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LFE3-70EA-8FN672C
+BOMIC FPGA 380 I/O 672FPBGA
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メーカーラティス・セミコンダクター・コーポレーション
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メーカー品番 #LFE3-70EA-8FN672C
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データシート LFE3-70EA-8FN672C DataSheet
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パッケージ BBGA-672
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在庫状況6162
365 日間品質保証
7*24 日間の品質保証
90-時間単位のサービス保証
1日間のアフターサービス保証
仕様
| 属性 | 値 |
| Package | Tray |
| Series | ECP3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 8375 |
| NumberofLogicElements/Cells | 67000 |
| TotalRAMBits | 4526080 |
| NumberofI/O | 380 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 672-BBGA |
概要
Description
This FPGA is built on a 65nm low-power process technology, ensuring efficient power usage. It supports high-speed I/Os and protocols like PCI Express, Ethernet, and CPRI/OBSAI, making it versatile for networking and signal processing tasks. The "-8" in its part number indicates its speed grade, which is a measure of its performance level, with lower numbers generally indicating higher speed capabilities.
The package type, "FN672," refers to a Fine-Pitch Ball Grid Array (FBGA) with 672 pins, aiding in compact and efficient board designs. The "C" denotes the commercial temperature range, meaning it is suitable for standard operating environments. Overall, the LFE3-70EA-8FN672C offers a balanced mix of performance, power efficiency, and connectivity options.
Equivalent
1. Xilinx Spartan-6 series, such as XC6SLX75.
2. Intel (Altera) Cyclone IV series, such as EP4CE75.
These products have comparable logic elements, I/O capabilities, and similar applications in cost-sensitive, high-volume applications requiring moderate performance. Always check specific requirements like power consumption and package type to ensure compatibility.
Features
1. Logic Capacity: It has approximately 70,000 LUTs, which provides substantial logic for complex designs.
2. Low Power: Designed for low power consumption, suitable for power-sensitive applications.
3. Embedded Memory: Includes embedded block RAM to facilitate data storage and retrieval.
4. DSP Blocks: Contains dedicated DSP blocks for efficient signal processing tasks.
5. I/O Features: Supports a wide range of I/O standards and includes high-speed SERDES (Serializer/Deserializer) for data transmission.
6. Package: Comes in a 672-ball Fine Pitch Ball Grid Array (FPBGA) package.
7. Speed Grade: The "-8" indicates the speed grade, with higher numbers typically representing faster performance.
Overall, the LFE3-70EA-8FN672C is designed for applications requiring a balance of performance, power efficiency, and cost-effectiveness, such as communication systems, video processing, and industrial control systems.
Pinout
1. I/O Pins: For interfacing with external components, supporting various I/O standards.
2. Power and Ground Pins: To supply power and establish ground connections for the FPGA's operation.
3. Configuration Pins: Used during the programming and configuration of the FPGA.
4. Clock Pins: For clock input and distribution within the FPGA.
5. Dedicated Function Pins: These may include pins for special functionalities such as JTAG for testing and debugging.
The specific functions assigned to each pin can vary depending on the configuration and application requirements, and detailed information can typically be found in the device's datasheet or technical reference manual provided by Lattice Semiconductor.
Manufacturer
Application
1. Telecommunications: Used in base stations, wireless infrastructure, and high-speed networking equipment.
2. Industrial Automation: Supports motor control, industrial networking, and surveillance systems.
3. Medical Devices: Implements imaging systems and diagnostic tools.
4. Consumer Electronics: Utilized in HD displays and digital cameras.
5. Aerospace and Defense: Deployed for secure communications and signal processing.
These applications leverage the FPGA's high-speed SERDES, DSP capabilities, and low-power architecture.