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GD25LQ256DWIGR
+BOMIC FLASH 256MBIT SPI/QUAD 8WSON
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メーカーギガデバイス・セミコンダクター(香港)リミテッド
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メーカー品番 #GD25LQ256DWIGR
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パッケージ 8-WDFN Exposed Pad
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在庫状況7605
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Not For New Designs |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 256Mb (32M x 8) |
| MemoryInterface | SPI - Quad I/O |
| ClockFrequency | 120 MHz |
| WriteCycleTime-WordPage | 2.4ms |
| Voltage-Supply | 1.65V ~ 2V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 8-WDFN Exposed Pad |
概要
Description
With a wide operating temperature range and robust data retention capabilities, the GD25LQ256DWIGR is well-suited for a variety of applications, including consumer electronics, industrial devices, and other embedded systems. Its compact package design makes it easy to integrate into space-constrained applications. Key features also include fast read and write capabilities, security enhancements, and durability with a high write/erase cycle count. Overall, this memory chip offers a reliable solution for developers looking to implement non-volatile memory in their projects.
Equivalent
1. Winbond W25Q256JW: A widely compatible 256 Mbit NOR Flash chip.
2. Micron MT25QL256ABA: Offers similar features and specifications.
3. Cypress S25FL256L: Another 256 Mbit NOR Flash with comparable performance.
4. Macronix MX25L25645G: A similar 256 Mbit NOR Flash memory chip.
These chips generally offer similar features like SPI interface and similar storage capacity. Always verify pin compatibility and specific electrical characteristics for replacements.
Features
1. Density: 256 Mbit (32 MB).
2. Interface: Supports SPI (Serial Peripheral Interface) protocols, including Dual/Quad SPI for faster data transfer.
3. Performance: High-speed read capabilities up to 133 MHz.
4. Voltage: Operates at a wide voltage range from 2.7V to 3.6V.
5. Security: Equipped with security features such as block protection, hardware-based Write Protection, and a unique ID for secure applications.
6. Endurance: Offers robust data retention and endurance, suitable for industrial applications.
7. Package: Typically available in compact WSON packages, making it suitable for space-constrained designs.
8. Other Features: Supports advanced power management modes to save energy, and fast programming/erase times.
These features make it ideal for applications requiring reliable and efficient flash memory solutions, such as embedded systems, consumer electronics, and automotive systems.
Pinout
1. CS# (Chip Select): Activates the device when pulled low.
2. SO (Serial Output): Outputs data on this pin during read operations.
3. WP# (Write Protect): Used to protect certain areas of the memory from being overwritten.
4. VSS (Ground): Ground reference for power supply.
5. SI (Serial Input): Inputs data during write operations.
6. SCK (Serial Clock): Provides the clock signal for synchronizing data transfers.
7. HOLD#: Temporarily pauses serial communication without resetting the device.
8. VCC (Power Supply): Supplies the power for the device.
This configuration allows the GD25LQ256DWIGR to integrate easily into systems for applications such as firmware storage and data logging, utilizing the SPI (Serial Peripheral Interface) protocol.
Manufacturer
Application
1. Consumer Electronics: Utilized in devices like smart TVs, set-top boxes, and digital cameras for firmware storage.
2. Industrial Equipment: Used in control systems and automation equipment for data logging and program storage.
3. Automotive Systems: Supports infotainment systems, navigation, and other in-car electronics.
4. Networking Devices: Employed in routers, switches, and modems for firmware and configuration data.
5. IoT Devices: Provides storage for firmware updates and data logging in connected devices.
These applications leverage its low power consumption, fast read/write capabilities, and wide temperature range.