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IS43LD32320C-18BLI
+BOMIC DRAM 1GBIT PARALLEL 134TFBGA
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メーカーISSI, インテグレーテッド・シリコン・ソリューションズ株式会社
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メーカー品番 #IS43LD32320C-18BLI
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データシート IS43LD32320C-18BLI DataSheet
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パッケージ BGA-134
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在庫状況1381
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package / Case | Tray |
| Part Status | Active |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR2-S4 |
| Memory Size | 1Gb (32M x 32) |
| Memory Interface | Parallel |
| Clock Frequency | 533 MHz |
| Write Cycle Time - Word Page | 15ns |
| Voltage - Supply | 1.14V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
概要
Description
The IS43LD32320C-18BLI is typical in applications like mobile devices, portable electronics, and other embedded systems, where efficient power usage without sacrificing performance is crucial. Its package type is often a TSOP (Thin Small Outline Package), which allows for a compact design, making it ideal for space-constrained applications. It provides the necessary features for systems that demand rapid access to data while maintaining low energy consumption.
Equivalent
Features
1. Density and Organization: It offers a 512Mb memory organized as 32M x 16.
2. Speed: Operates at a frequency of 166 MHz, supporting high-speed data processing.
3. Voltage: Requires a power supply of 1.8V, ensuring low power consumption.
4. Interface: Uses a parallel interface for data transfer.
5. Package: Available in a 60-ball Fine-Pitch Ball Grid Array (FBGA) package, which is compact and suitable for space-constrained applications.
6. Temperature Range: Designed to operate over a wide temperature range, suitable for industrial applications.
7. Clock Cycle: Supports a clock cycle time of 5.4 ns for faster operations.
8. Low Power Features: Includes power-down and self-refresh modes to conserve energy.
9. Compatibility: Compliant with JEDEC standards, ensuring compatibility with a wide range of systems.
These features make the IS43LD32320C-18BLI ideal for applications requiring reliable and efficient memory solutions.
Manufacturer
Application
1. Mobile Devices: Smartphones, tablets, and wearable technology where power efficiency is crucial.
2. Embedded Systems: Used in automotive, industrial, and consumer electronics that require reliable memory performance.
3. Networking Equipment: Routers and switches for buffering and data storage.
4. IoT Devices: Supports connected devices with limited power resources.
5. Portable Electronics: Digital cameras, handheld gaming devices, and other portable gadgets.
The chip's low power consumption and compact size make it ideal for these applications.