |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 1Mb (128K x 8) |
| Memory Interface | SPI - Dual I/O |
| Clock Frequency | 100 MHz |
| Write Cycle Time - Word Page | 50µs, 4ms |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
概要
Description
GD25D10CEIGR is a 1‑Mbit serial flash memory from GigaDevice (GD25D10C), packaged in an 8‑pin device (EIGR variant). It stores code and data with an SPI interface, suitable for firmware storage, bootloaders, or small data logging.
Key points:
- Density and organisation: 1 Mbit (128 KB), accessed via 3-byte addressing for reads/writes.
- Interface: SPI-compatible, with standard read, fast read, write enable/disable, and erase commands.
- Erase/Program: Page program (commonly 256 bytes), sector/block/chip erase options.
- Voltage and temp: typically 2.7–3.6 V operation; industrial temperature range (-40°C to +85°C).
- Package: 8‑pin small outline package (SOP) in the EIGR variant.
Note: exact opcodes, timing, endurance, and voltage details are specified in the latest datasheet; verify the specifics for your design.
Key points:
- Density and organisation: 1 Mbit (128 KB), accessed via 3-byte addressing for reads/writes.
- Interface: SPI-compatible, with standard read, fast read, write enable/disable, and erase commands.
- Erase/Program: Page program (commonly 256 bytes), sector/block/chip erase options.
- Voltage and temp: typically 2.7–3.6 V operation; industrial temperature range (-40°C to +85°C).
- Package: 8‑pin small outline package (SOP) in the EIGR variant.
Note: exact opcodes, timing, endurance, and voltage details are specified in the latest datasheet; verify the specifics for your design.
Equivalent
Equivalent parts (1 Mb SPI Serial Flash, 2.7–3.6V, 8-pin SOIC):
- Winbond: W25Q10BV / W25Q10D
- Macronix: MX25D10 / MX25L10
- Spansion/Cypress: S25FL010K
- ISSI: IS25LP010
- Microchip/Atmel: AT25DF010
- EON: EN25Q10
- SST: SST25LF010
Note: all are 1 Mb SPI flashes with similar package and voltage; verify timing, quad-SPI support, and die revisions for exact drop-in use.
- Winbond: W25Q10BV / W25Q10D
- Macronix: MX25D10 / MX25L10
- Spansion/Cypress: S25FL010K
- ISSI: IS25LP010
- Microchip/Atmel: AT25DF010
- EON: EN25Q10
- SST: SST25LF010
Note: all are 1 Mb SPI flashes with similar package and voltage; verify timing, quad-SPI support, and die revisions for exact drop-in use.
Features
Key features of GD25D10CEIGR (1 Mbit SPI Serial Flash):
- 1 Mbit capacity with SPI serial interface
- 2.7–3.6 V operation (single supply)
- 3-byte addressing for memory access
- 256-byte page programming
- Erase options: 4 KB sectors and 64 KB blocks
- Write Enable/Disable, Status Register with WIP and protection bits
- Fast read mode (up to about 50 MHz typical)
- Low power with standby and deep-power-down modes
- 8-pin package (EIGR variant), RoHS compliant
- Industrial temperature range: approx. -40°C to +85°C
Note: exact timings and block/sector structure can vary by revision; please consult the datasheet for precise specs.
- 1 Mbit capacity with SPI serial interface
- 2.7–3.6 V operation (single supply)
- 3-byte addressing for memory access
- 256-byte page programming
- Erase options: 4 KB sectors and 64 KB blocks
- Write Enable/Disable, Status Register with WIP and protection bits
- Fast read mode (up to about 50 MHz typical)
- Low power with standby and deep-power-down modes
- 8-pin package (EIGR variant), RoHS compliant
- Industrial temperature range: approx. -40°C to +85°C
Note: exact timings and block/sector structure can vary by revision; please consult the datasheet for precise specs.
Pinout
- Pin count: 8 pins (standard 8-pin SPI serial flash, e.g., SOIC-8)
- Pin functions (pin1 to pin8):
1. CS# (Chip Select)
2. DO / MISO (Data Out)
3. WP# (Write Protect)
4. GND
5. DI / MOSI (Data In)
6. CLK (Serial Clock)
7. HOLD#
8. VCC (Power)
- Pin functions (pin1 to pin8):
1. CS# (Chip Select)
2. DO / MISO (Data Out)
3. WP# (Write Protect)
4. GND
5. DI / MOSI (Data In)
6. CLK (Serial Clock)
7. HOLD#
8. VCC (Power)
Manufacturer
- Manufacturer: GigaDevice Semiconductor Inc. (GigaDevice)
- What kind of company: A Chinese fabless semiconductor company that designs flash memory and microcontroller products and outsources fabrication to foundries.
- What kind of company: A Chinese fabless semiconductor company that designs flash memory and microcontroller products and outsources fabrication to foundries.
Application
GD25D10CEIGR is a 1 Mbit SPI serial flash memory (8-pin package) from GigaDevice. Common application areas:
- Boot code and firmware storage for microcontrollers
- External program/data memory for MCUs lacking internal flash
- Firmware update and patch storage
- Data logging and sensor data storage in IoT/industrial devices
- Configuration, calibration, and parameter storage
- Lookup tables, fonts/icons, and small asset storage in consumer electronics
- Used in automotive, networking, and other embedded systems requiring compact, non-volatile storage
- Boot code and firmware storage for microcontrollers
- External program/data memory for MCUs lacking internal flash
- Firmware update and patch storage
- Data logging and sensor data storage in IoT/industrial devices
- Configuration, calibration, and parameter storage
- Lookup tables, fonts/icons, and small asset storage in consumer electronics
- Used in automotive, networking, and other embedded systems requiring compact, non-volatile storage
Package
8-pin SOP (SOIC-8) package, RoHS-compliant.
