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K4B4G1646D-BYMA
+BOM4Gbit 1.35V 933MHz DDR3L SDRAM FBGA-96 Memory (ICs) RoHS
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メーカー三星
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メーカー品番 #K4B4G1646D-BYMA
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在庫状況2884
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Packaging | FBGA-96 |
| Clock Frequency | 933MHz |
| Memory Format | DDR3L SDRAM |
| Memory Size | 4Gbit |
| Operating Temperature | 0℃~+85℃ |
| Voltage - Supply | 1.35V |
概要
Description
Key specifications include a maximum data rate of 1066 Mbps, low power consumption suitable for battery-operated devices, and support for various operating temperatures. The chip is typically used in smartphones, tablets, and other portable devices requiring high-performance memory solutions.
The BYMA designation indicates specific features or configurations, such as package type and speed grade. Overall, the K4B4G1646D-BYMA plays a critical role in enhancing system performance by providing fast and reliable memory access, contributing to improved multitasking and application responsiveness in mobile environments.
Equivalent
1. Micron MT41K256M16HA-125
2. Hynix H5TQ4G63AFR
3. Samsung K4B4G1646E-BYMA
These alternatives may have slight variations in specifications, so it's important to verify compatibility with your specific application.
Features
1. Technology: DDR3 DRAM, which offers higher speed and lower power consumption compared to its predecessors.
2. Density: 4 Gbit capacity, enabling high data storage in compact designs.
3. Data Rate: Typically supports data rates of 1066 MT/s (megatransfers per second) to 1600 MT/s.
4. Package: Available in a 78-ball FBGA (Fine Ball Grid Array) package, which aids in space-saving on PCBs (Printed Circuit Boards).
5. Voltage: Operates at a low voltage of 1.5V, contributing to energy efficiency.
6. Access Time: Features low latency for improved performance in various applications.
7. Use Cases: Suitable for applications like consumer electronics, mobile devices, and computing systems where high-speed memory is required.
This combination of features makes the K4B4G1646D-BYMA ideal for modern electronics demanding efficient, high-bandwidth memory solutions.
Pinout
Functionally, this memory chip is designed to provide high-speed data transfer and efficient performance in various applications, including computers and other electronic devices. It features a 4 Gbit capacity with a data width of 16 bits, allowing it to offer a notable bandwidth for read and write operations. The device operates at DDR3 voltage levels, typically around 1.5V, and supports various data rates, making it suitable for applications that require fast and reliable memory solutions. Its integration into systems helps enhance overall performance, especially in multitasking and data-intensive environments.
Manufacturer
Samsung's semiconductor division is a key player in the global market, known for its innovation and advanced technology in memory products. The K4B4G1646D-BYMA is a specific type of DRAM (Dynamic Random Access Memory) chip, typically used in various electronic devices such as smartphones, tablets, and computers. Samsung's commitment to research and development in memory technology has positioned it as a leader in the industry, contributing significantly to advancements in data storage and processing capabilities.
Application
1. Computers and Laptops: For main memory in desktops and laptops.
2. Servers: Enhancing performance in data centers and enterprise servers.
3. Consumer Electronics: Utilized in smart TVs, tablets, and gaming consoles.
4. Networking Equipment: In routers and switches for buffering and caching.
5. Industrial Devices: Supporting memory needs in automation systems and control units.
This chip is favored for its high speed and efficiency in data processing tasks.
Package
Frequently Asked Questions
Q: What is the memory density and configuration of the K4B4G1646D-BYMA?
A: It is a 4Gbit DDR3L SDRAM, typically organized as 256M x 16, suitable for high-density memory applications.
Q: What is the operating voltage and temperature range for this component?
A: It operates at 1.35V (low voltage DDR3L) with a temperature range of 0℃ to +85℃, supporting industrial-grade thermal environments.
Q: Can this memory be used in low-power embedded systems?
A: Yes, with 1.35V supply and FBGA-96 package, it is ideal for power-sensitive designs like routers, SSDs, or industrial controllers.
Q: What is the maximum clock frequency supported?
A: It supports up to 933MHz clock frequency, equivalent to DDR3L-1866 data rate for high-speed data transfer.
Q: Does this part require a specific PCB layout for signal integrity?
A: Yes, the FBGA-96 package demands precise routing; refer to DDR3L layout guidelines for impedance matching at 933MHz.
Q: Is the K4B4G1646D-BYMA compatible with standard DDR3 slots?
A: No, it is a BGA-mounted component for soldering, not a DIMM module; it must be directly soldered onto the PCB.
Q: What applications commonly use this DDR3L SDRAM?
A: It is used in networking equipment, automotive infotainment, and embedded computing where 1.35V low power is critical.
