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K4B2G0846F-BYMA
+BOM1.35V 2Gbit 256Mx8 DDR3 FBGA-78 Memory (ICs) RoHS
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メーカー三星
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メーカー品番 #K4B2G0846F-BYMA
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在庫状況24404
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Packaging | FBGA-78 |
| Interface | DDR3 |
| MemoryFormat | 256Mx8 |
| MemorySize | 2Gbit |
| Operatingtemperature | 0℃~+85℃ |
| Voltage-Supply | 1.35V |
概要
Description
The K4B2G0846F-BYMA typically offers several features like lower voltage operation compared to its predecessors, improved data transfer rates, and enhanced bandwidth, which cater to the demands of modern computing and multimedia applications. As part of the LPDDR3 family, it supports advanced power-saving modes and has a smaller physical footprint, which is crucial for mobile device manufacturers looking to optimize space without sacrificing performance. Overall, the K4B2G0846F-BYMA is an integral component for devices needing efficient memory solutions.
Equivalent
1. Hynix H5TQ2G83CFR - DDR3 2Gb
2. Micron MT41J128M16 - DDR3 2Gb
3. Nanya NT5CB128M16 - DDR3 2Gb
4. Elpida EDJ2116CBBG - DDR3 2Gb
5. Kingston equivalent using similar specifications
These products offer similar memory capacity and technology standards. Always verify specific package types and speed requirements for compatibility.
Features
1. Capacity: 2 Gb (Gigabit).
2. Organization: The chip is organized as 256M x 8 bits.
3. Speed: It supports a data rate of up to 1600 Mbps (megabits per second).
4. Voltage: Operates at a voltage of 1.5V.
5. Package: Available in a standard FBGA (Fine Ball Grid Array) package.
6. Temperature Range: Designed to function in a standard operating temperature range suitable for most consumer electronics.
7. Compatibility: Compliant with the JEDEC standard for DDR3 memory.
8. Low Power: Includes features for power optimization, making it suitable for portable and low-power devices.
9. Applications: Typically used in computers, laptops, and other devices requiring high-speed and reliable memory.
These features make the K4B2G0846F-BYMA a versatile memory chip suitable for a wide range of applications in the computing and electronics industry.
Pinout
The function of the K4B2G0846F-BYMA is to provide volatile random access memory for electronic devices, enabling temporary data storage and retrieval. This DDR3 (Double Data Rate Type 3) SDRAM chip offers high-speed data transfer rates and efficient power consumption, making it ideal for various applications such as computers, servers, and other digital electronics requiring fast and reliable memory performance. It supports features like on-die termination, dynamic on-chip thermal sensor, and programmable burst lengths for better performance and versatility.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the K4B2G0846F-BYMA?
A: This is a 2Gbit DDR3 SDRAM organized as 256M x 8, suitable for applications requiring 2Gb density.
Q: What is the operating voltage range for this component?
A: It operates at a low voltage of 1.35V, compliant with DDR3L standards, reducing power consumption.
Q: What is the temperature range for reliable operation?
A: It supports an operating temperature range from 0°C to +85°C, covering commercial and industrial use cases.
Q: What package type does the K4B2G0846F-BYMA use?
A: It is packaged in an FBGA-78 (Fine-Pitch Ball Grid Array) form factor, ideal for compact PCB layouts.
Q: Is this component compatible with standard DDR3 interfaces?
A: Yes, it uses a standard DDR3 memory interface, ensuring broad compatibility with DDR3 memory controllers.
Q: What typical applications suit this memory IC?
A: It is ideal for embedded systems, networking equipment, and computing devices requiring low-power 2Gb DDR3 memory.