K4UBE3D4AA-MGCR

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K4UBE3D4AA-MGCR

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32Gbit x32 LPDDR4X FBGA-200 Memory (ICs) RoHS

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仕様

属性 値
Packaging FBGA-200
Interface LPDDR4X
Memory Format x32
Memory Size 32Gbit
Operating Temperature -25℃~+85℃
Voltage - Supply 1.8V;1.1V;600mV

概要

Equivalent

The K4UBE3D4AA-MGCR is a Samsung LPDDR4X DRAM chip. Equivalent products include:
- Micron MT53E512M32D2NP-046 WT (LPDDR4X)
- SK Hynix H9HCNNN8KUMLHR-NME (LPDDR4X)
- Samsung K4UBE3D4AA-MGCL (similar variant)
These chips offer comparable specs (speed, density, and power efficiency). Always verify pin compatibility and datasheet details before substitution.

Features

The K4UBE3D4AA-MGCR is a high-performance DDR4 memory module with the following key features:
- Capacity: 8GB per module
- Speed: 3200MHz (PC4-25600)
- Voltage: 1.2V (low power consumption)
- CAS Latency (CL): 22
- Form Factor: 260-pin SODIMM (for laptops/compact systems)
- ECC Support: No (non-ECC unbuffered)
- Density: 1Rx8 (single-rank, 8 banks)
- Reliability: High-quality ICs with strict testing
Ideal for gaming laptops, workstations, and compact PCs requiring fast, efficient DDR4 memory.

Package

The K4UBE3D4AA-MGCR is a BGA (Ball Grid Array) package type, commonly used for memory modules like DDR4 SDRAM. It features a compact, high-density layout with solder balls on the underside for surface-mounting. BGA packages offer reliable electrical performance and space efficiency, making them ideal for modern electronics.

Frequently Asked Questions


Q: What are the key benefits of using LPDDR4X over standard LPDDR4?
A: LPDDR4X offers lower operating voltage (1.1V VDD2 vs 1.2V), reducing power consumption by up to 20% while maintaining high bandwidth, ideal for portable devices.


Q: Is this 32Gbit memory suitable for high-density mobile applications?
A: Yes, it provides a 32Gbit density in a x32 memory format, perfect for flagship smartphones and tablets requiring large capacity and fast data throughput.


Q: What interface type does the K4UBE3D4AA-MGCR use for connection?
A: It uses the LPDDR4X interface with a x32 memory format, ensuring compatibility with modern application processors designed for low-power DRAM.


Q: Can this component operate reliably in high-temperature environments?
A: Yes, its operating temperature range is -25°C to +85°C, covering standard consumer and industrial thermal conditions for stable performance.


Q: What is the package type and how does it affect PCB layout?
A: It uses a FBGA-200 (Fine-Pitch Ball Grid Array) package, which requires precise PCB design for 200 solder balls, but offers space savings and improved signal integrity.


Q: What voltage rails are required to power this LPDDR4X device?
A: It requires three supply voltages: 1.8V for VDD1 (IO), 1.1V for VDD2 (Core), and 600mV for VDDQ (DQ interface) to ensure proper operation.


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