H26M41204HPR

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H26M41204HPR

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8GB FBGA-153 Specialized Memory Products RoHS

365 日間品質保証

7*24 日間の品質保証

90-時間単位のサービス保証

1日間のアフターサービス保証

仕様

属性 値
Packaging FBGA-153
Memory Size 8GB
Operating Temperature -25℃~+85℃

概要

Equivalent

The H26M41204HPR is a 4Gb (512MB) DDR3L SDRAM chip from SK Hynix. Equivalent alternatives include:
- Micron: MT41K256M16TW-107 (4Gb DDR3L)
- Samsung: K4B4G1646E-BCMA (4Gb DDR3L)
- Nanya: NT5CC256M16EP-EK (4Gb DDR3L)
Ensure compatibility with voltage (1.35V/1.5V), speed (e.g., 1600MHz), and pin configuration before substitution. Always verify datasheets for exact matches.

Features

The H26M41204HPR is a high-performance NAND flash memory chip with the following key features:
- Capacity: 4Gb (512MB)
- Interface: Asynchronous NAND
- Organization: 2KB + 64B per page, 128 pages per block
- Voltage: 3.3V operation
- Speed: Fast read/write performance
- Endurance: High reliability with robust error correction
- Package: Industry-standard TSOP48
- Applications: Embedded systems, storage devices, industrial electronics
Designed for efficiency and durability, it supports advanced flash management techniques.

Manufacturer

The H26M41204HPR is a NAND flash memory chip manufactured by SK Hynix, a South Korean semiconductor company. SK Hynix is a major global player in memory technology, specializing in DRAM, NAND flash, and other advanced memory solutions. The company is known for supplying components to electronics manufacturers worldwide, including smartphones, SSDs, and enterprise storage systems.
For precise specifications, refer to SK Hynix's official datasheets or product documentation.

Package

The H26M41204HPR is a BGA (Ball Grid Array) package type. It features a 144-ball configuration with a 12mm x 12mm footprint, commonly used for high-density memory applications like NAND flash storage. The BGA design ensures compact size and reliable electrical connections.

Frequently Asked Questions


Q: Is the memory component in FBGA-153 package compatible with standard NAND flash interfaces?
A: Yes, the FBGA-153 package is standard for embedded NAND storage, ensuring compatibility with common controller interfaces.


Q: What is the typical application for this 8GB H26M41204HPR?
A: It is ideal for eMMC or similar embedded storage in mobile devices, IoT modules, and industrial computing where space is constrained.


Q: Can this component operate reliably in harsh thermal environments?
A: Yes, with a rated temperature range of -25°C to +85°C, it supports industrial-grade applications with moderate thermal stress.


Q: Does the -25°C minimum temperature limit cold start performance?
A: No, the component is specified for full functionality down to -25°C, enabling reliable cold start in outdoor or unheated equipment.


Q: Is this memory size suitable for high-resolution boot or firmware storage?
A: Yes, 8GB capacity is sufficient for operating system images, firmware, and application data in many embedded systems.


Q: What is the supply voltage range required for this HYNIX memory?
A: Please refer to the official datasheet; specific voltage ratings are not provided in the given parameters but typical NAND flash uses 2.7V-3.6V.


Q: Are there any known cross-compatibility issues with different NAND controllers?
A: As an industry-standard FBGA-153 part, it generally works with most controllers, but verifying the controller’s supported NAND geometry is recommended.


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