K4B8G1646D-MYK0

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K4B8G1646D-MYK0

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  • メーカー品番 #K4B8G1646D-MYK0

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仕様

属性 値
Manufacturer Samsung Electro-Mechanics
Package / Case BGA96

概要

Description

The K4B8G1646D-MYK0 is a type of DRAM (Dynamic Random Access Memory) module manufactured by Samsung, designed primarily for use in computing devices such as laptops and desktops. It features a density of 8GB and operates using a DDR3 SDRAM architecture, specifically DDR3L, which allows for lower voltage operation (1.35V) compared to standard DDR3 (1.5V). This module typically supports data transfer rates of up to 1600 MT/s and comes in a small form factor, making it suitable for various compact devices.
The "MYK0" designation generally indicates specific characteristics such as temperature range and packaging. This memory is known for its reliability and efficiency, making it a popular choice for both consumer and enterprise applications. The K4B8G1646D-MYK0 is often utilized in scenarios where enhanced performance and energy efficiency are critical, such as in gaming laptops, ultrabooks, and server applications.

Equivalent

The K4B8G1646D-MYK0 chip is a 1GB DDR3 SDRAM memory chip. Equivalent products include similar DDR3 SDRAM chips such as the Hynix H5TQ2G63AFR, Micron MT41K256M16HA-125, and Samsung K4B2G1646D. Ensure compatibility with specifications like speed and voltage when selecting alternatives.

Features

The K4B8G1646D-MYK0 is a 1GB DDR3 SDRAM memory chip, featuring a 128M x 8-bit organization. It operates at a voltage of 1.5V, making it energy-efficient. This chip supports data rates up to 1066 MT/s, ensuring high-speed performance for various applications. It utilizes a 78-ball, FBGA (Fine Ball Grid Array) package, which allows for a compact design suitable for space-constrained devices. The device is designed for low power consumption, making it ideal for mobile and portable electronics, as well as computing systems. The K4B8G1646D-MYK0 is typically used in laptops, desktops, and other computing devices requiring reliable memory solutions. Additionally, it complies with JEDEC standards, ensuring compatibility across a wide range of platforms.

Pinout

The K4B8G1646D-MYK0 is a 1GB DDR3 SDRAM memory chip, specifically configured as 8 bits x 8 banks (1 Gbit x 8). It has a total of 84 pins.
The primary functions of these pins include:
- Data Pins (DQ): 8 pins for data input/output.
- Address Pins (A): Multiple pins for addressing the memory locations.
- Control Pins: Pins like Chip Select (CS), Write Enable (WE), Read Enable (RE), and Clock (CK) for controlling memory operations.
- Power and Ground Pins: Pins for power supply (VDD/VDDQ) and ground (VSS).
- Baud Select Pins: Used to select the bank of memory.
This configuration allows for efficient data storage and retrieval in computing applications.

Manufacturer

The K4B8G1646D-MYK0 is manufactured by Samsung Electronics, a South Korean multinational company. Samsung Electronics is part of the larger Samsung Group and is a leading global producer of electronic components, including semiconductors, displays, and consumer electronics. The company is well-known for its innovation in technology and plays a significant role in the memory chip market, producing DRAM and NAND flash memory used in various devices such as smartphones, tablets, and computers. Samsung Electronics is recognized for its commitment to research and development, contributing to advancements in electronics and technology globally.

Application

The K4B8G1646D-MYK0 is a 16Gb (gigabit) DDR3 SDRAM memory chip commonly used in various applications, including:
1. Consumer Electronics: Smartphones, tablets, and laptops for improved performance and multitasking.
2. Networking Equipment: Routers and switches for efficient data handling and speed.
3. Gaming Consoles: Enhancing graphics performance and gaming experience.
4. Embedded Systems: Automation and control systems requiring reliable memory solutions.
5. Data Centers: Servers and storage solutions for high-speed data processing.
Its high capacity and efficiency make it suitable for both consumer and industrial applications.

Package

The K4B8G1646D-MYK0 is a DRAM memory chip packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This type of packaging is typically used for high-density memory chips, providing a compact design and efficient performance.

Frequently Asked Questions


Q: What is the package type of the K4B8G1646D-MYK0?
A: It comes in a BGA96 package, which is a standard fine-pitch Ball Grid Array for DDR3 memory modules.


Q: What is the memory density and organization of this component?
A: The part number indicates an 8Gb density (K4B8G) with a x16 data bus width (x16), organized as 512M x16.


Q: Is this component compatible with DDR3 or DDR3L voltage standards?
A: Based on the "MYK0" suffix specification, it complies with DDR3 standard, typically operating at 1.5V VDD.


Q: What typical applications is this memory IC suitable for?
A: It is designed for high-speed memory applications like servers, laptops, and networking equipment requiring reliable BGA96 soldering.


Q: What is the operating temperature range for this device?
A: The suffix “-MYK0” typically denotes commercial temperature range (0°C to +85°C) for standard memory ICs, but verify with the datasheet.


Q: Does the BGA96 package require special PCB layout considerations?
A: Yes, BGA96 requires precise pad design and solder paste stencil to ensure proper ball attach and thermal management during reflow.


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