K4A4G165WE-BCTD

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K4A4G165WE-BCTD

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1.2V 4Gbit 256Mx16 DDR4 FBGA-96 Memory (ICs) RoHS

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  • メーカー品番 #K4A4G165WE-BCTD

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仕様

属性 値
Packaging FBGA-96
Interface DDR4
MemoryFormat 256Mx16
MemorySize 4Gbit
Operatingtemperature 0℃~+85℃
Voltage-Supply 1.2V

概要

Description

The K4A4G165WE-BCTD is a type of DRAM memory chip manufactured by Samsung. It is part of the company's LPDDR4 (Low Power Double Data Rate 4) series, which is designed for high-performance, power-efficient applications such as smartphones, tablets, and other portable devices. This particular chip is a 4Gb (gigabit) memory module, organized as 256M x 16, and it operates at a low voltage, typically around 1.1 volts, to conserve power and extend battery life in mobile devices.
The LPDDR4 standard offers significant improvements over its predecessors, including increased bandwidth and reduced power consumption, making it ideal for handling demanding applications and multitasking in mobile and embedded systems. The K4A4G165WE-BCTD's design emphasizes efficiency and speed, supporting higher data rates and enabling smoother performance in consumer electronics. Its compact form factor and advanced technology contribute to the overall performance and responsiveness of the devices it powers, aligning with the growing demands of modern mobile computing.

Equivalent

The K4A4G165WE-BCTD is a 4Gb DDR4 SDRAM chip from Samsung. Equivalent products can include other DDR4 SDRAM chips with similar specifications, such as:
1. Micron MT40A512M8HX-083E
2. Hynix H5AN4G6NAFR-UHC
3. Kingston D5128A1PBJ-TPB
These alternatives should be checked for specific compatibility regarding speed, voltage, and timing to ensure they meet the same requirements as the Samsung chip.

Features

The K4A4G165WE-BCTD is a DRAM (Dynamic Random Access Memory) chip. Here are its key features:
1. Type: DDR4 SDRAM – It belongs to the fourth generation of Double Data Rate Synchronous Dynamic RAM, offering improved performance over previous DDR standards.
2. Capacity: Typically 4Gb (Gigabits) – Provides a moderate level of memory suitable for various applications.
3. Speed: Operates at high frequencies to ensure fast data processing, usually in the range of 2133–3200 MT/s (Mega Transfers per second).
4. Voltage: Low operating voltage around 1.2V – Enhances energy efficiency and reduces power consumption.
5. Package: Comes in a compact FBGA (Fine-pitch Ball Grid Array) package, which is commonly used for mounting on PCBs (Printed Circuit Boards).
6. Applications: Widely used in computing devices, including PCs, laptops, and servers, for enhancing performance and multitasking capabilities.
7. Performance: Offers high bandwidth and low latency, which is crucial for high-performance computing tasks.
This combination of features makes the K4A4G165WE-BCTD a versatile choice for modern memory solutions in various electronic devices.

Pinout

The K4A4G165WE-BCTD is a 4Gb DDR4 SDRAM (Synchronous Dynamic Random-Access Memory) chip manufactured by Samsung. It typically comes in a 96-ball FBGA (Fine-pitch Ball Grid Array) package. The device is organized as 1G x 16 bits and is designed to support high-speed data transfer rates.
Key features and pin functions include:
- 96-ball FBGA package: This encapsulation supports high pin density and efficient thermal performance.
- Data Pins (DQ): 16 data pins for transferring data.
- Address Pins (A0-A15): Used for specifying the memory address.
- Control Pins: Including RAS#, CAS#, WE# for row, column, and write operations.
- Clock Pins: CK, CK# for input clock signal; CKE for clock enable.
- Command Pins: Including CS# for chip select.
- ODT: On-die termination control.
- RAS, CAS, WE: Row address strobe, column address strobe, and write enable for controlling memory operation.
- VDD/VDDQ: Power supply pins for core and I/O operations.
This memory chip is often used in computing systems for improved speed and efficiency, leveraging DDR4 technology for enhanced performance.

Manufacturer

The K4A4G165WE-BCTD is a type of DRAM chip manufactured by Samsung Electronics. Samsung Electronics is a global technology company based in South Korea. It is one of the largest electronics companies in the world, known for producing a wide range of consumer and industrial electronics, including memory chips, semiconductors, mobile phones, televisions, and home appliances. Samsung is a key player in the technology industry with a significant focus on innovation and development in the semiconductor sector.

Application

The K4A4G165WE-BCTD is a DRAM chip commonly used in various applications requiring high-speed and high-density memory. Key application areas include:
1. Consumer Electronics: Devices like smartphones, tablets, and smart TVs, which require efficient memory for processing applications and multimedia content.

2. Computing: Laptops, desktops, and servers where fast and reliable memory is crucial for system performance and multitasking.
3. Networking Equipment: Routers, switches, and other networking devices that rely on quick data processing and storage.
4. Automotive Systems: Advanced driver-assistance systems (ADAS) and infotainment systems in vehicles that demand robust memory solutions.
5. Industrial Applications: Embedded systems in industrial automation and control systems where stable and efficient memory is needed.

Package

The K4A4G165WE-BCTD is a DRAM package from Samsung, typically used in electronic devices. It is part of the LPDDR4 memory series and features a compact FBGA (Fine-Pitch Ball Grid Array) package type, which is designed to save space while providing efficient performance for mobile and embedded applications.

Frequently Asked Questions


Q: What memory density does this DDR4 component offer?
A: It provides a 4Gbit memory size organized as 256Mx16, suitable for high-density memory applications.


Q: What is the operating temperature range for the K4A4G165WE-BCTD?
A: The component operates reliably from 0°C to +85°C, covering standard commercial temperature requirements.


Q: What is the supply voltage required for this memory chip?
A: It requires a standard DDR4 supply voltage of 1.2V, ensuring low power consumption.


Q: Is this memory compatible with standard DDR4 interfaces?
A: Yes, it uses a DDR4 memory format with a 256Mx16 data bus, compatible with common DDR4 controllers.


Q: What package type does this component come in?
A: It is packaged in a FBGA-96, which is a fine-pitch ball grid array for compact PCB design.


Q: Can this chip operate in high-temperature environments above 85°C?
A: No, its specified operating range is 0°C to +85°C; use above this may cause reliability issues.


Q: Is this memory suitable for automotive or industrial applications?
A: It is designed for commercial temperature (0 to +85°C), not for extended industrial or automotive temperature ranges.


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