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IS21ES08GA-JCLI-TR
+BOMIC FLASH 64GBIT EMMC 153VFBGA
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メーカーISSI, インテグレーテッド・シリコン・ソリューションズ株式会社
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メーカー品番 #IS21ES08GA-JCLI-TR
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在庫状況8728
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| PartStatus | Active |
| DigiKeyProgrammable | Not Verified |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (MLC) |
| MemorySize | 64Gbit |
| MemoryOrganization | 8G x 8 |
| MemoryInterface | eMMC |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 153-VFBGA |
| SupplierDevicePackage | 153-VFBGA (11.5x13) |
| BaseProductNumber | IS21ES08 |
概要
Description
The model outputs from IS21ES08GA-JCLI-TR help researchers analyze future climate conditions, assess risks, and inform climate-related policies. It includes projections related to temperature increases, precipitation patterns, and extreme weather events, contributing to a better understanding of climate dynamics under different greenhouse gas concentration pathways.
The findings from this experiment are crucial for scientists, policymakers, and stakeholders involved in climate adaptation and mitigation strategies, aiding in the development of resilient and sustainable solutions in response to a changing climate.
Equivalent
1. IS61WV25616BLL - 256K x 16-bit SRAM
2. MCM62V2000 - 2M x 8-bit SRAM
3. CY7C128 - 128K x 8-bit SRAM
4. MT48LC4M16A2 - 4M x 16-bit DRAM (with different characteristics)
Ensure compatibility in terms of voltage, access speed, and package type when selecting alternatives.
Features
Key features include:
- Memory Configuration: 1MB of memory organized as 1M x 8 bits.
- Interface: Supports a parallel interface for ease of integration.
- Low Power Consumption: Ideal for battery-operated devices, with a deep power-down mode.
- Page Programming: Allows for efficient data writing and erasing, enabling quick updates.
- Temperature Range: Operates effectively over a wide temperature range, suitable for various environments.
- Packages: Available in compact packages, facilitating space-saving designs.
This chip is designed for reliability and endurance, making it a solid choice for applications requiring non-volatile data storage.
Pinout
1. Address Inputs (A0-A2): These are used to select the memory address.
2. Data Inputs/Outputs (D0-D7): These pins are used for data input and output.
3. Chip Enable (CE): Activates the chip for read or write operations.
4. Write Enable (WE): Controls write operations. When low, data is written to the memory.
5. Output Enable (OE): Controls the output buffer. When low, the data at the addressed location is output.
6. VCC: Power supply pin.
7. GND: Ground reference pin.
The component is typically used in applications requiring fast access time and low power consumption.