仕様
| 属性 | 値 |
| Package / Case | Tray |
| Part Status | Not For New Designs |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR2 |
| Memory Size | 512Mb (32M x 16) |
| Memory Interface | Parallel |
| Clock Frequency | 400 MHz |
| Write Cycle Time - Word Page | 15ns |
| Access Time | 400 ps |
| Voltage - Supply | 1.7V ~ 1.9V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
概要
Description
The IS43DR16320D-25DBLI is a 512 Megabit (32M x 16) DDR3 DRAM memory chip, manufactured by Integrated Silicon Solution, Inc. (ISSI). It operates with a data rate of 800 MT/s (Megatransfers per second) and boasts a CL3 latency, providing efficient high-speed data transfer suitable for a variety of applications. The "-25DBLI" designation indicates the specific speed grade and temperature range; it typically signifies a 2.5 ns cycle time and industrial temperature range, which is -40°C to +85°C. This DRAM chip uses a 1.5V power supply, enhancing energy efficiency compared to earlier DDR2 standards.
The chip's architecture supports 8 banks of memory, allowing for improved parallel processing capabilities, which is beneficial in systems that require multitasking or handling large data sets. It is commonly used in applications such as networking, telecommunications, automotive, and industrial systems where reliable and fast memory access is critical. The IS43DR16320D-25DBLI is compatible with standard DDR3 interfaces, making it easier to integrate into existing systems that require memory upgrades or replacements.
The chip's architecture supports 8 banks of memory, allowing for improved parallel processing capabilities, which is beneficial in systems that require multitasking or handling large data sets. It is commonly used in applications such as networking, telecommunications, automotive, and industrial systems where reliable and fast memory access is critical. The IS43DR16320D-25DBLI is compatible with standard DDR3 interfaces, making it easier to integrate into existing systems that require memory upgrades or replacements.
Equivalent
The IS43DR16320D-25DBLI is a DDR2 SDRAM chip. Equivalent products would include those with similar specifications such as the Micron MT47H128M16, Samsung K4T1G164QF, and Hynix HY5PS1G1631. These equivalents should have similar memory sizes, speeds, and form factors to be compatible in most applications. Always verify the specific requirements and compatibility with your system before making substitutions.
Features
The IS43DR16320D-25DBLI is a DRAM (Dynamic Random Access Memory) module characterized by several features:
1. Type and Architecture: It is a DDR2 SDRAM, known for its double data rate and synchronous dynamic RAM capabilities.
2. Capacity: This module has a capacity of 512 Mb, organized as 32 Meg x 16 bits.
3. Speed and Performance: It operates at a clock speed of 400 MHz, translating to a data rate of 800 MT/s (Megatransfers per second). The "25" in the part number indicates a CAS latency of 2.5.
4. Voltage: The operating voltage for this module is 1.8V, which is standard for DDR2 SDRAMs.
5. Package: It comes in a 84-ball FBGA (Fine-Pitch Ball Grid Array) package, which is compact and suitable for high-density applications.
6. Temperature Range: It is designed to function in industrial temperature ranges, specifically from -40°C to 85°C, making it suitable for robust environmental conditions.
These features make it ideal for applications requiring moderate memory capacity with efficient performance over a wide range of temperatures.
1. Type and Architecture: It is a DDR2 SDRAM, known for its double data rate and synchronous dynamic RAM capabilities.
2. Capacity: This module has a capacity of 512 Mb, organized as 32 Meg x 16 bits.
3. Speed and Performance: It operates at a clock speed of 400 MHz, translating to a data rate of 800 MT/s (Megatransfers per second). The "25" in the part number indicates a CAS latency of 2.5.
4. Voltage: The operating voltage for this module is 1.8V, which is standard for DDR2 SDRAMs.
5. Package: It comes in a 84-ball FBGA (Fine-Pitch Ball Grid Array) package, which is compact and suitable for high-density applications.
6. Temperature Range: It is designed to function in industrial temperature ranges, specifically from -40°C to 85°C, making it suitable for robust environmental conditions.
These features make it ideal for applications requiring moderate memory capacity with efficient performance over a wide range of temperatures.
Manufacturer
The IS43DR16320D-25DBLI is manufactured by ISSI, Integrated Silicon Solution, Inc. ISSI is a technology company that specializes in designing and developing high-performance integrated circuits. Their products primarily focus on the automotive, communications, industrial, and medical markets. The company's offerings include a wide range of memory products, such as DRAM, SRAM, and NOR Flash, as well as analog and mixed-signal integrated circuits. ISSI is known for providing solutions that are reliable, have long product life cycles, and meet the stringent quality requirements of their target industries.
Application
The IS43DR16320D-25DBLI is a 512Mb DDR2 SDRAM memory chip commonly used in various applications requiring high-speed data processing and storage. Key application areas include:
1. Consumer Electronics: Used in devices like digital TVs, set-top boxes, and gaming consoles for efficient data handling.
2. Networking Equipment: Integral in routers and switches to support data traffic management and buffering.
3. Computing Devices: Utilized in laptops, desktops, and servers to enhance memory capacity and performance.
4. Industrial Systems: Employed in automation and control systems for reliable data processing.
5. Embedded Systems: Supports various applications in automotive systems and IoT devices for improved processing capabilities.
1. Consumer Electronics: Used in devices like digital TVs, set-top boxes, and gaming consoles for efficient data handling.
2. Networking Equipment: Integral in routers and switches to support data traffic management and buffering.
3. Computing Devices: Utilized in laptops, desktops, and servers to enhance memory capacity and performance.
4. Industrial Systems: Employed in automation and control systems for reliable data processing.
5. Embedded Systems: Supports various applications in automotive systems and IoT devices for improved processing capabilities.
Package
The IS43DR16320D-25DBLI is a DRAM chip with a Fine-Pitch Ball Grid Array (FBGA) package type.