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HMC361S8G
+BOMIC FREQ DIVIDER DC-10GHZ 8SOIC
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メーカーテキサス・インスツルメンツ
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メーカー品番 #HMC361S8G
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データシート HMC361S8G DataSheet
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パッケージ SOIC-8
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在庫状況2396
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Strip |
| ProductStatus | Active |
| Function | Prescaler |
| Frequency | 0Hz ~ 10GHz |
| RFType | General Purpose |
| SecondaryAttributes | Divide by 2 |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) Exposed Pad |
概要
Description
Key features of the HMC361S8G include a wide operating frequency range, low phase noise, and high input sensitivity, which ensure reliable performance across various applications. It operates within a typical frequency range of DC - 13 GHz, making it suitable for both commercial and military applications.
The HMC361S8G is housed in an 8-lead surface-mount package (S8G), which enhances its ease of integration into compact designs. The low phase noise characteristic is crucial for maintaining signal integrity in high-frequency applications, such as signal processing, satellite communication, and radar systems.
Overall, the HMC361S8G is a robust and efficient solution for frequency division, contributing to the advancement of modern communication technologies.
Equivalent
1. Analog Devices HMC394: Offers similar frequency division capabilities.
2. Mini-Circuits RPD Series: Provides a range of frequency dividers with comparable performance.
3. Peregrine Semiconductor PE9301: Another frequency divider option with similar specifications.
When selecting an equivalent, ensure to verify the frequency range, power requirements, and package compatibility with your specific application.
Features
1. Frequency Range: Operates within a broad frequency range from 3.0 GHz to 12.0 GHz.
2. Division Ratio: Fixed divide-by-2 operation, making it suitable for frequency division in high-frequency applications.
3. Output Power: Provides a consistent output power level, typically around 0 dBm.
4. Single Supply Voltage: Operates on a single positive supply voltage, simplifying power supply requirements.
5. Low Power Consumption: Consumes low DC power, making it efficient for battery-operated devices.
6. RF Input Power: Can handle a wide range of input power levels, typically from -10 dBm to +10 dBm.
7. Package: Available in an 8-lead SOIC package, which is compact and easy to integrate into various designs.
8. Temperature Range: Operates over a broad temperature range, suitable for industrial applications.
These features make the HMC361S8G a versatile component for use in communication systems, radar, and other RF signal processing applications.
Pinout
1. Pin 1 (Vcc): Power supply pin. Typically requires a DC voltage of around 3V to 5V.
2. Pin 2 (GND): Ground connection.
3. Pin 3 (IN): RF input pin where the signal to be divided is applied.
4. Pin 4 (GND): Ground connection, often to provide a low-impedance path for RF.
5. Pin 5 (OUT): RF output pin that provides the divided frequency signal.
6. Pin 6 (GND): Ground connection.
7. Pin 7 (N/C): No connection, often used for mechanical stability.
8. Pin 8 (Vcc): Power supply pin, similar to Pin 1.
This IC is useful in applications requiring frequency division, maintaining low phase noise and wide bandwidth. It is typically used in communication systems, frequency synthesizers, and test equipment.
Manufacturer
Application
1. Wireless Infrastructure: Employed in base stations for frequency conversion tasks.
2. Test and Measurement Equipment: Utilized in RF test setups for signal analysis.
3. Military and Aerospace: Used in communication systems for secure and reliable frequency translation.
4. Microwave Radio Systems: Aids in up/down conversion in point-to-point and point-to-multipoint radios.
5. Satellite Communication: Facilitates frequency mixing in satellite transceivers.
6. Instrumentation: Applied in RF signal processing equipment.
Its broad frequency range and versatility make it suitable for these demanding applications.